The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial

BGA reflow guide Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2007 - BGA reflow guide

Abstract: No abstract text available
Text: BGA Socket FinderTM at www.bgasockets.com. Step 1: Reflow solder the BGA device to the Guide Box , BGA Socket Adapter System BGA Guide Box Socketing System With Extraction Screw Feature Table , 140°C (-40°F to 284°F) Insulator Size: BGA Device body + 0.315/(8.00) with guide box* Description , °F) Insulator Size: BGA Device body + 0.315/(8.00) with guide box* Features: · Facilitates easy insertion , . Specifications subject to change without notice. inch/(mm) BGA Guide Box Socketing System With Extraction


Original
PDF
2010 - BGA reflow guide

Abstract: pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga
Text: Solder Reflow Guide for Surface Mount Devices November 2010 Technical Note TN1076 , . www.latticesemi.com 1-1 tn1076_02.4 Solder Reflow Guide for Surface Mount Devices Lattice Semiconductor , 2 Solder Reflow Guide for Surface Mount Devices Lattice Semiconductor Table 2. Peak , 245 Solder Reflow Guide for Surface Mount Devices Lattice Semiconductor Table 2. Peak , , MachXO, LatticeXP2. 2. LatticeECP3. 4 Solder Reflow Guide for Surface Mount Devices Lattice


Original
PDF TN1076 1-800-LATTICE BGA reflow guide pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga
2009 - BGA reflow guide

Abstract: JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
Text: Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction , . www.latticesemi.com 1-1 tn1076_02.3 Solder Reflow Guide for Surface Mount Devices Lattice Semiconductor , Guide for Surface Mount Devices Lattice Semiconductor Table 2. Peak Reflow Temperature (TP) by , PQFP 3 100 3 225 160 3 225 208 3 225 3 Solder Reflow Guide for , 1156 ftBGA 3 250 256 3 260 324 3 260 4 Solder Reflow Guide for Surface


Original
PDF TN1076 1-800-LATTICE BGA reflow guide JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
2004 - xilinx topside marking

Abstract: xilinx part marking pcb footprint FS48, and FSG48 CF1752 smd code v36 reballing BGA reflow guide recommended layout CSG324 SMD MARKING CODE C1G XC2VP7 reflow profile
Text: Solder Reflow Process for BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , balls for BGA packages. In addition, suitable material sets are chosen and qualified for higher reflow , peak reflow temperature of 205oC - 220oC. At this temperature range, the SnAgCu BGA solder balls do , Device Package User Guide [ Guide Subtitle] [optional] UG112 (v3.6) September 22, 2010 [optional] R R Xilinx is disclosing this user guide , manual, release note, and/or specification


Original
PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 CF1752 smd code v36 reballing BGA reflow guide recommended layout CSG324 SMD MARKING CODE C1G XC2VP7 reflow profile
2004 - xilinx part marking

Abstract: xilinx topside marking UG112 HQG160 reballing FGG484 qfn 3x3 tray dimension FF1148 top marking 957 so8 xilinx XC2V6000-FF1152
Text: . . . . . . . . 111 Implementing and Optimizing Solder Reflow Process for BGA Packages . . . . . , process usually has a peak reflow temperature of 205oC - 220oC. At this temperature range, the SnAgCu BGA , Device Package User Guide [ Guide Subtitle] [optional] UG112 (v3.2) March 17, 2009 [optional] R R Xilinx is disclosing this user guide , manual, release note, and/or specification (the , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3.2) March


Original
PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 HQG160 reballing FGG484 qfn 3x3 tray dimension FF1148 top marking 957 so8 xilinx XC2V6000-FF1152
2004 - XILINX/part marking Hot

Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY XC2VP7 reflow profile TT 2076 qfn 3x3 tray dimension SPARTAN-II xc2s50 pq208 HQG160 sn63pb37 solder SPHERES
Text: Solder Reflow Process for BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , usually has a peak reflow temperature of 205oC - 220oC. At this temperature range, the SnAgCu BGA solder , Device Package User Guide [ Guide Subtitle] [optional] UG112 (v3.4) June 10, 2009 [optional] R R Xilinx is disclosing this user guide , manual, release note, and/or specification (the , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3.4) June 10


