The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial

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Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray drawing JEDEC Kostat DAEWON tray 48 daewon CERAMIC PIN GRID ARRAY CPGA AMD D-12G-56LD-A13
Text: Chapter 7 Trays Tray Suppliers per Package Type (Continued) Package Plastic Ball Grid Array ( BGA , and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication , serving as a cover. The diagrams and tables that follow show tray dimensions per package and the , Device Count per Tray and Box (Continued) Devices per Tray Devices per Box1 24 120 569 BGA , ) 388 BGA (35 mm x 35 mm) 420 BGD (35 mm x 35 mm) 492 BGA (35 mm x 35 mm) Plastic Quad Flat Package


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PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray drawing JEDEC Kostat DAEWON tray 48 daewon CERAMIC PIN GRID ARRAY CPGA AMD D-12G-56LD-A13
1999 - LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 smd code 38P YAMAICHI ic234 fpq-144-0.5-03 smd p08
Text: ­ SOJ Small Outline J-Leaded Package 1.27 ­ BGA Ball Grid Array 1.5/1.27/1.0 , substrate 10 Package Structures Lamination: Metal seal, frit seal Plastic BGA (cavity down type , LSI are rapidly increasing. Given this environment, package technology is rapidly increasing in , packages in the design of their products, and therefore focuses on the package outline drawings , Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case


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2002 - LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram Wells-CTI 36 lead Flat Pack 216-LQFP smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 Enplas drawings BGA136
Text: PACKAGE 176 PIN PLASTIC BGA -176P-M03 176-pin plastic FBGA Lead pitch 0.50 mm Package width × , Package code ( BGA -176P-M03) Tab: Shows form 176-pin plastic FBGA ( BGA -176P-M03) 8.00±0.10 , Quad Flat Non-Leaded Package (JEITA) BGA Ball Grid Array FBGA Fine pitch Ball Grid Array , package is suited for high-density mounting of packages with 64 or more pins. A special surfacemount , , and 70 mm. 0.50 to 0.15mm BGA This package has a grid of equally spaced leads (solder ball


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1999 - BGA PACKAGE TOP MARK intel

Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
Text: for Easy BGA Packages µBGA* Package Thin Tray Dimensions Pkg. Type M M1 M2 M3 Rows , respective owners. Easy BGA Mechanical Specification Contents 1.0 Easy BGA Package Drawing and Dimensions . 1 2.0 Easy BGA Package Schematics: Silicon , . 2 3.0 Easy BGA Package Media Information . 3 3.1 3.2 3.3 3.4 Carrier Tape Diagram and Dimensions for Easy BGA Package


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PDF 28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
1996 - NEC A39A 240

Abstract: NEC A39A SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 ED-7500 smd TRANSISTOR code b6 120-PIN 282 185 01 transistor a39a SIP 400B
Text: BGA 3 CHAPTER 1 1.1.2 PACKAGE OUTLINES AND EXPLANATION Outer view and characteristics , chip is connected to the leads of the film pattern. BGA Balls are on one surface of the package , Package QTP G Land Grid Array BGA Quad Tape Carrier Package (iii) Number of package pins (example of code) Code Number of Package Terminals 0008 8 0014 14 0064 64 0144 , Package ) Package Outline Drawing No. Pin Count 64 pin Remarks Page Features Forming


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PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A 240 NEC A39A SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 ED-7500 smd TRANSISTOR code b6 120-PIN 282 185 01 transistor a39a SIP 400B
2011 - daewon tray

Abstract: Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
Text: tray ). ■Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA , 652 BGA Parts or Tray Vendor and Vendor Part Number Handling J-Lead and QFP Devices , -12213-00 24 1152 35  35 Flip Chip BGA Package thickness >2.2mm Daewon T0809050 A E20 , Corporation Tray Revision 256 FineLine BGA Vendor and Vendor Part Number Primary Supplier , Flat No-Lead (QFN) E20-12212-00 68 M B 64 Micro BGA (MBGA) Daewon 12V-2727-319


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PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
2010 - QFN tray

