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FW82443BX

Abstract: MAA8 cdqa2 MAA12 C579 MAA11 hd61 HA20 MAA5
Text: # CDQA4# CDQA5# CDQA6# CDQA7# CDQB1#(NC) CDQB5#(NC) RESVC BGA456_36 9 CLKAGP 1 G_ST[0.2] 9 G_ST0 , VCC3G VCC3H VCC3I VCC3J VCC3K VCC3L VCC3M VCC3N VCC3O VCC3P VCC3Q VCC3R VCC3S VCC3T VCC3U BGA456_36 3 , #1 CSA#0 BGA456_36 1 18 0603 C606 10P/NA 0603 GND Title 7233 M/B Size C Date: A B C D


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PDF 440BX BGA456 10P/NA FW82443BX MAA8 cdqa2 MAA12 C579 MAA11 hd61 HA20 MAA5
fw82443bx

Abstract: HA20 HD-61
Text: # CDQA4# CDQA5# CDQA6# CDQA7# CDQB1#(NC) CDQB5#(NC) RESVC BGA456_36 9 CLKAGP 1 G_ST[0.2] 9 G_ST0 , VCC3N VCC3O VCC3P VCC3Q VCC3R VCC3S VCC3T VCC3U BGA456_36 3 GND VCC3V VCC3W VCC3X VCC3Y VCC3Z , #0 WEA# CSA#5 CSA#4 CSA#3 CSA#2 CSA#1 CSA#0 7,8 8 8 7 7 7 7 BGA456_36 1 MITAC INTERNATIONAL


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PDF 440BX BGA456 SD411667700002 fw82443bx HA20 HD-61
2009 - Not Available

Abstract: No abstract text available
Text: Package outline BGA456 : plastic ball grid array package; 456 balls SOT1153-1 B D J1 A ball A1 index area J2 A2 A E A1 detail X e1 e AB Y V T P M K H F D B 1/2 e ∅v ∅w b AA C C A B C y y1 C e W U R N e2 L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 2 4 6 8 10 12 14 16 18 20 22 X 0 10 Unit mm 20 mm scale Dimensions A max 2.52 nom 2.37 min 2.22 A1 0.6 0.5 0.4 A2 b D


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PDF BGA456: OT1153-1 sot1153-1 MS-034D
1996 - sot583

Abstract: BGA456 BGA-456
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456 : plastic ball grid array package; 456 balls; body 35 x 35 x 2.15 mm SOT583-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e w M y v M A AF AD AB Y V T P M K H F D B AE AC AA e W U R e1 N L J G E C A 1 3 2 5 4 7 6 9 8 11 13 15 17 19 21 23 25 10 12 14 16 18 20 22 24 26 X 0 10 20 mm scale


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PDF BGA456: OT583-1 sot583 BGA456 BGA-456
1996 - BGA456

Abstract: MS-034 27x27
Text: PDF: 2002 Nov 19 Philips Semiconductors Package outline BGA456 : plastic ball grid array package; 456 balls; body 27 x 27 x 1.75 mm SOT795-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 e 1/2 e y y1 C v M C A B b w M C AF AD AB AE AC AA Y V T P M K H F D B e W U R e2 N L 1/2 e J G E C A 1 shape 2 optional (4x) 3 5 4 7 6 9 8 11 13 15 17 19 21 23 25 10 12 14 16


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PDF BGA456: OT795-1 MS-034 BGA456 MS-034 27x27
2004 - Not Available

Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT584-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SP SL occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 1.27 0.600 0.500 0.750 Hx Hy 35.575 35.575 SOT584-1_fp PDF Â


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PDF BGA456 OT584-1 OT584-1
1996 - BGA456

Abstract: MS-034 BGA-456
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA456 : plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 v M C A B b 1/2 e e y y1 C w M C AF AD AB Y V T P M K H F D B AE e AC AA W U R e2 N L 1/2 e J G E C A 1 shape 2 optional (4x) 3 5 4 7 6 9 8 11 13 15 17 19 21 23 25 10 12 14 16 18 20 22 24


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PDF BGA456: OT584-1 MS-034 BGA456 MS-034 BGA-456
2005 - BGA456

