The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
RH07MJ Linear Technology IC OP-AMP, 300 uV OFFSET-MAX, CDIP8, CERAMIC, DIP-8, Operational Amplifier
RH1009W Linear Technology IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, CDFP10, CERAMIC, PACKAGE-10, Voltage Reference
RH1011J8 Linear Technology IC COMPARATOR, 3000 uV OFFSET-MAX, CDIP8, CERAMIC, DIP-8, Comparator
RH07J Linear Technology IC OP-AMP, CDIP8, CERAMIC, DIP-8, Operational Amplifier
LT1077CIJ8 Linear Technology IC OP-AMP, CDIP8, CERAMIC, DIP-8, Operational Amplifier
LT1077CMJ8 Linear Technology IC OP-AMP, CDIP8, CERAMIC, DIP-8, Operational Amplifier

CERAMIC FLATPACK 16 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
Not Available

Abstract: No abstract text available
Text: -38535 Level Q MIL-PRF-38535 Level V MIL-PRF-38535 Level V Sample Sample PACKAGE 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack CAUTION: These , 8 HS9-508ARH 16 LEAD FLATPACK MIL-STD-1835, CDFP4-F16 TOP VIEW AO EN -VSUP IN1 IN2 IN3 IN4 OUT 1 , . 75°C/W 12°C/W Ceramic Flatpack Package. 85°C/W 25°C/W Maximum Package Power , . 0.67W Ceramic Flatpack It device power


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PDF HS-508ARH HS1-508ARH MIL-STD-1835, CDIP2-T16 MIL-PRF-38535 HS-508ARH 68e04
Not Available

Abstract: No abstract text available
Text: PACKAGE 16 LeadSBDIP 16 Lead Ceramic Flatpack 16 LeadSBDIP 16 Lead Ceramic Flatpack 16 LeadSBDIP 16 Lead Ceramic Flatpack C AUTIO N : These devices are sensitive to electrostatic discharge. Users should , . 0JA 0JC SBDIP Package. 75°C/W 12°C/W Ceramic Flatpack P ackage , . .0.67W Ceramic Flatpack P ackage. .0.59W If device power , SBDIP Package. . 13.3mW/°C Ceramic Flatpack P


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PDF HS-508ARH HS1-508ARH MIL-STD-1835, CDIP2-T16 MIL-PRF-38535 100ns/DIV. HS-508ARH 68e04
4 bit synchronous counter

Abstract: CERAMIC FLATPACK 16 zcp n
Text: VOL, VOH · Fast Propagation Delay. 21 ns (Max), 14ns (Typ) 16 ] VCC 15] TC 14| QO 13] Q1 12] Q2 3 Q3 1Ö] TE J\S P Ë 16 PIN CERAMIC FLATPACK MIL-STD , /SOS Logic family. The ACS161MS is supplied in a 16 lead Ceramic Flatpack (K suffix) or a Ceramic , Die PACKAGE 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die , Pinouts 16 PI N CERAMIC DUAL-IN-LINE MIL-STD-1835, DESIGNATOR CDIP2-T16, LEAD FINISH C TOP VIEW MR Q CP


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PDF ACS161MS MIL-STD-1835, CDIP2-T16, MIL-PRF-38535 ACS161MS 2240mm 2240mm 125kA ACS161 4 bit synchronous counter CERAMIC FLATPACK 16 zcp n
Not Available

Abstract: No abstract text available
Text: Ë 16 PIN CERAMIC FLATPACK MIL-STD-1835, DESIGNATOR CDFP4-F16, LEAD FINISH C TOP VIEW 1· 16 15 14 , family. The ACTS161 MS is supplied in a 16 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-ln-Line , -38535 Class V Sample Sample Die PACKAGE 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die CAUTION: These devices are sensitive to electrostatic discharge. Users should tollow proper , Pinouts 16 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835, DESIGNATOR CDIP2-T16, LEAD FINISH C TOP VIEW MR Q CP


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PDF ACTS161MS MIL-STD-1835, CDIP2-T16, MIL-PRF-38535 ACTS161MS 2240mm 2240mm 125kA
CERAMIC FLATPACK 16