Abstract: 7x7x1.4 tray qfn 5 x 5 TRAY MKT71C1176-00 tray datasheet bga PS007229-1010 lqfp 7x7 tray BGA package tray 64 13X13 LQFP Package tray
Text: . 7 Marketing Outline, 64 -Lead PDIP , . 17 Marketing Outline, 64 -Lead LQFP. 18 Marketing Outline, 64 -Lead LQFP , . 28 Marketing Outline, 144-Lead BGA , . 37 Package Migration


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PDF PS007229-1010 2000/REEL 1000/REEL 160/TRAY 1600/BAG 490/TRAY 260/TRAY QFN tray 7x7x1.4 tray qfn 5 x 5 TRAY MKT71C1176-00 tray datasheet bga PS007229-1010 lqfp 7x7 tray BGA package tray 64 13X13 LQFP Package tray
KGA0E000BA

Abstract: kgc0g000dm fBGA package tray 12 x 19 KGB0F000BA FCMSP kga0a000am fBGA package tray 12 19 kgd0h000dm secucalm lsi SoC
Text: : 64 - BGA A : 272 D : 153 G : 388 - PBGAH E : 918 B : 416 E : 208 - SOP C:8 K : 20 O , : 308 7 : 256 T : 64 14. Packing B : Tube U : Bulk R : Tray T : Tape & Reel S : Tape & Reel , : 1.5M byte W : 144K byte 8. Version A~Z *1st Version X 9~10. Mask Option 11. " - " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB R : TSSOP S : SOP U , XXXXXX 1 2 3 4 5 13. Package Pin Wafer/CHIP BIZ = 0 (NONE) - SDIP B : 56 M : 24 Q : 42


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PDF 16-bit 32-bit ARM10 16-bit HT80Cer KGA0E000BA kgc0g000dm fBGA package tray 12 x 19 KGB0F000BA FCMSP kga0a000am fBGA package tray 12 19 kgd0h000dm secucalm lsi SoC
1998 - MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B BGA package tray 64 TSOP TRAY 40 PIN 6-tsop NEC A39A 240 TSOP package tray TRAY DIMENSIONS 132 PGA
Text: -100-400B-1 Magazine MD400-1A Tray Plastic DIP Nominal 20 Package LA-0530B-1 22 NEC Code , NEC Code Tray LA-027 40 P40E-100-A-1 - - 42 P42E-100-A-1 - - 64 , -65-375B-1 Magazine MM375-2A 500 70 P70G7-80-500A Tray LA-3521A-1 525 64 P64GW , TSOP (2) 400MIL18 S28G5-50-7KD5 Tray TSOP (2) 400MIL18 CHAPTER 4 Package TSOP (II , -0551A-1 12 × 12 64 P64GK-65-8A8-1 Tray LA-1004A-1, LA-0557A-1 14 × 14 64 P64G


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PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B BGA package tray 64 TSOP TRAY 40 PIN 6-tsop NEC A39A 240 TSOP package tray TRAY DIMENSIONS 132 PGA
2004 - tray 20 x 14

Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Text: quantities are specified below. Table II. Tray Quantities by Package Type Device Package Type Number , 420 450 420 300 200 135 120 ­3­ a Table II. Tray Quantities by Package Type (continued , Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride , resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type Device Package , Quantities by Package Type (continued) Device Package Type Number of Leads Quantity per Tube


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PDF E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray
2001 - EIA and EIAJ standards 783

Abstract: EIA standards 783 eia783 EIA 783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B ti packing label JEDEC tray standard
Text: cover tape Termination End of the package pins Tray Primary container used for QFP/TQFP/ BGA , . Table 2. SLL Packages and Standard Quantities PACKAGE PINS QUANTITY PER TRAY MATRIX CONTAINER STANDARD QUANTITY PM PACKAGE TYPE 64 160 8 × 20 800 QFP PN 80 119 , 56 MicroStar Jr. BGA Jr 1.6 1.2 12 17.3 1.7 1.2 12 24 PMR 64 , PM ( 64 ) PK (3) KTE (3) KTG (5) KTP (2) MicroStar BGA GKE (96) GKF (114) MicroStar Jr


