The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial

BGA OUTLINE DRAWING Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1998 - 2032VE

Abstract: 2128VE BGA OUTLINE DRAWING PB1107 Lattice Package Dia
Text: Side View Coplanarity not to exceed 0.12mm 49-Ball Chip Array BGA Outline Drawing 17.00 NOM , exceed 0.15mm 208-Ball Fine Pitch BGA Outline Drawing Lattice Semiconductor Home Page: http , counts from 144 to over 500. Package outline drawings for the 49-Ball Chip Array BGA and 208-Ball Fine , Pitch BGA Packages Introduction Lattice Semiconductor has announced the availability of advanced Chip Array and Fine Pitch BGA (ball grid array) packages for its ISP logic devices. The first Lattice


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PDF PB1107 2000VE 2032VE 2128VE 208-Ball 1-888-ISP-PLDS BGA OUTLINE DRAWING PB1107 Lattice Package Dia
2001 - rise mp6

Abstract: MARKING CODE AA4 BGA 0.56mm P55C VM86 intel 8086 Arithmetic and Logic Unit -ALU BGA OUTLINE DRAWING D44 MARKING CODE
Text: .36 FIGURE 16. BGA OUTLINE DRAWING .37 FIGURE 16. BGA OUTLINE DRAWING ( FIGURE 16. BGA OUTLINE DRAWING (CONTINUED , .37 4.1 387 BALL BGA MECHANICAL DRAWING , Technology with 3.3V I/O and 2.0V Core · Low Profile 387-Terminal BGA Package 2 TM All rights


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PDF MKTD6510 x86-compatible mP6-500MIPS: mP6-600MIPS: rise mp6 MARKING CODE AA4 BGA 0.56mm P55C VM86 intel 8086 Arithmetic and Logic Unit -ALU BGA OUTLINE DRAWING D44 MARKING CODE
2002 - BU-6474XB

Abstract: BU-64840R3 BU-64860B3
Text: Corporation Make Sure the next Card you purchase has. Figure 1: Micro-ACE TE BGA Outline Drawing Figure 2: Micro-ACE BGA Outline Drawing BOTTOM VIEW BOTTOM VIEW .815 [20.70] (MAX) SQUARE , are the world's smallest extended temperature range MIL-STD-1553 terminals. With a BGA package body , Micro-ACE verison is available in a 128-ball BGA package, rated for -40°C to +85°C operation. The , -Ball Plastic BGA Single 3.3V supply required for 3.3V transceiver versions 5 Volt-Tolerant Logic Signals (PCI


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PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-6474XB BU-64840R3 BU-64860B3
2002 - BU-61860B

Abstract: bu61740b BU-61740B DDC total ace 1553 chip pcb footprint BU-BU-64863B 61840B 3E02 324 bga thermal BU-64863B BU-61840B
Text: Device Corporation Make Sure the next Card you purchase has. Figure 1: Micro-Ace TE BGA Outline Drawing BOTTOM VIEW .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) Figure 2: Micro-Ace BGA Outline Drawing BOTTOM VIEW .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) .065 [1.65] (TYP) 18 17 16 15 14 , MIL-STD-1553 terminals. With a BGA package body of 0.64in², the Micro-ACE TE and PCI Micro-ACE TE are , for mixed 3.3V/5V operation. The Micro-ACE version is available in a 128-ball BGA package, rated for


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PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-61860B bu61740b BU-61740B DDC total ace 1553 chip pcb footprint BU-BU-64863B 61840B 3E02 324 bga thermal BU-64863B BU-61840B
2002 - STANAG 3838

Abstract: BU-BU-64863B BU-64840R3 BU-61860B3-601
Text: Make Sure the next Card you purchase has. Figure 1: Micro-ACE TE BGA Outline Drawing BOTTOM VIEW .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) Figure 2: Micro-ACE BGA Outline Drawing BOTTOM VIEW , MIL-STD-1553 terminals. With a BGA package body of 0.64in², the Micro-ACE TE and PCI Micro-ACE TE are , for mixed 3.3V/5V operation. The Micro-ACE version is available in a 128-ball BGA package, rated for , 324-Ball Plastic BGA Single 3.3V supply required for 3.3V transceiver versions 5 Volt-Tolerant Logic


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PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 STANAG 3838 BU-BU-64863B BU-64840R3 BU-61860B3-601
2002 - STANAG 3838