Abstract: No abstract text available
Text: Q [ QÏ Q[ Q2 13] CP2 12] K2 TT| J2 10] S2 T ]Q 2 [7 GND [ ] [ 16 PIN CERAMIC FLATPACK , ACTS112MS is supplied in a 16 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix). , Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die C AUTIO N : These devices are sensitive to , Semiconductor ACTS112MS Radiation Hardened Dual J-K Flip-Flop Pinouts 16 PIN CERAMIC , - 16 ] VCC 15] ÏÏT 14] R2 K1 | T j i |T (Typ) SEU LET T h re s h o ld


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PDF ACTS112MS MIL-STD-1835, CDIP2-T16, MIL-PRF-38535 05A/cm2 CERAMIC FLATPACK 16
hs138

Abstract: No abstract text available
Text: Flatpack 14 Lead SBDIP 14 Lead Ceramic Flatpack 14 Lead SBDIP 14 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Pinouts (Switch States are for Logic "1" Inputs) 14 LEAD , OFF ON SW3 AND SW4 ON OFF 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE ( FLATPACK ) MIL-STD , SBDIP Package. . .0.71W 14 Lead Ceramic Flatpack Package . . . 0.48W 16 Lead SBDIP


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PDF HS-302RH/883S, HS-303RH/883S, HS-306RH/883S, HS-307RH/883S, HS-384RH/883S, HS-390RH/883S HS-3XXRH/883S 00b337T -302RH/303RH/306RH/307RH/384RH/390RH/883S 1930nm hs138
54ls75

Abstract: No abstract text available
Text: remain stable as long as the enable is Low. ORDERING INFORMATION DESCRIPTION 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic LLCC ORDER CODE 54LS75/BEA 54LS75/BFA 54LS75/B2A INPUT AND OUTPUT , PIN CONFIGURATION LOGIC SYMBOL -^ Do E D, U E 2-3 [ ± Vcc - 16 ] Qo m q i , = Max, V, = 7.0V D inputs E inputs 0.1 0.4 20 80 -0.4 - 1.6 -20 6.3 -100 12 l|H1 High-level


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PDF 54LS75 54LS75 16-Pin 54LS75/BEA 54LS75/BFA 54LS75/B2A 54LSXXX 500ns
54S112

Abstract: totempole d2302
Text: are initiated by the High-to-Low transition of CP. ORDERING INFORMATION DESCRIPTION 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic LLCC ORDER CODE 54S112/BEA 54S112/BFA 54S112/B2A INPUT , , [ [ K i [2 j, Sd Qi ì -^ - 16 ] VCC jU Rd i |T Gì [T i l l H i» 13l C , 100 100 - 1.6 -7 -4 -40 15 -110 50 Max V V V V mA MA HA HA mA mA mA mA mA UNIT 1 Von VOL V|K l


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PDF 54S112 54S112 54SXXX 500ns 1N916 1N3064, totempole d2302
54LSXXX

Abstract: No abstract text available
Text: operations. ORDERING INFORMATION DESCRIPTION 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic , 4.5 2.0 LIMITS Nom 5.0 UNIT Max 5.5 v cc V V V,H V,L IlK IO H +0.7 -18 - 1.6 12


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PDF 54LS173 DM8551 54LSXXX 500ns 54LSXXX 1N916 1N3064,
Not Available

Abstract: No abstract text available
Text: outputs of 3-State devices are tied together. ORDERING INFORMATION DESCRIPTION 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic LLCC ORDER CODE 54F257A/BEA 54F257A/BFA 54F257A/B2A DESCRIPTION The


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PDF 54F257A 54F258A 54F257A 500ns
Not Available

Abstract: No abstract text available
Text: DESCRIPTION 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic LLCC ORDER CODE 54LS109/BEA 54LS109/BFA


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PDF 54LS109 54LSXXX 500ns 1N916 1N3064,
54S138

Abstract: 54ls138 TE307
Text: state. ORDERING INFORMATION DESCRIPTION 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic , 54LS138, 54S138 LOGIC DIAGRAM e2 e3 ( ) - Pin num ber Vcc - Pin 16 GND - PlnS 0« Ö« 03


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PDF 54LS138, 54S138 1-of-32 54LSXXX 54SXXX 500ns 500ns s15ns 54S138 54ls138 TE307
max3259

Abstract: ic 74 LS 138 DECODER
Text: High or active Low state. ORDERING INFORMATION DESCRIPTION 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic LLCC ORDER CODE 54LS138/BEA, 54S 138/BEA 54LS138/BFA, 54S138/BFA 54LS138/B2A , 54LS138, 54S138 LOGIC DIAGRAM ^2 E3 ( ) - Pin number Pin 8 Vcc - Pin 16 GND - O7 06