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PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 eia783 EIA 783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B ti packing label JEDEC tray standard
2004 - spansion part marking

Abstract: Spansion S29GL256N spansion top marking SPANSION s29al016d s29al016 Am29LV256MH113REI S29AL016D90TAI020 S29AL016D70BAI010 S29GL128N10FAI010 S29AL016D70TFI020
Text: (Varies by Package Type) [ BGA ] A = Standard Not Lead (Pb)-Free N = 110 nm, MirrorBitTM Technology , [Lead Frame] F = Standard Lead (Pb)-Free, Copper, Sn Package Type [Family] B = BGA [ BGA ] C = CSOP , . 3 BGA package marking omits leading "S29" and packing type designator from ordering part , 3. 2 TSOP package marking omits packing type designator from ordering part number. 3 BGA , designator from ordering part number. 3 BGA package marking omits leading "S29" and packing type


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PDF S29AL016D S29AL016M S29JL032H S29GL032M S29GL064M S29GL128N S29GL256N spansion part marking Spansion S29GL256N spansion top marking SPANSION s29al016d s29al016 Am29LV256MH113REI S29AL016D90TAI020 S29AL016D70BAI010 S29GL128N10FAI010 S29AL016D70TFI020
1999 - INTEL 28F640

Abstract: BGA PACKAGE TOP MARK intel 28F160C18 vf bga INTEL 28F640 application 298161 intel BGA PACKAGE TOP MARK 28F016B3 28F008B3 BGA package tray 64
Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 , .12 Very-Thin, Fine-Pitch, BGA Package (VF BGA ) Drawing and Dimensions, Very-Thin, Fine-Pitch, BGA Package (VF BGA ) Drawing and Dimensions, 28F320B3_C and 28F320C3 , . 3 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA ) Package Daisy Chain Schematics for GE28FSDCR46 . 4 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA ) Package Drawing and Dimensions for Daisy Chain


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PDF 12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 vf bga INTEL 28F640 application 298161 intel BGA PACKAGE TOP MARK 28F016B3 28F008B3 BGA package tray 64
1998 - LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram LGA 1151 PIN diagram IC107-26035-20-G IC107-3204-G REFLOW lga socket 1155 TB 2929 H alternative e p1 50171
Text: SKINNY DIP TCP PGA SHRINK-DIP BGA /LGA CSP Figure 1.1.1 Packaging Trend 2 PACKAGE , .) 80 60 Usage rate (%) 40 Surface mounting type package (SOP, QFP, SOJ, QFJ, BGA ) 20 , package body in four directions, and can be mounted flat. The standard lead pitch is 1.27 mm (50 mil). BGA , circuit board (PCB). Quad Flat J-Leaded Package Ball Grid Array/Fine Pitch BGA Fine Pitch Land , 64 73 88 133 177 209 240 257 301 365 400 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS OKI


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PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram LGA 1151 PIN diagram IC107-26035-20-G IC107-3204-G REFLOW lga socket 1155 TB 2929 H alternative e p1 50171
2000 - smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 BGA reflow guide P6K6 k5m6 Senju metal flux T5 K793 SMD CODE G7
Text: . Figure 1. Packaging Trends Package trend (customer requirement) QFP 0.5 mm pitch BGA (ball grid , Fine pitch BGA (0.5, 0.8, 1.0 mm ball pitch) QFP-0.5 BGA Package size QFP-0.4 CSP Bare , 's MicroStar BGA package . Figure 2. Structure of TI's MicroStar BGA Conforms to JEDEC Outlines: MO-192 and , . MicroStar BGA Package Assembly Flow Same as QFP assembly Die attach Wire bond Encap Non-Ag paste Short loop X'fer mode Figure 3. MicroStar BGA Package Assembly Issues Substrate ­


