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Part Manufacturer Description Datasheet Download Buy Part
TW2835-BA1-GR Intersil Corporation 4 Channel Video and Audio Controller; BGA256, PQFP208; Temp Range: -40° to 85°C
ISL5416KI Intersil Corporation Four-Channel Wideband Programmable DownConverter; BGA256; Temp Range: -40° to 85°C
ISL5416KIZ Intersil Corporation Four-Channel Wideband Programmable DownConverter; BGA256; Temp Range: -40° to 85°C
TW2837-BB1-GR Intersil Corporation 4-Channel Video and Audio Controller; BGA256, PQFP208; Temp Range: -40° to 85°C
TW2836-BA1-GR Intersil Corporation 4 Channel Video QUAD/MUX Controller; BGA256, PQFP208; Temp Range: -40° to 85°C
TW2835-PA1-GE Intersil Corporation 4 Channel Video and Audio Controller; BGA256, PQFP208; Temp Range: -40° to 85°C
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WINA-001-PBGA256-U-XTD AMISEMICON Bristol Electronics 598 - -
WINA/002/PBGA256R/U/XTD AMISEMICON Bristol Electronics 184 - -
XC2S506FGFPBGA256 Chip One Exchange 11 - -

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BGA256 datasheet (1)

Part Manufacturer Description Type PDF
BGA256 NXP Semiconductors Footprint for reflow soldering Original PDF

BGA256 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2013 - BGA256

Abstract: No abstract text available
Text: BGA256 , BGA180, LQFP144, BGA100 LPC4333 512 136 KB • • 2 • • 16-32 -40 to +105 °C BGA256 , BGA180, LQFP144, BGA100 LPC4337 1024 136 KB • • 2 • • 16-32 -40 to +105 °C BGA256 , BGA180, LQFP144, BGA100 264 KB • • • 2 • • 16-32 -40 to +85 °C BGA256 , LQFP208, BGA180 136 KB • • • 2 • • 16-32 -40 to +105 °C BGA256 , LQFP208, BGA180 136 KB • â


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PDF 204-MHz, 32-bit LPC4300 32-bit 10/100T LPC4370 BGA256
2010 - BGA180

Abstract: No abstract text available
Text: LQFP208, BGA256 , BGA180 LPC4333 512 136 KB • • 2 • • 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 LPC4337 1024 136 KB • • 2 • • 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 LPC4350 264 KB • • • 2 • • 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 LPC4353 , LQFP208, BGA256 , BGA180 LPC4357 1024 (2x512) 136 KB • • • 2 â


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PDF 32-bit LPC4300 32-bit LQFP208, BGA256, BGA180 BGA180
2010 - BGA256

Abstract: lpc1800 TBGA100 LQFP144 LPC1810 LPC1833 LPC1837 LQFP208 LPC1850 LPC1817
Text: 2x 8ch 10b 80 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 LPC1833 512 (2x256) 136 · 2 · · 2x 8ch 10b 80 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 , 80 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 · 2 · · 2x 8ch 10b 80 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 LPC1853 512 (2x256) 136 · · 2 · · 2x 8ch 10b 80 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 LPC1857 1024 (2x512


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PDF 32-bit LPC1800 LPC1800 32-bit 10-bit LQFP208, BGA256, BGA180 BGA256 TBGA100 LQFP144 LPC1810 LPC1833 LPC1837 LQFP208 LPC1850 LPC1817
2011 - Not Available

Abstract: No abstract text available
Text: €¢ 16-32 -40 to +85 °C BGA256 , BGA180, LQFP144, BGA100 136 KB • 264 KB LPC4330 , to +85 °C BGA256 , BGA180, LQFP144, BGA100 LPC4337 1024 136 KB • • 2 • • 16-32 -40 to +85 °C BGA256 , BGA180, LQFP144, BGA100 LPC4350 264 KB • • • 2 • • 16-32 -40 to +85 °C LQFP208, BGA256 , +85 °C LQFP208, BGA256 , BGA180 LPC4357 1024 (2x512) 136 KB • • â


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PDF 32-bit LPC4300 32-bit 10/100T LQFP208, BGA256, BGA180
2011 - Not Available