Original
PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY XC2VP7 reflow profile TT 2076 qfn 3x3 tray dimension SPARTAN-II xc2s50 pq208 HQG160 sn63pb37 solder SPHERES
2004 - qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I XC4VLX25 cmos 668 fcbga FFG676
Text: Implementing and Optimizing Solder Reflow Process for BGA Packages . . . . . . . . . . . . . . . . . . . . . . , process usually has a peak reflow temperature of 205oC - 220oC. At this temperature range, the SnAgCu BGA , Device Package User Guide [ Guide Subtitle] [optional] UG112 (v3.5) November 6, 2009 [optional] R R Xilinx is disclosing this user guide , manual, release note, and/or specification (the , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3


Original
PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I XC4VLX25 cmos 668 fcbga FFG676
2000 - smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 BGA reflow guide P6K6 k5m6 Senju metal flux T5 K793 SMD CODE G7
Text: Instruments. MicroStar BGA Packaging Reference Guide iii Texas Instruments addressed several key , your application. This guide is designed to give you technical background on MicroStar BGA packages , . . . . . . . . B­13 MicroStar BGA Packaging Reference Guide v Contents (continued) 240GGW , BGA Packaging Reference Guide vii List of Figures (continued) Figure Page 38 , . . . . . . . . . . . . . . . . . . . . . . 6­5 MicroStar BGA Packaging Reference Guide PCB


Original
PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 BGA reflow guide P6K6 k5m6 Senju metal flux T5 K793 SMD CODE G7
1999 - CBG064-052A

Abstract: csp process flow diagram CBG064 reballing 28F160C18 intel 845 MOTHERBOARD pcb CIRCUIT diagram BGA Solder Ball 0.35mm collapse intel MOTHERBOARD pcb design in micron tsop 48 PIN tray 28F3202C3
Text: ® FLASH MEMORY CHIP SCALE PACKAGE USER'S GUIDE D Figure 2-5. Easy BGA Package Manufacturing Flow , D Intel Flash Memory Chip Scale Package User's Guide ® The Complete Reference Guide 1999 , USER'S GUIDE D CONTENTS 1.0 CHIP SCALE PACKAGING , . 2.3 The Easy BGA and Intel® Stacked-CSP Process Flow , . 9 3.5 The Easy BGA Package


Original
PDF
sn63pb37 solder wire

Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Text: GHz BGA Socket User Manual Tel: (800) 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen Elastomer Cleaning , SGB.doc, Rev. P, VP, 8/20/2009 Tel: (800) 404-0204 www.ironwoodelectronics.com Selecting a BGA , www.ironwoodelectronics.com. Select the "Products" link, then under the "Browse" menu, select the "GHz BGA & MLF socket" link


Original
PDF
1997 - CM16C550P

Abstract: sad1 diode smd 4.7 uf/50v smd capacitor NPN CD100 transistor SPER 1A1 C4 DIALCO 0.1 uf/50v smd capacitor C01100 clock 7 segment intel packaging handbook 240800
Text: 1-15. BGA Example SMT Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 , Rev. 2.1 i960® Rx I/O Processor Design Guide November, 1997 Order Number: 273004-002 , GUIDE 1.1 80960Rx Layout and Routing Recommendations . . . . . . . . . . . . . . . . . . . . . 1 , 1.16 Designing Your PCB for the BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.17 , . . . . . . . . . . . . . . . . . . . . 47 1.21 Surface Mount Technology Processing of BGA . . . .


Original
PDF 74ALS245A 74ALS245AD-T 74AS244 SN74AS244DWR 74F07 N74F07AD 74F04 74F04D 74F32 SN74F32DR CM16C550P sad1 diode smd 4.7 uf/50v smd capacitor NPN CD100 transistor SPER 1A1 C4 DIALCO 0.1 uf/50v smd capacitor C01100 clock 7 segment intel packaging handbook 240800
1999 - PCB design for very fine pitch csp package

Abstract: Senju Senju metal solder paste Modified Coffin-Manson Equation Calculations 179GHH B12-246 37K-1 Semicon volume 1 N12114 senju solder bar
Text: Incorporated. MicroStar BGA Packaging Reference Guide iii Texas Instruments addressed several key , production units. This guide is designed to give you technical background on MicroStar BGA packages as well , local TI field sales office. MicroStar BGA Packaging Reference Guide Contents 1 PCB Design , B­17 MicroStar BGA Packaging Reference Guide v List of Figures Figure 1 2 3 4 5 6 7 , Packaging Reference Guide PCB Design Considerations 1 PCB Design Considerations MicroStar BGA


Original
PDF SSYZ015A PCB design for very fine pitch csp package Senju Senju metal solder paste Modified Coffin-Manson Equation Calculations 179GHH B12-246 37K-1 Semicon volume 1 N12114 senju solder bar
2004 - BFG95