Abstract: BU-61740B3
Text: µ-Ace BGA Outline Drawing Figure 1 0.140 [3.58] (MAX) .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP , Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE , inches DESCRIPTION The µ-ACE (Micro-ACE) plastic BGA is the industry's smallest MIL-STD-1553 terminal , World's Smallest MIL-STD-1553 Terminal 128-Ball Plastic BGA 0.815 X 0.815 inch Maximum Footprint Size , CHARACTERISTICS Size 128-Ball BGA Package 16.0 12.0 10.0 20.0 MHz MHz MHz MHz 120 225 330 540 40 mA mA


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PDF BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 STANAG 3838 BU-61740B3
2005 - bc 352 b

Abstract: BU-61860 BU-61740B3
Text: Corporation µ-Ace BGA Outline Drawing Figure 1 0.120 0.140 (3.05) [3.58] (MAX) .815 [20.70] (MAX , FEATURES Smallest Complete 1553 Terminal 128-Ball Plastic BGA Package 0.120 inch Max Height Enhanced , inches DESCRIPTION The µ-ACE (Micro-ACE) plastic BGA is the industry's smallest complete MIL-STD , BOTTOM VIEW Smallest Complete MIL-STD-1553 Terminal 128-Ball Plastic BGA 0.815 X 0.815 inch Maximum , CHARACTERISTICS Size 128-Ball BGA Package 16.0 12.0 10.0 20.0 MHz MHz MHz MHz 66 174 282 390 25 120


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PDF BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 bc 352 b BU-61860 BU-61740B3
2002 - BU6184

Abstract: BU-6184 BU-61840B3 BU-6186 vram 64k
Text: µ-Ace BGA Outline Drawing Figure 1 0.140 [3.58] (MAX) .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP , Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE , inches DESCRIPTION The µ-ACE (Micro-ACE) plastic BGA is the industry's smallest MIL-STD-1553 terminal , World's Smallest MIL-STD-1553 Terminal 128-Ball Plastic BGA 0.815 X 0.815 inch Maximum Footprint Size , CHARACTERISTICS Size 128-Ball BGA Package 16.0 12.0 10.0 20.0 MHz MHz MHz MHz 120 225 330 540 40 mA mA


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PDF BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 BU6184 BU-6184 BU-61840B3 BU-6186 vram 64k
2008 - MN-6186X-001

Abstract: BU-69092 BU-64843T BU648 BU-648 MN-69092SX-002 BU-65863 DS-BU-64843T STANAG 3838 MIL-STD-1553 ACE manual
Text: BGA Outline Drawing *A 12 EQ. SP. @ 0.0394 (1.00) = .473 (12) (TOL NONCUM) (TYP) 24 23 22 21 20 19 , plastic BGA package with direct and/or transformer coupled 1553 connections inside. Key Features · 1 , Small Package: - 312 Ball BGA (1.1 in. x 0.6 in.) (27.9 mm x 15.2 mm) - 0.185" (4.7 mm) Max Height · , 13 matrix) BGA package, and is rated for -40°C to +100°C operation. The required isolation transformers (with "Transformer Coupled" output ratios) are integrated within the plastic BGA package, and the


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PDF MIL-STD-1553 MIL-STD-1760 AS9100 A5976 PB-BU-64843T-7 MN-6186X-001 BU-69092 BU-64843T BU648 BU-648 MN-69092SX-002 BU-65863 DS-BU-64843T STANAG 3838 MIL-STD-1553 ACE manual
2002 - BU-64843B8

Abstract: BU-64863B8-E02 BU-64860B3-E02 BU-65863B8-E02 BU-64840B3-E02 BU-64840B3 BU-65864B3-E02 BU-64843B8-E02 BU-648 BU-65863B8-E
Text: µ-Ace TE BGA Outline Drawing Figure 1 .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) 0.015 [0.38] (REF , Range: -40°C to +100°C · Thermally Enhanced (TE) BGA package · Options for 3.3 volt only, 5.0 volt only , -1553 terminals. With a BGA package body of 0.64in2, the Micro-ACE TE and PCI Micro-ACE TE are ideal for extended , Die (0JB,) Note 3 324 Ball BGA Operating Thermal Balls Temperature -40 Operating Junction Temperature , Body Size 324 ball BGA 15 +100 +150 +150 +300 °C/W °C °C °C °C 0.18 0.31 0.71 1.08 1.83 W W


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PDF BU-6484XB 6486XB 6584XB 6586XB 553A/B A5976 1-800-DDC-5757 BU-64843B8 BU-64863B8-E02 BU-64860B3-E02 BU-65863B8-E02 BU-64840B3-E02 BU-64840B3 BU-65864B3-E02 BU-64843B8-E02 BU-648 BU-65863B8-E
2000 - 639X