Abstract: No abstract text available
Text: €¢ 16-32 -40 to +85 °C BGA256 , BGA180, LQFP144, BGA100 136 KB • 264 KB LPC4330 â , BGA256 , BGA180, LQFP144, BGA100 LPC4337 1024 136 KB • • 2 • • 16-32 -40 to +85 °C BGA256 , BGA180, LQFP144, BGA100 LPC4350 264 KB • • • 2 • • 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 LPC4353 512 136 KB • • • 2 • • 16-32 -40 to +85 °C LQFP208, BGA256 , BGA180 LPC4357 1024


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PDF 32-bit LPC4300 32-bit 10/100T LQFP208, BGA256, BGA180
1995 - CE51484

Abstract: micron 100 ball BGA BGA 256 PACKAGE power dissipation BGA256 CG51114 CE51364 BGA576 BGA352 BGA-576 CG51284
Text: k 403 BALL GRID ARRAY (BGA) PACKAGES ASIC TECHNOLOGY BRIEF BGA256 Type B Thermal , 5 0 1 Air Flow [m/sec] 0 BGA256 Type B Electrical /Thermal Characteristics 3 BGA416 , CG46154 352 CE46194 400 BGA-256 (Type-B) BGA-352 (Type-B) BGA-352 (Type-C) BGA-416 (Type-C , Pads CE46533 208 CE46713 240 CE46833 256 CE46903 272 BGA-256 (Type-B) BGA , 0.635 4-R0.75 4-R1.00 576-ø0.75 ± 0.15 Cu heatsink BGA256 (Type-B) 3-RO .50 TYP. 27.00


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PDF CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA 256 PACKAGE power dissipation BGA256 CG51114 CE51364 BGA576 BGA352 BGA-576 CG51284
2004 - BGA256

Abstract: BGA256 17 X 17 STLC8100 STLC8201 BGA256 1700
Text: EEPROM memory interface to hold PCI/ Figure 1. Package BGA256 (17x17x1.7mm) Table 1. Order Codes Part Number 2 Package STLC8201 BGA256 CardBus32 configuration. JTAG , Interface Host PC STLC8201 Figure 3. BGA256 (17x17x1.7mm) Mechanical Data & Package Dimensions mm


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PDF STLC8201 BGA256 BGA256 17 X 17 STLC8100 STLC8201 BGA256 1700
QFP256

Abstract: BGA256 YY9001 QFP-256 SH7751 QFP-256 package green hills probe
Text: Product Brief Ver 1.03 UniSTAC ® SH-7751 (8M/16M) In-Circuit Emulator Supports Renesas Technology (formerly Hitachi) SH7751 (SH-4) microcontroller Real-time execution with 0 wait-states up to 167 MHz internal clock (83 MHz external clock in Full ICE Mode). Supports QFP-256, BGA256 pin , SH7751 Package QFP-256 pin, BGA-256 pin (option) CPU Clock Max. 83 MHz external (167 MHz , Adapters: CPU Type SH7751 Package QFP256 BGA256 Probe End Adapter (option) CS2342B


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PDF SH-7751 8M/16M) SH7751 QFP-256, BGA256 Mbytes/16 SH7751 Windows98/Me/NT/2000/XP SH7751-PB-BGA256-AD FGA256-721G QFP256 YY9001 QFP-256 QFP-256 package green hills probe
2004 - bga256

Abstract: BGA-256 BGA256 17
Text: 1.3 Pin Arrangement The pin arrangement of this LSI is shown in figure 1.2. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 A A B B C C D D E E F F G G H H J SH7641 J K BGA-256 K L L (Top view) M M N N P P R R T T U U V V W W Y Y 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Figure 1.2 Pin Arrangement ( BGA-256


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PDF SH7641 BGA-256 BGA-256) bga256 BGA-256 BGA256 17
BGA-169

Abstract: TQFP112 BGA169 PLCC18 BGA-256 BQFP-84 PQFP144 qfp132 BGA196 BGA-421
Text: 33x33 TF, BGA-240/324 32x32 TF, BGA-240/304/432 31x31 TF, BGA-256 30x30 TF, BGA-256 /400 29x29 , -196/121 19x19 TF, BGA-256 17x17 TF, BGA-100 16x16 TF, BGA-86 16.25x17.75 TF, BGA-121/196/68 15x15


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PDF SOIC-14 SOIC-16 05x10 BGA-100 16x16 BGA-86 25x17 BGA-121/196/68 15x15 BGA-144 BGA-169 TQFP112 BGA169 PLCC18 BGA-256 BQFP-84 PQFP144 qfp132 BGA196 BGA-421
yuv422 RGB

