The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM4601AEY#PBF Linear Technology LTM4601A/LTM4601A-1 - 12A µModule (Power Module) Regulators with PLL, Output Tracking and Margining; Package: BGA; Pins: 133; Temperature Range: -40°C to 85°C
LTM4601HVIY#PBF Linear Technology LTM4601HV - 12A 28VIN DC/DC µModule (Power Module) Regulator with PLL, Output Tracking and Margining; Package: BGA; Pins: 118; Temperature Range: -40°C to 85°C
LTM4601AHVEY#PBF Linear Technology LTM4601AHV - 12A, 28VIN DC/DC µModule (Power Module) Regulator with PLL, Output Tracking and Margining; Package: BGA; Pins: 133; Temperature Range: -40°C to 85°C
LTM2883CY-5S#PBF Linear Technology LTM2883 - SPI/Digital or I2C µModule Isolator with Adjustable ±12.5V and 5V Regulated Power; Package: BGA; Pins: 32; Temperature Range: 0°C to 70°C
LTM2883CY-5I#PBF Linear Technology LTM2883 - SPI/Digital or I2C µModule Isolator with Adjustable ±12.5V and 5V Regulated Power; Package: BGA; Pins: 32; Temperature Range: 0°C to 70°C
LTM4601HVEY#PBF Linear Technology LTM4601HV - 12A 28VIN DC/DC µModule (Power Module) Regulator with PLL, Output Tracking and Margining; Package: BGA; Pins: 118; Temperature Range: -40°C to 85°C

BGA and QFP Package mounting Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
35 x 35 PBGA, 580 100 balls

Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
Text: single-layer model of this type of BGA package is of the face-up mounting type and has excellent cost , BGA 51 (million units/month) Mpcs/M QFP 39 the interposer, and these balls interface a , shows a comparison example between a QFP and BGA . As shown, the BGA is 20% smaller than the QFP but , 2.0 Pin Pitch (mm) Peripheral Pin Mounting 1.5 Area Pin Mounting BGA SOP 1.0 QFP CSP , package . 2. Two types of BGA packages Figure 4 shows the relation between the number of pins and body


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1999 - strapack s-669

Abstract: strapack d-52 Sivaron S 669 strapack MIL-I-8835A CAMTEX camtex trays s-669 strapping machine PQFP 176 J-Lead PEAK TRAY bga
Text: J-lead, quad flat pack ( QFP ), and ball-grid array ( BGA )-including FineLine BGATM-packaging are now , , QFP , and BGA packages and ensure easier soldering. This application note discusses the following , Devices Handling J-Lead and QFP Devices Transferring devices between tubes Transferring QFP and BGA devices without carriers between trays Dry-packing J-lead, QFP , and BGA devices Shipping J-lead, QFP , and BGA devices in boxes To protect device leads and ensure proper operation, J-lead and QFP


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2001 - land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin qfp 64 0.4 mm pitch land pattern oki naming ic packages TSOP 54 land pattern TSOP 66 pin Package thermal resistance land pattern tsop 66 ED730
Text: (DIP, ZIP, SIP, PGA, etc.) 80 Usage rate (%) 60 Surface mounting type package (SOP, QFP , , material, and mounting methods. QFP Quad Lead Rows TQFP/LQFP Flat SOP Dual Lead Rows Surface , ) Matrix Plastic BGA /FBGA FLGA W-CSP Standard Throughhole Mounting Type Package Type , . PACKAGE CLASSIFICATIONS Package Type and Characteristics Through-hole mounting type package Type , FBGA FLGA BGA QFJ SOJ TQFP LQFP QFP TSOP(2) TSOP(1) SSOP SOP Package


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BGA and QFP Package mounting

Abstract: MCP Technology Trend SC47D tfBGA PACKAGE thermal resistance EE13 jwg2 EIA and EIAJ standards EE13 JWG Packaging trends BGA and QFP Package C7021
Text: TSOP Higher pin count ZIP SSOP SVP Area array package QFP MCM TFBGA (CSP) BGA PGA TCP 1-3 TQFP TBGA Bare Chip HDD System Configuration and Package Evolution , LCD driver TSOP(II) TCP Package Mounting Area vs. Pin Count Package mounting area (mm2) QFP family 1000 BGA family 100 TFBGA (CSP) 20 1-6 SOP family 10 100 Pin count 1000 Package Mounting Height vs. Pin Count Maximum mounting height (mm) 4.0 QFP family