Abstract: No abstract text available
Text: Implementing and Optimizing Solder Reflow Process for BGA Packages . . . . . . . . . . . . . . . . . . . . . . , Device Package User Guide UG112 (v3.7) September 5, 2012 R R Notice of Disclaimer The , the property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3 , )”, and Table 1-2: “Xilinx Device Marking Definition—Example”. Updated “Flip-Chip BGA , Updated “Recommended PCB Design Rules for BGA , CSP, and CCGA Packages,” page 87; added missing (D


Original
PDF UG112 UG072, UG075, XAPP427, BFG95
2004 - BGA reflow guide

Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire sn63pb37 0.4mm fine BGA thermal profile 23M1 20mm light dependent resistors ultra fine pitch BGA
Text: www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to www.ironwoodelectronics.com. Select "Products" link, then under "Browse" menu, select "GHz BGA & MLF socket" link. For 1.27mm, 1mm, 0.8mm and 0.75mm pitch BGA device, select "SG-BGA-6xxx" link. . For 0.65mm, and 0.5mm pitch BGA device, select "SG-BGA-7xxx" link , sectional views and the material details. The second page shows the recommended PCB layout (Note: BGA pads


Original
PDF
40KHZ ULTRASONIC CLEANER CIRCUIT

Abstract: pogo pin cleaning 1mm pitch zif BGA socket BGA reflow guide "ultrasonic cleaner" 1mm pitch BGA socket 40KHz ultrasonic interface ULTRASONIC bath CLEANER CIRCUIT maintenance program ultrasonic probe
Text: . 2 Selecting a BGA Stamped pin socket , . 3 IC and PCB Reflow Requirement , . 5 0.5mm, 0.65mm & 0.8mm Center ­ BGA Stamped Contact Specification (Scale 40:1 , ) . 7 1mm & 1.27mm Center ­ BGA Stamped Contact Specification (Scale 25:1 , compresses on the circuit board and thereby making electrical connection. Selecting a BGA Stamped pin


Original
PDF
2002 - IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: senju solder bar Coffin-Manson Equation senju solder paste vps BGA reflow guide BGA PROFILING Senju metal solder paste 06107 entek Cu-56 Cu-56
Text: Place Components and PIH Connectors Component Placement ( BGA , SMT) Wave Solder Reflow , CBGA Surface Mount Assembly and Rework User's Guide May 23, 2002 ® Copyright , ://www.chips.ibm.com CBGA Surface Mount Assembly and Rework User's Guide May 23, 2002 . CBGA Surface Mount Assembly and Rework User's Guide Contents Figures , . 2.7 Solder Reflow


Original
PDF
Soldering Instructions

Abstract: reflow soldering profile BGA BGA reflow guide BGA PROFILING reflow temperature bga
Text: www.ironwoodelectronics.com Giga-snaPTM & BGA Surface Mount Foot Soldering Instructions (cont.) Soldering Reflow , Tel: (800) 404-0204 www.ironwoodelectronics.com Giga-snaPTM & BGA Surface Mount Foot Soldering Instructions Target PCBs, which are intended to accept the Ironwood Electronics BGA surface mount emulator , that can be used to attach the BGA surface mount emulator feet to target PCBs. Because of these wide , general Figure 1: Target PCB/ BGA Emulator Foot soldering instructions. Ironwood's BGA surface mount


Original
PDF
2004 - BGA reflow guide

Abstract: pitch 0.75mm BGA 1024 ball bga
Text: Guide Post Socket (SG) · Adapter size equals the BGA Device body + .157/(4.0) Features: · Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to , Type -700 0.75mm Pitch Type -757 ADAPTER Reflow (solder) BGA Device to Adapter .182 (4.62 , Ball Grid Array ( BGA ) Adapters 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel , BGA Adapters Standard Adapter (A): · Mates with Standard Socket (S) · Adapter size equals BGA


Original
PDF
BGA reflow guide

Abstract: 1024 ball bga
Text: Extraction Socket (SB) or Guide Post Socket (SG) · Adapter size equals the BGA Device body + .157/(4.0 , Type -715 Type -700 Type -757 7 7* Reflow (solder) BGA Device to Adapter a^ / j. .182 , ADVANCED INTERCONNECTIONS. Ball Grid Array ( BGA ) Adapters Standard Adapter (A): · Mates with Standard Socket (S) · Adapter size equals BGA Device body + .079/(2.0) 5 Energy Way, P.O. Box 1019, West , Internet http://w ww .advintcorp.com BGA Adapters Extraction Slot Adapter (AX): · Slots allow AIC