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PDF 1-of-32 54LS138, 54S138 500ns 500ns 54LSXXX 54SXXX 515ns 1N916 1N3064, max3259 ic 74 LS 138 DECODER
1995 - Not Available

Abstract: No abstract text available
Text: , high-speed, CMOS/SOS Logic Family . The HCTS390MS is supplied in a 16 lead Ceramic flatpack (K suffix) or a , Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die CAUTION: These devices are , Semiconductor HCTS390MS Radiation Hardened Dual Decade Ripple Counter Pinouts 16 LEAD CERAMIC , Min · Input Current Levels Ii 5µA at VOL, VOH Q2 1 6 Q3 1 7 GND 8 16 LEAD CERAMIC METAL SEAL , Resistance JA JC SBDIP Package. . . . . . . . . . . . . . . . . . . . 73oC/W 24oC/W Ceramic Flatpack Package


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PDF HCTS390MS MIL-STD-1835 CDIP2-T16 -55oC 125oC HCTS390MS 05A/cm2 HCTS390 TA14489A.
Not Available

Abstract: No abstract text available
Text: Levels li < 5[iA at VOL, VOH 13 12 11 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE ( FLATPACK ) MIL-STD , HCS151 MS is supplied in a 16 lead Ceramic flatpack (K suffix) or a SBDIP Package (D suffix). I0 Y , 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die CAUTION: These devices are , . 73°C/W 24°C/W Ceramic Flatpack Package. 114°C/W 29°C/W Maximum Package Power , .0.68W Ceramic Flatpack Package. 0.44W If device power


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PDF HCS151MS MIL-STD-1835 CDIP2-T16 HCS151 HCTS151 TA14467A.
Not Available

Abstract: No abstract text available
Text: is supplied in a 16 lead Ceramic flatpack (K suffix) or a SBDIP Package (D suffix). Q1 01 GND , Equivalent Harris Class S Equivalent Sample Sample Die PACKAGE 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die CAUTION: These devices are sensitive to electrostatic discharge , GND E RT CP1 ül R2 E l J2 K2 ül CP2 S2 g Q2 H Q2 16 LEAD CERAMIC METAL SEAL , . 73°C/W 24°C/W Ceramic Flatpack Package. 114°C/W 29°C/W Maximum Package Power


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PDF HCTS109MS MIL-STD-1835 CDIP2-T16, HCTS109MS HCTS109 TA14440A.
Not Available

Abstract: No abstract text available
Text: Sample Die PACKAGE 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die , /Demultiplexer Pinouts 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T16, LEAD , CERAMIC METAL SEAL FLATPACK PACKAGE ( FLATPACK ) MIL-STD-1835 CDFP4-F16, LEAD FINISH C TOP VIEW E1 A0 1 A1 , , high-speed, CMOS/SOS Logic Family. The HCS139M S is supplied in a 16 lead C eram ic flatpack (K suffix) or a , . 73°C/W 24°C/W Ceramic Flatpack Package. 114°C/W 29°C/W Maximum Package Power


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PDF HCS139MS MIL-STD-1835 CDIP2-T16, HCS139 TA14309A.
Not Available

Abstract: No abstract text available
Text: § 1 9 T ] YO Y1 ^ GND [ Ï Ï 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE ( FLATPACK ) MIL-STD , PACKAGE 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die CAUTION , Pinouts 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T16 TOP VIEW Ì4 Q Ì5 , compatibility. The HCTS147MS is supplied in a 16 lead Ceramic tlatpack (K suffix) or a SBDIP Package (D suffix). , . 73°C/W 24°C/W Ceramic Flatpack Package. 114°C/W 29°C/W Maximum Package Power


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PDF HCTS147MS 10-to-4 MIL-STD-1835 CDIP2-T16 HCTS147 TA14482A.
LSE B3

Abstract: 54S85 LSE -B3 54LSXX 54ls85 signetics
Text: 54LS85/BEA 54S85/BEA 5485/B EA 54LS85/BFA 5485/BFA 54LS85/B2A 54S85/B2A 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic LLCC DESCRIPTION The '85 is a 4-bit magnitude comparator that can , voltage +125°C I IK l0 H lo L 54 Nom 5.0 M ax 5.5 M in 4.5 2.0 +0.8 +0.8 -12 -400 16 -55 +125 -55 , noted.) 5485 Min Typ2 3.4 0.2 0.4 0.4 -1.5 1.0 0.1 0.3 40 120 20 60 - 1.6 -4.8 -0.4 -1.2 -2.0 -6.0 -18 , c = 5.0V 54 54 LS5 54S 5 C L = 15pF M in Max 16 16.5 18 16.5 ns ns UNIT T E S T C O N D IT IO N S