Abstract: MB86277 MB88F332 MB86297A ada01 YCBCR422 RGB666 MB86276 MB86294 QFP-240
Text: ) GDC-Studio Tool QFP256 · BGA256 · BGA256 · BGA256 · 32 133 32 100 QFP256 · 64


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PDF MB86290A MB86291A MB86292 MB86293 GPB86297A SK-86R01-EMWI MB86R01 MB86290A SK-86R01-TERMINAL yuv422 RGB MB86277 MB88F332 MB86297A ada01 YCBCR422 RGB666 MB86276 MB86294 QFP-240
Not Available

Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT (REFLOW SOLDERING) Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10 BGA256 SOT466-1 1.27 1.27 0.75 0.60 27.30 27.30 ±0.10 BGA256 SOT471-1 1.27 1.27 0.50 0.60 27.30 27.30 ±0.10 BGA292 SOT489


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PDF MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316
2010 - 1280x480

Abstract: QFP256 QFP-256 MB88F332 MB86298EB01-VIDEO01 MB86298 MB86297 MB86276 Display Controllers MB86R02
Text: Other 100 MHz (Max.) ­- ­- ­- QFP256, BGA256 ­- BGA256 ­- BGA256 ITU-RBT656 ­- BGA256 2.5V (Internal) 3.3V (External) QFP208 QFP256 Yes 4 layers ­-


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PDF SK-86R0X-GHS-TRACE-ADA SK-86R01 SK-86R02-01 SK-86R01 GDC-FS-21357-01/2010 1280x480 QFP256 QFP-256 MB88F332 MB86298EB01-VIDEO01 MB86298 MB86297 MB86276 Display Controllers MB86R02
2007 - secure access module

Abstract: AT91SO25 at91so100 AT91SO51 ARM SC100 AES RSA chips AT91SO101 hardware AES 256 controller CRC-16 and CRC-32 ARM SC100 7816
Text: , TWI, USARTs and I/O ports. The AT91SO101 is a single package solution in BGA256 embedding two chips , same package ( BGA256 ) pin to pin compatible with the AT91SO101 but without the AT83C26. The AT91SO51 , 6514BS­SPD­10 May 07 Figure 2. BGA256 (AT91SO100/101) All dimensions are in mm 4 AT91SO100


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PDF 32-bit -SC100TM 384-byte 128-byte 6514BS secure access module AT91SO25 at91so100 AT91SO51 ARM SC100 AES RSA chips AT91SO101 hardware AES 256 controller CRC-16 and CRC-32 ARM SC100 7816
2005 - saa7117

Abstract: SAA7117AE SAA7136 SAA7136E saa7119e NTSC LCD video decoder SAA6734AHL SAA7135 SAA7119 SAA7115H
Text: Decoders Package SOT425 (LQFP128) SOT425 (LQFP128) SOT425 (LQFP128) SOT425 (LQFP128) SOT811 ( BGA256 ) SOT811-1 ( BGA256 ) SOT811 (SQFP208) Application PC TV Card PC TV Card PC TV Card PC TV Card PC TV


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PDF SAA6734AHL LQFP100 SAA6734AHL 10-bit andQFP208) SAA7130, SAA7134, SAA7133, SAA7135) LQPF128 saa7117 SAA7117AE SAA7136 SAA7136E saa7119e NTSC LCD video decoder SAA7135 SAA7119 SAA7115H
2004 - atmel 426

Abstract: ARM microcontrollers AT91-series AT91FR40162 AT91FR4042 ARM926EJ-S AT91M42800A AT91M55800A AT91R40008 usart for arm
Text: Now Now Now Now QFP100 Now Now BGA256 2Q04 3Q04 QFP144 2Q04 3Q04 QFP176 Now 2Q04 QFP100 QFP48 QFP64 QFP64 QFP64 QFP100 QFP208 BGA256 3Q04 3Q04 3Q04


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PDF AT91-series CH-1705 QFP100 BGA121 BGA256 QFP144 QFP176 atmel 426 ARM microcontrollers AT91FR40162 AT91FR4042 ARM926EJ-S AT91M42800A AT91M55800A AT91R40008 usart for arm
1996 - D 2395