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PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 BGA reflow guide P6K6 k5m6 Senju metal flux T5 K793 SMD CODE G7
1997 - SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 LGA 1155 Socket PIN diagram smd marking m05 L QUAD Aluminum nitride pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: Shipment 6.2 Tube Dimensions 6.3 Tray Dimension Diagrams 6.4 Tape Dimension Sales Offices Information , Package 50 ­ BGA Ball Grid Array 1.5mm/1.27mm/ 1.0mm ­ DTP Dual Tape Carrier , To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods 2.1 Overview 2.2


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PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 LGA 1155 Socket PIN diagram smd marking m05 L QUAD Aluminum nitride pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
tray matrix bga

Abstract: tray datasheet bga BGA package tray JEDEC tray standard for PLCC CERAMIC PIN GRID ARRAY CPGA AMD PLCC JEDEC tray V Box codes
Text: Profile Quad Flat Package (LQFP) All leadcounts Standard: Tray (5 trays) \W or none required , Code Description BGA Wirebonded, die-up package ; solder ball terminals BGD Wirebonded , Product Carrier Options Package Codes Product Date Codes Packages and Packing Publication Revision A , Chapter 2 Package Design A 3/1/03 Chapter 3 Board Assembly A 3/1/03 Chapter 4 Package Materials A 3/1/03 Chapter 5 Package Characterization A 3/1/03 Chapter 6 Summary of


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1999 - PCB design for very fine pitch csp package

Abstract: Senju Senju metal solder paste Modified Coffin-Manson Equation Calculations 179GHH B12-246 37K-1 Semicon volume 1 N12114 senju solder bar
Text: packages are 64 - and 144-ball packages. Figure 2 shows the structure of TI's MicroStar BGA package , Package trend (customer requirement) QFP 0.5 mm pitch BGA (ball grid array) 1.27 mm ball pitch , , 1.0 mm ball pitch) QFP-0.5 BGA Package size QFP-0.4 CSP Bare chip (bump) Pin count , interconnect between the package substrate and the board on which the package is soldered. The MicroStar BGA , . MicroStar BGA Package Assembly Flow Same as QFP assembly Die attach Wire bond Encap Non-Ag


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PDF SSYZ015A PCB design for very fine pitch csp package Senju Senju metal solder paste Modified Coffin-Manson Equation Calculations 179GHH B12-246 37K-1 Semicon volume 1 N12114 senju solder bar
2005 - Not Available

Abstract: No abstract text available
Text: €¢ Networking/Telecom • DVD-RW FEATURES AND BENEFITS 15 12.5 0.5 • 48-pin TSOP Package • 56-pin TSOP Package • 48-ball Fine-pitch BGA Package • 64 -ball Fortified BGA Package • Standard and , Pb-Free PACKAGE TYPE T B F = TSOP Package = Fine-pitch BGA Package = Fortified BGA Package , numbers 3. BGA package marking omits leading “S29” and packing type designator from ordering number , Memory TM 64 Megabit (4 M x 16-Bit / 8 M x 8-Bit) Spansion™ Overview Spansion™, the Flash


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PDF S29GL064A 16-Bit ISO/TS16949 ISO9001 S29GL064A10FA1010 GL064A10FAI01. MBM29PL64LM MBM29PL65LM 1-866-SPANSION 3019A
1999 - strapack s-669

Abstract: strapack d-52 Sivaron S 669 strapack MIL-I-8835A CAMTEX camtex trays s-669 strapping machine PQFP 176 J-Lead PEAK TRAY bga
Text: cover tray ). Stack plastic quad flat pack (PQFP) and BGA trays no higher than 7 trays (i.e., 6 trays containing devices and 1 cover tray ). 7 AN 71: Guidelines for Handling J-Lead, QFP & BGA Devices , ) Package Package Dimensions (mm) Tray Capacity (Devices) Note (1) Peak Part Number (2 , ) Note (1) Package Dimensions (mm) Tray Capacity (Devices) Peak Part Number (2) Altera , . The current tray (Peak part number NH-1010-2.0-0616-kn) for this package is compatible with the old


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2000 - EIA and EIAJ standards 783