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1999 - LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 smd code 38P YAMAICHI ic234 fpq-144-0.5-03 smd p08
Text: , forms, and structure, and also discusses future trends in packages. Chapter 2: Package Mounting , arranged in either DIP form or QFP form. This type of package is used for program evaluation and system , the mounting surface and the bottom of the package Height of body A2 Height (thickness) of , package parallel to the mounting surface and excluding the pins; also include resin burrs Package , top of the package Distance between the mounting surface and the bottom of the package Thickness of


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2011 - daewon tray

Abstract: Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
Text: Guidelines for Handling J-Lead, QFP , BGA , FBGA, and Lidless FBGA Devices AN , that use surface-mount J-Lead, QFP , BGA , FBGA, and lidless BGA are now common on boards because they , Between Tubes” on page 13 ■“Transferring QFP , BGA , FBGA, and Lidless FBGA Devices Without Carriers Between Trays” on page 13 ■“Dry Packing J-Lead, QFP , BGA , FBGA, and Lidless BGA Devices” on page 14 ■“Shipping J-Lead, QFP , BGA , FBGA, and Lidless FBGA Devices in Boxes” on


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PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
1994 - GE4F

Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R smd TRANSISTOR code YW UPC451G2 UPD74HC00 TRANSISTOR SMD MARKING CODE 352 UPD7514
Text: expected that surface mount packages, such as QFP and SOP, which are more suitable for surface mounting , 1-2. VLSI Package Trend Smaller size and thinner package Area Array Mounting T-BGA PGA P-BGA , Calculation of QFP Mounting Pad Unit: mm Package No. of pins 40 Code No. P40G-80-F-2 P44G-80-22-2 P44G , mounting pads of this package , therefore, the body dimensions and pin dimensions (pin pull-out length: L2 , 1-5b. Example of Calculation of QFP Fine-Pitch Mounting Pad Dimensions Unit: mm Package No. of pins 48


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PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R smd TRANSISTOR code YW UPC451G2 UPD74HC00 TRANSISTOR SMD MARKING CODE 352 UPD7514
1994 - marking code SMD Transistor 2ak

Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 Ultrasonic humidifier circuit koki solder paste 1.6/SmD TRANSISTOR av
Text: expected that surface mount packages, such as QFP and SOP, which are more suitable for surface mounting , Package Trend Smaller size and thinner package Area Array Mounting T-BGA Higher pin counts PGA , width (E). In designing the mounting pads of this package , therefore, the body width (E) and pin , SEMICONDUCTOR DEVICES (SMDs) Table 1-5a. Example of Calculation of QFP Mounting Pad Unit: mm Package No , designing the mounting pads of this package , therefore, the body dimensions and pin dimensions (pin


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PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 Ultrasonic humidifier circuit koki solder paste 1.6/SmD TRANSISTOR av
QFP lead pitch 0.3mm

Abstract: BGA and QFP Package mounting QFP 0.3mm pitch 0.3mm pitch BGA particle bga socket material for chip resistors qfp 100 SOCKET BGA and QFP Package 0.3mm pitch package bga
Text: Capabilities · 0.3mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA , QFN, QFP , SOIC · 3000 pin count · , 50x50mm device · BGA , LGA, QFN, QFP , SOIC · 5000 pin count · Heat sink options · Easy chip replacement , 2x3mm to 50x50mm device · BGA , LGA, QFN, QFP , SOIC · 5000 pin count · Heat sink options · Easy chip , BGA , QFN, QFP , SOIC BGA , LGA, QFN, QFP , SOIC BGA , QFN, LGA LGA, QFN BGA , LGA, QFN, QFP , ) Capabilities · 0.5mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA , LGA, QFN, QFP , SOIC · 2000 pin count


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PDF Sep2009 ISO9001 50x50mm QFP lead pitch 0.3mm BGA and QFP Package mounting QFP 0.3mm pitch 0.3mm pitch BGA particle bga socket material for chip resistors qfp 100 SOCKET BGA and QFP Package 0.3mm pitch package bga
TMS87C510