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PDF 54LS85, 54S85 54S85 500ns 500ns 54LSXX 515ns 1N3064, LSE B3 LSE -B3 54ls85 signetics
Not Available

Abstract: No abstract text available
Text: Harris Class S Equivalent Sample Sample Die PACKAGE 16 Lead SBDIP 16 Lead Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die CAUTION: These devices are sensitive to electrostatic discharge , 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP , CERAMIC METAL SEAL FLATPACK PACKAGE ( FLATPACK ) MIL-STD-1835 CDFP4-F16, LEAD FINISH C TOP VIEW OE 1 I S1 , °C/W Ceramic Flatpack Package. 114°C/W 29°C/W Maximum Package Power Dissipation


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PDF HCS253MS MIL-STD-1835 CDIP2-T16,
Not Available

Abstract: No abstract text available
Text: (D suffix). 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE ( FLATPACK ) MIL-STD-1835 CDFP4-F16, LEAD , Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die CAUTION: These devices are sensitive to , 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP , . 73°C/W 24°C/W Ceramic Flatpack Package. 114°C/W 29°C/W Maximum Package Power , .0.68W Ceramic Flatpack Package. 0.44W If device power


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PDF HCTS161AMS MIL-STD-1835 CDIP2-T16, 104mils HCTS161 HCTS161A TA14446A.
54ls395a

Abstract: No abstract text available
Text: DESCRIPTION 16 -Pin Ceramic DIP 16 -Pin Ceramic FlatPack 16 -Pin Ceramic LLCC ORDER CODE 54LS395A/BEA 54LS395A , °2 13 03 12 PE [T GND [T 1 Vcc GND Pin 16 P in S For LLCC pin assignments, see


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PDF 54LS395A 54LSXXX 500ns 1N916 N3064, 54ls395a
Truth Table 74161

Abstract: 74161 pin diagram and truth table
Text: ackage (D su ffix ). 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE ( FLATPACK ) MIL-STD-1835 CDFP4-F16 TOP , Ceramic Flatpack 16 Lead SBDIP 16 Lead Ceramic Flatpack Die CAUTION: These devices are sensitive to , 3) September 1995 HCTS160MS Radiation Hardened Synchronous Counter Pinouts 16 LEAD CERAMIC , . 73°C/W 24°C/W Ceramic Flatpack Package. 114°C/W 29°C/W Maximum Package Power , .0.68W Ceramic Flatpack Package. 0.44W If device power


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PDF HCTS160MS MIL-STD-1835 CDIP2-T16 CTS160 HCTS160 TA14445A. Truth Table 74161 74161 pin diagram and truth table
Not Available

Abstract: No abstract text available
Text: BL^J VSS = 8 VDD = 16 These devices are similar to the type MC14511. The CD4511BMS is supplied in these packages: Braze Seal DIP 7-Segment Display H4W Frit Seal DIP Ceramic Flatpack 16 -lead outline H2R H6W a l£ Ê b ¥ ° o\i wams b \im 0 1 CAU TIO N : These , Sourcing Capability up to 25mA • Input Latches for BCD Code Storage - KJ-B IT 16 , perature (During S o ld e rin g ).+265°C At Distance 1/ 16 ± 1/32


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PDF CD4511BMS 100nA
2000 - CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL132C EL132B
Text: Ceramic Quad Flatpack (CQFP) 28 Lead Ceramic Quad Flatpack NS Package Number EL28B © 2000 National Semiconductor Corporation MS101107 www.national.com Ceramic Quad Flatpack (CQFP) August 1999 Ceramic Quad Flatpack (CQFP) 64 Lead Ceramic Quad Flatpack NS Package Number EL64A 100 Lead Ceramic Quad Flatpack NS Package Number EL100A www.national.com 2 Ceramic Quad Flatpack (CQFP) 116 Lead Ceramic Quad Flatpack NS Package Number EL116A 116 Lead Ceramic Quad


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PDF EL28B MS101107 EL64A EL100A EL116A EL116B EL128A CERAMIC QUAD FLATPACK CQFP CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL132C EL132B
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