Abstract: BGA256 17 X 17 BGA256 MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256 : plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 v M C A B b 1/2 e e y y1 C w M C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional (4x) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19


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PDF BGA256: OT471-1 MS-034 D 2395 BGA256 17 X 17 BGA256 MS-034
1999 - BGA256

Abstract: sot466 BGA256 17 X 17
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256 : plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm D D1 SOT466-1 ball A1 index E1 E detail X A2 A1 A k k e Y W V U T R P N M L K J H G F E D C B A 2 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 ZD b w M A v A ZE y e 20 X 10 scale 20 mm 0 DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.54 A1 0.70 0.50 A2 1.78 1.68 b 0.90 0.60 D 27.2 26.8 D1 24.7 24.0 E 27.2 26.8 E1


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PDF BGA256: OT466-1 BGA256 sot466 BGA256 17 X 17
2007 - SAA7136E

Abstract: SAA7138GHL saa7138 nxp saa7136E SAA7136AE SAA7136 SAA7137 SAA7136CE SAA7137DHS SAA7171
Text: BGA256 Package LQFP128 LQFP128 SAA7174A SAA7173 Production Pin-to-Pin Compatible Production BGA256 SQFP208 LQFP128 all SAA7136xE all SAA7137xHS all SAA7138xHL Production


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PDF SAA7173 SAA7174A SAA7171 SAA7136E SAA7136AE SAA7136BE SAA7136CE SAA7136DE SAA7137HS SAA7137BHS SAA7136E SAA7138GHL saa7138 nxp saa7136E SAA7136AE SAA7136 SAA7137 SAA7136CE SAA7137DHS SAA7171
1999 - sot471

Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256 : plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm D D1 SOT471-1 ball A1 index E1 E A2 A1 A detail X k k ZD e Y W V U T R P N M L K J H G F E D C B A 2 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 A v A ZE y b w M e X 10 scale 20 mm 0 DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.32 A1 0.70 0.50 A2 1.58 1.48 b 0.90 0.60 D D1 E E1 e 1.27 k 4.0 3.9 v 0.35


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PDF BGA256: OT471-1 sot471
2004 - Not Available

Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT471-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SP SL occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 1.27 0.600 0.500 0.750 Hx Hy 27.575 27.575 SOT471-1_fp PDF Â


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PDF BGA256 OT471-1 OT471-1
2002 - SA-1110

Abstract: 1110 strongArm BDT002 BGA256 SA1110 ac adapter schematic BGA-256 Sophia Systems
Text: Product Brief December 2000 StrongARM SA-1110 Evaluation Board SA-1110 Evaluation Board is as hardware reference used for evaluating the capability and performance of Intel StrongARM SA-1110. SA-1110 Evaluation Board includes connectors with CPU signal lines, which enables the user to make their own original board extend to the outside. The combination of SA-1110 Evaluation Board and UniSTACTM SA-1110 In-Circuit Emulator provides on-chip debugging. Specifications StrongARM SA-1110 ( BGA256 ) 59 ~ 206.4


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PDF SA-1110 SA-1110. SA-1110 BGA256) 6864MHz RS-232C 1110 strongArm BDT002 BGA256 SA1110 ac adapter schematic BGA-256 Sophia Systems
2006 - "Display Controller"

Abstract: BGA-256 graphic controller display controller MB86296 MB86290A serial graphic display MB86276 Master Instrument video out to rgb
Text: GPIO inputs/outputs · Serial interface · Supply voltage 3.3V (I/O), 1.8V (Internal) · BGA-256


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PDF MB86276 64MByte MB86276 MB86296 32-bit 16-bit GDC-FS-21148-2/2006 "Display Controller" BGA-256 graphic controller display controller MB86290A serial graphic display Master Instrument video out to rgb
2004 - Not Available

Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 1.00 0.450 0.450 0.600 Hx Hy 17.575 17.575 SOT811-1_fp PDF Â


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PDF BGA256 OT811-1 OT811-1
1996 - BGA256

Abstract: MS-034 BGA256 17 X 17 BGA-256 BGA256 17
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA256 : plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 v M C A B b 1/2 e e y y1 C w M C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional (4x) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19


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PDF BGA256: OT466-1 MS-034 ED-7311-9A BGA256 MS-034 BGA256 17 X 17 BGA-256 BGA256 17
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