Abstract: TL16CFM405 sn10448 TL16CFM405PH tl16cfm504pjm tms87c110 tl16cfm TCM78808FN TL16CRK600 tms29f256fm
Text: processing (peak package body temp. 220 °C) must be baked before mounting for: a. 192 hours at 40 °C + 5 °C , DGG DL10 PAH RC DGG PAG/PM DBB PH PN PGY Package Level TQFP QFP TQFP QFP QFP , PBE PCD PCE PCY PCZ Package Level BGA BGA BGA BGA BGA BGA * BGA * BGA * BGA-D CBGA , 48 hours, regardless of its classification. The new labels reflect the actual factory floor life and , classification levels are as follows: Level Floor Life at 30°C and 60%RH 2 1 year 3 1 week 4 72 hours 5


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PDF EIA/JEP113-A EIA/JEP113-A. TMS87C510 TL16CFM405 sn10448 TL16CFM405PH tl16cfm504pjm tms87c110 tl16cfm TCM78808FN TL16CRK600 tms29f256fm
CERAMIC PIN GRID ARRAY wire lead frame

Abstract: BGA and QFP Package TO metal package aluminum kovar 12 CERAMIC LEADLESS CHIP CARRIER LCC PGA wire bonding ceramic pin grid array package lead finish ceramic pin grid array package plating qfp 32 land pattern land pattern for TSOP TSOP 54 Package
Text: . The BGA package is suitable for high density mounting and includes the following types: BGA FBGA , package Features Lead pitch TSOP TQFP These packages are thinner versions of the SOP and QFP , Lineup The packages are classified as follows, according to form, material, and the mounting methods , /1.00/1.27 SON Small Outline Non-Leaded Package QFP Quad Flat Package (straight lead) Quad , Quad Flat L-Leaded Package TQFP Thin Quad Flat L-Leaded Package HQFP QFP with Heat Sink


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PDF DB81-10002-2E CERAMIC PIN GRID ARRAY wire lead frame BGA and QFP Package TO metal package aluminum kovar 12 CERAMIC LEADLESS CHIP CARRIER LCC PGA wire bonding ceramic pin grid array package lead finish ceramic pin grid array package plating qfp 32 land pattern land pattern for TSOP TSOP 54 Package
1999 - FBGA-484

Abstract: BGA313 reflow soldering profile BGA
Text: Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to , information about prototype socket pad layout and solder mask openings in the QFP packages. If the mounting , footprint as the BGA package , and the Adapter/Socket Module has the same overall size as the BGA package . - PCB layout is the same for the BGA package and the surface mount socket. Figure 2 BGAPackage , the BGA adapter module that has already been soldered to the package and plug it into the surface


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1994 - M9627

Abstract: uPC451g PR-53365 SMD 6PIN IC MARKING CODE NIHON SMD MARKING codes sealed relay ge mil 7451 tanaka AL wire UPD65013 GE4F smd code marking NEC g
Text: Edition Page Chapter 1 Revised points (1) BGA package mounting pad dimension examples are added , package Area Array Mounting T-BGA Higher pin counts PGA QFP c gi Lo Peripheral Pin , . (d) Mounting pad of QFP The nominal dimensions of QFP (quad flat package ) are determined by the , mm. In designing the mounting pads of this package , therefore, the body dimensions and pin , Calculation of QFP Mounting Pad Unit: mm Package No. of pins 40 Code No. Body width E P40G


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PDF C10535EJ8V0IF00 M9627 uPC451g PR-53365 SMD 6PIN IC MARKING CODE NIHON SMD MARKING codes sealed relay ge mil 7451 tanaka AL wire UPD65013 GE4F smd code marking NEC g
Fujitsu

Abstract: mb29LV160 SnAgCu QFP208 QFP208 SnPb fujitsu reflow profile solder ball 0.3mm profile QFP lead pitch 0.3mm QFP package weight QFP-208
Text: © Fujitsu Limited 8 Pb-Free Plan & Status Package CY2002 CY2001 CY2003 QFP LQFP QFP , Limited 9 Thermal Performance Grouping Group BGA QFP / SOP A:260Cmax SCSP Small-FBGA , Lead-free) HQFP FLGA EBGA TBGA SMCP* Item Package Material Method BGA Substrate Material , Terminal QFP Solder Paste Sn-Pb (PWB) BGA Terminal (PWB) Fujitsu LSI PACKAGING DIVISION , 2. Terminal materials BGA = Sn-Ag-Cu (Ball) QFP = Sn-Bi (Plating) 3. Discrimination of products