Abstract: LGA 1150
Text: hole. Figure 4. Carrier Tape Outline for BGA (Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm , 5. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA ) 8 x 9 mm Ko D BALL "A1" Po , pocket, not pocket hole. Figure 6. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA ) 7 x 12 , Outline for µBGA (Micro Ball Grid Array) and TFBGA (Thin Fine Pitch BGA ) 6.39 x 6.37 mm Po Ko D , (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5


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PDF 330mm 150mm 639X LGA 1150
2000 - Not Available

Abstract: No abstract text available
Text: Outline for BGA (Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm Ko D BALL "A1" REFERENCE , 5. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA ) 8 x 9 mm Ko D BALL "A1" Po , pocket, not pocket hole. Figure 6. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA ) 7 x 12 , (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , Ko D1 P USER DIRECTION OF FEED AI00652 Drawing is not to scale. Table 3. Carrier Tape


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PDF 330mm
2000 - LGA 1150

Abstract: No abstract text available
Text: measured as true position of pocket, not pocket hole. Figure 4. Carrier Tape Outline for BGA (Ball Grid , Outline for LFBGA (Low Profile Fine Pitch BGA ) 8 x 9 mm Ko D BALL "A1" Po REFERENCE T E , pocket, not pocket hole. Figure 6. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA ) 7 x 12 , (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , AI00652 Drawing is not to scale. Table 3. Carrier Tape Constant Dimensions Tape Size Ao, Bo, Ko


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PDF 330mm LGA 1150
2007 - SG-BGA-7090

Abstract: No abstract text available
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB , Assembled 8.0mm + IC thickness 6 2 Epoxy Customer's BGA IC Side View (Section AA) 5 15.2mm Customer's Target PCB Scale: - SG-BGA-7090 Drawing Status: Released © 2007 IRONWOOD , www.ironwoodelectronics.com Drawing : J. Glab Date: 04/30/07 File: SG-BGA-7090 Dwg Modified: Rev: B All , notice. PAGE 1 OF 4 Recommended PCB Layout Top View +0.03mm - 0.08mm socket base outline


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PDF 125mm 363mm. DP110 SG-BGA-7090
2000 - handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 stencil tension LR-735 handbook philips ic26
Text: standard machines or materials. Philips Semiconductors offers several (LF) BGA outline versions with , specifications of, for example, the BGA substrates can change over time. 1.1 OUTLINE VERSIONS This , drawing in Data Handbook IC26: Integrated Circuit Packages. Table 1 PACKAGE NAME PHILIPS OUTLINE CODE , OUTLINE DIMENSIONS BGA256 SOT466-1 27 × 27 × 1.75 12 Philips Semiconductors BGA , APPLICATION INFORMATION AN01026 (LF) BGA APPLICATION NOTE ATO INNOVATION, PHILIPS


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PDF AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 stencil tension LR-735 handbook philips ic26
2007 - SG-BGA-6236

Abstract: No abstract text available
Text: Customer's BGA IC Side View (Section AA) 5 15.2mm SG-BGA-6236 Drawing © 2007 IRONWOOD , GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB , www.ironwoodelectronics.com Customer's Target PCB Status: Released Scale: - Rev: A Drawing : J. Glab Date: 09 , socket base outline Recommended PCB Layout Top View 15.19mm 12.7mm Ø 0.43mm (x104) +0.03mm - 0.08mm socket base outline 15.19mm 12mm 0.8mm typ. 1.27mm typ. Target PCB


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PDF 125mm DP110 SG-BGA-6236
97Pb

Abstract: 90Pb 10Sn solder paste BGA OUTLINE DRAWING ceramic rework pcb warpage in ipc standard fine BGA thermal profile bga rework BGA Solder Ball collapse BGA PROFILING CBGA motorola
Text: Outline for Discussion · · · · · · Why BGA ? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability 2 Why BGA , 483 Pin CBGAs 10 Motorola 119 Pin, 14x22 mm CBGA Case Outline Drawing Note: This is an uncontrolled copy 11 Motorola 360 Pin, 25 mm CBGA Case Outline Drawing Note: This is an uncontrolled copy 12 Motorola 483 Pin, 29 mm CBGA Case Outline Drawing Note: This is an uncontrolled copy


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PDF 25x25x1 97Pb 90Pb 10Sn solder paste BGA OUTLINE DRAWING ceramic rework pcb warpage in ipc standard fine BGA thermal profile bga rework BGA Solder Ball collapse BGA PROFILING CBGA motorola
ceramic rework