Abstract: JEDEC tray standard dimension EIA standards 783 EIA-481-x abstract for water level indicator JEDEC Matrix Tray outlines EIA 783 QFP Shipping Trays EIA-783 EIA 481 TSSOP
Text: the package pins Tray Primary container used for QFP/TQFP/ BGA devices, e.g., standard JEDEC outlines used as defined by package outlines Tray box Intermediate container for stacked and bound , quantities. Table 2. SLL Packages and Standard Quantities PACKAGE PINS QUANTITY PER TRAY MATRIX CONTAINER STANDARD QUANTITY PM PACKAGE TYPE 64 160 8 × 20 800 QFP PN 80 119 , ( 64 ) TVSOP DGV (14/16) DGV (20/24/48/56) DBB (80) PowerFlex MicroStar BGA PH (80


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PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension EIA standards 783 EIA-481-x abstract for water level indicator JEDEC Matrix Tray outlines EIA 783 QFP Shipping Trays EIA-783 EIA 481 TSSOP
footprint jedec MS-026 TQFP

Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 TQFP 44 footprint jedec MS-026 LQFP 64 pin MS-026 BED AMD Package moisture BGA package tray 40 x 40 MO-069 MS-026
Text: BGA . The PBGA package consists of a substrate made of a high-temperature epoxy laminate. It is , Package Design Package Attributes: Plastic Ball Grid Array Package Code/Ballcount BGT 256 BGA , : Plastic Ball Grid Array (continued) Package Code/Ballcount BGA 388 BGD 420 BGA 492 BGA 569 , of this package is similar to a BGA except that a round post, instead of a ball, is used for the , an alternative for the ceramic BGA package for applications requiring a larger number of


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BGA package tray 40 x 40

Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray TRAY JEDEC BGA 5 6 BGA-544P-M04 tray datasheet bga SDP91-PS,PBGA,496P bga tray 150 tray bga BGA-676P-M07
Text: PKG code pcs/ tray pcs/inner box pcs/outer box BGA -484P-M07 40 400 1600 1600 BGA -484P-M09 40 400 1600 400 1600 BGA -496P-M02 40 400 1600 40 400 1600 BGA -543P-M01 40 400 1600 BGA -320P-M06 40 400 1600 BGA -544P-M01 40 , -480P-M14 40 400 1600 pcs/ tray pcs/inner box pcs/outer box BGA -256P-M20 40 400 1600 , FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256


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PDF BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray TRAY JEDEC BGA 5 6 BGA-544P-M04 tray datasheet bga SDP91-PS,PBGA,496P bga tray 150 tray bga BGA-676P-M07
2012 - JEDEC qfn tray

Abstract: JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
Text: . 7 Marketing Outline, 64 -Lead PDIP , . 17 Marketing Outline, 64 -Lead LQFP. 18 Marketing Outline, 64 -Lead LQFP , . 28 Marketing Outline, 144-Lead BGA , . 37 Package Migration


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PDF PS007230-0812 2500/BAG 1600/BAG 900/BAG 600/BAG 2000/REEL 1500/REEL JEDEC qfn tray JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
2005 - JEDEC Matrix Tray outlines

Abstract: ti packing label dck3 EIA-468 label location QFP Shipping Trays tray bga 64 dbv4 EIA standards 783 EIA-481-x EIA-783
Text: cover tape Termination End of the package pins Tray Primary container used for QFP/TQFP/ BGA devices, e.g., standard JEDEC outlines used as defined by package outlines Tray box Intermediate , . Table 2. SLL Packages and Standard Quantities PACKAGE PINS QUANTITY PER TRAY MATRIX CONTAINER STANDARD QUANTITY PM PACKAGE TYPE 64 160 8 × 20 800 PN QFP 80 119 , . . . . . . . . . . . . . . . . 5 Tray - Primary Component Container . . . . . . . . . . . . . . .


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PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 EIA-468 label location QFP Shipping Trays tray bga 64 dbv4 EIA standards 783 EIA-481-x EIA-783
Supplyframe Tracking Pixel