OCR Scan
PDF
1999 - land pattern BGA 0.75

Abstract: BGA reflow guide BGA and CSP bo 137
Text: Design Summary for 96GKE/114GKF MicroStar BGA Packages TM PCB Design Guidelines Package Via to Board Land Area Configuration MicroStar BGA Package Package ball via Near-Sn/Pb eutectic solder , reflow . · Paste contributes to the final volume of solder in the joint, and thus allows this volume to , the mounted components. IR Reflow Profile Packaging Tape and Reel 4.0 + 0.10 1.75 + 0.10 - , tolerances are specified at ±80 microns. These packages are selfaligning during solder reflow , so final


Original
PDF 96GKE/114GKF com/design/flcomp/packdata/297846 land pattern BGA 0.75 BGA reflow guide BGA and CSP bo 137
2008 - Not Available

Abstract: No abstract text available
Text: Appr title rev 0.3 0.XX 0.XXX 0.050 AirMax VS AirMax VS VERT BGA HEADER 5 PAIR , POS 2, 4, 6, 8, 10 & 10 DETAIL A D AirMax VS VERT BGA HEADER dwg no 1 title , 2 3 4 (12.45 ) (3.90 ) A B A B PCB C D D AirMax VS VERT BGA HEADER dwg no COMPONENT AFTER REFLOW , W/ CAP REMOVED title Copyright FCI. C 5 PAIR , 10mm PICK UP AREA A A POSITION A1 INDICATOR B B C D D AirMax VS VERT BGA


Original
PDF 10076728-101LF V07-0674 VO8-0170
2009 - BGA reflow guide

Abstract: C17200
Text: TM Flip-Top BGA Sockets TM Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket (FRG, 1.27mm pitch) Guide Box and Base Mat'l: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Description: Socket (FRH, 1.00mm pitch) Guide Box Mat'l: High , hold-downs or soldering of BGA device required. · AIC exclusive solder ball terminals offer superior processing. · Uses same footprint as BGA device. · Available with integral, finned heat sink or coin screw


Original
PDF
2010 - BGA reflow guide

Abstract: No abstract text available
Text: Flip-Top BGA Sockets TM Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket (FRG, 1.27mm pitch) Guide Box and Base Mat'l: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Description: Socket (FRH, 1.00mm pitch) Guide Box Mat'l: High , Epoxy Index: -40°C to 140°C (-40°F to 284°F) Socket Size: 3.00mm wider and 10.00mm longer than BGA , than BGA device (for packages larger than 15.00mm square).* Features: · Designed to save space on


Original
PDF
2008 - 10035911

Abstract: airMax BGA reflow guide GS-14-920
Text: VERT BGA HEADER 5 PAIR, 150 POS, 30MM - 10076728 CUSTOMER sheet B 1 of 5 catalog no 1 , ADJACENT FOOTPRINTS SHOWN) NOTES 4, 6, & 7 AirMax VS VERT BGA HEADER 5 PAIR, 150 POS, 30MM - , C C Copyright FCI. D D dwg no title COMPONENT AFTER REFLOW , W/ CAP REMOVED REV F - 2006-04-17 AirMax VS VERT BGA HEADER 5 PAIR, 150 POS, 30MM - 10076728 CUSTOMER sheet , Copyright FCI. D D dwg no title AirMax VS VERT BGA HEADER 5 PAIR, 150 POS, 30MM -


Original
PDF 10076728-101LF V07-0674 VO8-0170 10035911 airMax BGA reflow guide GS-14-920
2008 - 10035911

Abstract: airmax
Text: VERT BGA HEADER 5 PAIR, 150 POS, 30MM - 10076728 CUSTOMER sheet B 1 of 5 catalog no 1 , ADJACENT FOOTPRINTS SHOWN) NOTES 4, 6, & 7 AirMax VS VERT BGA HEADER 5 PAIR, 150 POS, 30MM - , C C Copyright FCI. D D dwg no title COMPONENT AFTER REFLOW , W/ CAP REMOVED REV F - 2006-04-17 AirMax VS VERT BGA HEADER 5 PAIR, 150 POS, 30MM - 10076728 CUSTOMER sheet , Copyright FCI. D D dwg no title AirMax VS VERT BGA HEADER 5 PAIR, 150 POS, 30MM -


Original
PDF 10076728-101LF V07-0674 VO8-0170 10035911 airmax
Supplyframe Tracking Pixel