Abstract: BGA Solder Ball collapse CCGA 304-pin ltcc 90Pb 10Sn solder paste 360-Pin freescale BGA PROFILING MPC106 spray nozzles BGA and QFP Package ibm
Text: Outline for Discussion · · · · · · Why BGA ? CBGA Introduction and Package Description PC , Freescale Semiconductor 10 Motorola 119 Pin, 14x22 mm CBGA Case Outline Drawing Note: This is an uncontrolled copy 11 Freescale Semiconductor Motorola 360 Pin, 25 mm CBGA Case Outline Drawing Note , Outline Drawing Note: This is an uncontrolled copy 13 Freescale Semiconductor Incoming PCB , Semiconductor 2 Why BGA ? · Advantages: ­ Higher Surface Mount Assembly Yield. » Coarse Pitches


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PDF 25x25x1 ceramic rework BGA Solder Ball collapse CCGA 304-pin ltcc 90Pb 10Sn solder paste 360-Pin freescale BGA PROFILING MPC106 spray nozzles BGA and QFP Package ibm
2009 - IC 7109

Abstract: 7109 SG-BGA-7109
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , 2 8 6 7 10 Side View (Section AA) 10 11 Customer's BGA IC SG-BGA-7109 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 11 5 , . Customer's Target PCB Status: Released Scale: - Rev: B Drawing : J. Glab Date: 10/05/07 , Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes


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PDF 475mm. SG-BGA-7109 725mm 025mm 125mm. IC 7109 7109
2005 - SG-BGA-7051

Abstract: No abstract text available
Text: (Section AA) 10 11 Customer's BGA IC SG-BGA-7051 Drawing © 2005 IRONWOOD ELECTRONICS, INC , GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , : B Drawing : H. Hansen Date: 5/10/05 File: SG-BGA-7051 Dwg Modified: 6/2/09, AE All , notice. PAGE 1 of 4 *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View Note: Full BGA pattern shown. Please adjust pattern according to


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PDF 475mm. SG-BGA-7051 725mm 025mm 125mm.
2003 - torque of screw for pcb

Abstract: torque of 4-40 screw for pcb BGA OUTLINE DRAWING SG-BGA-6081 35x35 bga
Text: Top View Bottom View tapped for 4-40 machine screw (x4) 55.225mm BGA pad outline A , User's BGA IC Status: Released Scale: 1:0.75 Rev: A Drawing : H. Hansen Date: 4/30/03 , 14.32mm±0.5mm 2 5 5.75mm±0.5mm 4 8 User's target PCB SG-BGA-6081 Drawing © 2003 IRONWOOD , Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes , size Ø 0.635mm pad (x 1225) 50.225mm 10mm 2.5mm typ. Note: Maximum BGA pattern shown


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PDF 225mm torque of screw for pcb torque of 4-40 screw for pcb BGA OUTLINE DRAWING SG-BGA-6081 35x35 bga
2007 - reflow temperature rohs bga

Abstract: No abstract text available
Text: batteries Snaps directly onto a surface-mounted 40mm ball-grid array ( BGA ) nonvolatile (NV) SRAM module Attaches after host BGA module has been surface-mounted to protect lithium battery from the high temperatures of reflow soldering Maintains mechanical and electrical connection with BGA module even during severe shock and vibration stresses Two attachment flanges latch onto host BGA module to provide a strong , OUTLINE DALLAS Semiconductor DS3802 BATTERY CAP yywwA DO NOT WASH § § § Top View Side View


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PDF DS3802 380mAh DS3802EXT DS3802 DS3816 DS3832 reflow temperature rohs bga
2005 - SG-BGA-7055

Abstract: No abstract text available
Text: 1.59mm. 11 10 11 Customer's BGA IC SG-BGA-7055 Drawing © 2005 IRONWOOD ELECTRONICS, INC , GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , : B Drawing : H. Hansen Date: 5/11/05 File: SG-BGA-7055 Dwg Modified: 6/2/09, AE All , notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Note: Full BGA pattern shown. Please adjust pattern according


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PDF 475mm. SG-BGA-7055 725mm 025mm 125mm.
2005 - SG-BGA-7053

Abstract: IC-512
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , 1.59mm. 11 10 11 Customer's BGA IC 5 12 Customer's Target PCB Scale: - Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. IC Guide: FR4 SG-BGA-7053 Drawing Status: Released © 2005 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing , notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical


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PDF 475mm. SG-BGA-7053 725mm 025mm 125mm. IC-512
2005 - SG-BGA-7070

Abstract: FR4 0.8mm thickness
Text: Customer's BGA IC 5 12 Customer's Target PCB Scale: - SG-BGA-7070 Drawing Status: Released © 2005 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing , GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Note: Full BGA pattern shown. Please adjust pattern according to individual


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PDF 475mm. SG-BGA-7070 725mm 025mm 125mm. FR4 0.8mm thickness
Supplyframe Tracking Pixel