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2002 - LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram Wells-CTI 36 lead Flat Pack 216-LQFP smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 Enplas drawings BGA136
Text: , and 70 mm. 0.50 to 0.15mm BGA This package has a grid of equally spaced leads (solder ball) on the underside of the package . The BGA package is suitable for high density mounting and includes , of the package Standoff height A1 Distance between the mounting surface and the bottom of , dimension of the body of the package parallel to the mounting surface and excluding the pins; also include , package format has changed from DIP to types such as SOP QFP and PGA. In addition, a package is now


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1998 - 35 x 35 PBGA, 580 100 balls

Abstract: HG7900 Enplas drawings BGA Ball Crack PEAK TRAY bga NEC stacked CSP 2000 BGA-35 153pin Lead Free reflow soldering profile BGA sumitomo 3m
Text: frequency and pin counts. Also, BGA has a broader terminal pitch than the same pin count QFP for easier mounting onto to PCB. Q1: How do the size, weight and terminal pitch of a BGA compared to those of a QFP , depends on the package size, type and reflow system. For simultaneous reflow of BGA and QFP , it is , temperature of BGA 's solder balls with respect to that of the BGA package surface. PCB Layers and Package Temperature PKG: 1 Metal TBGA 40 × 40 BGA : Package Surface QFP : 28 × 28 Reflow: IR PCB: FR-4,1.6mm Solder


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PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls HG7900 Enplas drawings BGA Ball Crack PEAK TRAY bga NEC stacked CSP 2000 BGA-35 153pin Lead Free reflow soldering profile BGA sumitomo 3m
1998 - 116-Pin

Abstract: semiconductor cross index Lead Free reflow soldering profile BGA PBGA 256 reflow profile tray qfp 14x14 1.4 tray bga 10x10 JIS-Z0202 224-pin plastic ball grid array 0.8mm reflow soldering profile BGA pcb warpage after reflow
Text: condition the mixed soldering of FPBGA and QFP BGA QFP PKG BGA PKG PCB 235°C 250 QFP , AI Advantages FPBGATM and D2BGATM are smaller and lighter than currently prevalent QFP packages , !! Q1: How much smaller and lighter is the CSP compared to the QFP ? In case of FPBGA, 0.8mm pitch , shows the daisychain layouts of the package and the PCB Package layout and PCB layout- top view , and mixed soldering condition. In concurrent soldering of FPBGATM and D2BGATM with 0.5 mm QFP , the


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PDF C13185EJ1V0PF00 116-Pin semiconductor cross index Lead Free reflow soldering profile BGA PBGA 256 reflow profile tray qfp 14x14 1.4 tray bga 10x10 JIS-Z0202 224-pin plastic ball grid array 0.8mm reflow soldering profile BGA pcb warpage after reflow
2015 - Adapters

Abstract: Logic Analyzer Adapters Receptacles Prototyping Adapters Turn-Key Giga-snaP™ BGA SMT Adapters Product Presentations Probing and Analysis Adapters GHz Elastomer Sockets BGA Sockets
Text: Ironwood Socket Mounting Options For target boards with BGA pads and Ironwood socket mounting holes - , to 1.27mm LGA, BGA , QFN, QFP , SOIC and other packages. Contact technology has 3 part system which , package and package code specifications. • BGA - Male Interface These BGA surface mount feet are , converters, like the BGA to QFP converter shown below, are designed with space efficiency and a reduced , :// and then select GHz BGA Sockets. When a product line is


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PDF 75GHz 50-80grams Adapters Logic Analyzer Adapters Receptacles Prototyping Adapters Turn-Key Giga-snaP™ BGA SMT Adapters Product Presentations Probing and Analysis Adapters GHz Elastomer Sockets BGA Sockets
BGA and QFP Package mounting

Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Text: thin SOPs with a package L-Leaded mounting height of less than 1.27 mm, and are suited to ultra-thin , Grid Array BGA packages are surface mounting package with solder ball arrays on backside surface of , 1. PACKAGE CLASSIFICATIONS 2) Surface mounting type package Type Package Types , from each package body in two directions, and can be mounted flat. The standard lead pitch is 1.27 mm , Heat Sink Quad Flat L-Leaded Package with Heat Spreader QFP packages are characterized by


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1998 - MSM5238

Abstract: LCD OKI 19 oki lcd driver QFP44-P-910-0 MSM5238GS-2K MSM5238GS-K MSM5238GS-L2 32-bit shift register
Text: for Mounting the Surface Mount Type Package The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are , plating 5 mm or more 0.35 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP , TSOP , mm or more 0.35 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP , TSOP, SOJ , 's responsible sales person for the product name, package name, pin number, package code and desired mounting , for the product name, package name, pin number, package code and desired mounting conditions (reflow


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PDF E2B0027-27-Y2 MSM5238 32-DOT MSM5238 32-bit QFP44-P-910-0 LCD OKI 19 oki lcd driver MSM5238GS-2K MSM5238GS-K MSM5238GS-L2 32-bit shift register
pin configuration of lcd panel

Abstract: DO40 MSM5238 MSM5839B
Text: the Surface Mount Type Package The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount , Package The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very , , package name, pin number, package code and desired mounting conditions (reflow method, temperature and , ) 0.43 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and


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PDF E2B0022-27-Y2 MSM5839B MSM5839B 20-bit 40-bit QFP56-P-910-0 65-2K pin configuration of lcd panel DO40 MSM5238
MSM5238

Abstract: MSM5238GS-2K MSM5238GS-K MSM5238GS-L2 QFP44-P-910-0 32-bit shift register
Text: Surface Mount Type Package The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type , weight (g) 0.35 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP , TSOP, SOJ, QFJ , 's responsible sales person for the product name, package name, pin number, package code and desired mounting , The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very , name, pin number, package code and desired mounting conditions (reflow method, temperature and times).


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PDF E2B0027-27-Y2 MSM5238 32-DOT MSM5238 32-bit MSM5238s MSM5238GS-2K MSM5238GS-K MSM5238GS-L2 QFP44-P-910-0 32-bit shift register
1998 - MSM5052

Abstract: QFP80-P-1420-0 thermistor 7 rom
Text: Mounting the Surface Mount Type Package The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount , Type Package The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which , 0.36 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP , TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting , 's responsible sales person for the product name, package name, pin number, package code and desired mounting


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PDF E2E0008-38-94 MSM5052 MSM5052 QFP80-P-1420-0 80-BK thermistor 7 rom
2004 - 1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package QFN 64 8x8 footprint MO-235 FOOTPRINT BGA and QFP Package mounting HLQFP1414-100 "General Catalog" transistor sc100 LFPAK footprint
Text: densities and improved reliability has been increasing. By utilizing Package Mounting Height vs. Pin , Mounting Height (mm) QFP HQFP Package Mounting Height (mm) Quad Flat Package Quad Flat , Count 1000 BGA family LQFP family 2.0 LQFP family LQFP Package Mounting Area (mm2) Package Mounting Height (mm) 3.0 TQFP family BGA family 100 LQFP QFN family TQFP TQFP , Package Mounting Height vs. Pin Count 1000 BGA family LQFP family 2.0 LQFP family LQFP


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PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package QFN 64 8x8 footprint MO-235 FOOTPRINT BGA and QFP Package mounting HLQFP1414-100 "General Catalog" transistor sc100 LFPAK footprint
1997 - SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 LGA 1155 Socket PIN diagram smd marking m05 L QUAD Aluminum nitride pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: package and body. Excellent lead precision is possible by mounting a holder. 0.30mm *: Package name , the mounting surface and the bottom of the package Height of body A2 Height (thickness) of , package parallel to the mounting surface and excluding the pins; also include resin burrs Package , top of the package Distance between the mounting surface and the bottom of the package Thickness of , body of the package parallel to the mounting surface and excluding the pins; also include resin burrs


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PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 LGA 1155 Socket PIN diagram smd marking m05 L QUAD Aluminum nitride pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Supplyframe Tracking Pixel