Abstract: MS-034 sot795
Text: Package outline Philips Semiconductors BGA456 : plastic ball grid array package; 456 balls; body 27 x 27 x 1.75 mm SOT795-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 e 1/2 e y y1 C v M C A B b w M C AF AD AB AE AC AA Y V T P M K H F D B e W U R e2 N L 1/2 e J G E C A 1 shape 2 optional (4x) 3 5 4 7 6 9 8 11 13 15 17 19 21 23 25 10 12 14 16 18 20 22 24 26 X 0


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PDF BGA456: OT795-1 MS-034 BGA456 MS-034 sot795
zru 2

Abstract: BGA456 300541 8214-0-15-15-05-14-40-0
Text: TITLE BGA456 35x35 Mill-Max Adapter Socket VENDOR NAME: MILL-MAX MFG. CORP. VENDOR SID (PART) NUMBER


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PDF S582-11-456-1 S500-21 13000000L: 100ju" BGA456 35x35 S582-11 SM-BG456-B DB0519 zru 2 300541 8214-0-15-15-05-14-40-0
2004 - Not Available

Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT795-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 1.00 0.450 0.450 0.600 Hx Hy 27.575 27.575 SOT795-1_fp PDF Â


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PDF BGA456 OT795-1 OT795-1
MiniMOS

Abstract: TX4939XBG DDR266 TB62737FUG TLP261J TLP361J TSSOP14 1000BASE3 bga456 TODX2500
Text: Peripheral Interface RTC BGA456 27mm×27mm 1.00mm Ball Pitch 36 3 5 1 1.25Gb/s 550m


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PDF LEDICTB62737FUG OT23-6 TB62737FUG ODX2500 125Mb/s 25Gb/s 17dBm 850nm MiniMOS TX4939XBG DDR266 TB62737FUG TLP261J TLP361J TSSOP14 1000BASE3 bga456 TODX2500
1996 - BGA456

Abstract: sot584
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456 : plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k C e1 v M B b e w M AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A y y1 C v M A e e1 1 3 2 5 4 7 6 9 8 11 13 15 17 19 21 23 25 10 12 14 16 18 20 22 24 26 X 0 10 20 mm


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PDF BGA456: OT584-1 BGA456 sot584
1999 - FBGA-484

Abstract: BGA313 reflow soldering profile BGA
Text: BGA456 BGA272 BGA329 Option 1 (part#) Mill-Max No (see socket drawing for detail) SM-BG272-A SM-BG272-B


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1997 - udf1

Abstract: h9311 i386ex intel CRC-10 bga456 Q67001-H9311 GR-1248-CORE life cycle of sustainable product
Text: / VCC · Temperature range from 0°C to +70°C BGA-456 Header Translation · Header Verification and , Q67001-H9311 BGA-456 Semiconductor Group 6 04.97 PXB 4350 · Maximum Burst Size (MBS) given , BGA-456 package · expected power dissipation 2.5 W Semiconductor Group 8 04.97 PXB 4350


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PDF T4350-XV11-O1-7600 622MBit/s udf1 h9311 i386ex intel CRC-10 bga456 Q67001-H9311 GR-1248-CORE life cycle of sustainable product
Elco md10

Abstract: TX38D85VC1CAA TX38d85 FW82443BX MD10 elco BH 7243 QE R611 GAD31 BAV99-SOT23 MITAC 660
Text: ) MAB13(NC) CDQA0# CDQA1# CDQA2# CDQA3# CDQA4# CDQA5# CDQA6# CDQA7# CDQB1#(NC) CDQB5#(NC) RESVC BGA456_36 , VCC3L VCC3M VCC3N VCC3O VCC3P VCC3Q VCC3R VCC3S VCC3T VCC3U BGA456_36 3 GND VCC3V VCC3W VCC3X , #2 CSA#1 CSA#0 WEA# CSA#5 CSA#4 CSA#3 CSA#2 CSA#1 CSA#0 7,8 8 8 7 7 7 7 BGA456_36 1 MITAC


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PDF MTG10 MTG11 MTG12 MTG13 MTG118 RD30X12 MTG217NRD335 30X12 Elco md10 TX38D85VC1CAA TX38d85 FW82443BX MD10 elco BH 7243 QE R611 GAD31 BAV99-SOT23 MITAC 660
1998 - HITACHI WORKBENCH 1.01

Abstract: ALP 102 B4 i386ex i386ex intel i386 TTC 103 435 AC16 AD17 ALPS 328 TC55V1325FF-7
Text: connections in both directions (VPC/ VCC) BGA-456 Header Translation · Header Verification and , PXB 4350 E on request BGA-456 Semiconductor Group 14 09.98 PXB 4350 E Overview · , and downstream to upstream Technology · · · · BGA-456 package Power dissipation 1.7 W


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2007 - ixp435

Abstract: Si3050-FT KENDIN KSZ8995M PNX1702EH/G rt9214 PC28F128J3D PNX1702 TM3260 SI3201-FS IXDP465
Text: No file text available


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PDF IXP435 001US 0x50000000 0x00080000 0x00000000 0x50800000 Si3050-FT KENDIN KSZ8995M PNX1702EH/G rt9214 PC28F128J3D PNX1702 TM3260 SI3201-FS IXDP465
1997 - h9311

Abstract: intel i386ex K2634 dcct CRC-10 AC16 AD17 TC55V1325FF-7 TC55V2325FF-7 TC55V2325FF
Text: BGA-456 Header Translation · Header Verification and discarding of unallocated PN/VPI/VCIs · , Leaky Bucket) up to 4s Type Ordering Code Package PXB 4350 Q67001-H9311 BGA-456 , and downstream to upstream Technology · BGA-456 package · expected power dissipation 2.5 W


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2003 - LD33

Abstract: la1 d22 a65 LD58 RM2 LA1 XTEST32 ld33 3.3v LD49 TQM8xxL ld33 stm LD61
Text: Q_STM Q_TDI Q_TCK FLOAT1 FLOAT2 FLOAT3 FLOAT4 FLOAT5 FLOAT6 STM TDO TDI TCK TMS TRSTB QL5064 BGA456 A9


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PDF QL5064 ICS527 LD33 la1 d22 a65 LD58 RM2 LA1 XTEST32 ld33 3.3v LD49 TQM8xxL ld33 stm LD61
Not Available

Abstract: No abstract text available
Text: Leaky Bucket) up to 4s Type Ordering Code Package PXB 4350 E on request BGA-456 , downstream to upstream Technology • • • • BGA-456 package Power dissipation 1.7 W


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2007 - dolby true HD 5.1 pcb layout

Abstract: TM3260 ATMEL 24C512 atmel 748 atmel 716 24c04 ATMEL 230 24C04 atmel 24c256 data sheet eeprom 24C256 ATMEL 520 24C02 rca 17556
Text: No file text available


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PDF PNX15xx/952x PNX15XX PNX952X dolby true HD 5.1 pcb layout TM3260 ATMEL 24C512 atmel 748 atmel 716 24c04 ATMEL 230 24C04 atmel 24c256 data sheet eeprom 24C256 ATMEL 520 24C02 rca 17556
2007 - PNX1300

Abstract: No abstract text available
Text: No file text available


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PDF PNX15xx/952x PNX15XX PNX952X PNX1300
2003 - J2534

Abstract: at3217 infineon b 58 468 la intel 80 sy 6551
Text: Type PXB 4350 E Package BGA-456 Data Sheet 16 2003-12-17 ATM-LP PXB 4350 E OAM , Technology · · · · BGA-456 package 0,35 µm CMOS typ. power dissipation 1.7 W Extended temperature range -40°C


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PDF 10BaseV® 10BaseVX® 10BaseSTM, J2534 at3217 infineon b 58 468 la intel 80 sy 6551
VIA vt8501

Abstract: VIA Apollo mvp4 RX5A VT82C686A VENUS tv circuit diagram VT1611A 74f245-type AMD-K6 Processor diagram explanation vt8501 notebook led screen LVDS connector pinout
Text: No file text available


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PDF 5133S 103JT-025 2N7002LT1 DTC144TKA OT-23 DTC144WK FDB7030BL 60A30V VIA vt8501 VIA Apollo mvp4 RX5A VT82C686A VENUS tv circuit diagram VT1611A 74f245-type AMD-K6 Processor diagram explanation vt8501 notebook led screen LVDS connector pinout
2000 - 2am smd transistor

Abstract: ALP 102 B4 i386ex intel tc55v2325ff application note scr tic 106 TC55V2325FF ATM622 alps ALP 102
Text: for one port) Multicast light 7\SH PXB 4350 E Data Sheet 3DFNDJH BGA-456 1-15 08.2000 , · · · BGA-456 package 0,35 µm CMOS typ. power dissipation 1.7 W Extended temperature range


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PDF 87OPIA 2am smd transistor ALP 102 B4 i386ex intel tc55v2325ff application note scr tic 106 TC55V2325FF ATM622 alps ALP 102
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