The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial

BGA 40 x 40 mm St Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2004 - SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 SG-BGA-6094 1mm pitch BGA socket BGA Solder Ball compressive force SG-MLF-7003 SG-BGA-6033 17X17* BGA 289
Text: 576 625 676 729 729 841 961 1005 1089 1225 Any ( X ) 15 23 21 27 23 35 25 27 40 , SOCKETS The High Density GHz BGA sockets allow prototyping and testing of 0.5 and 0.65 mm pitch BGA , Description Socket Lid Max Pincount X mm Y mm SG-MLF-7000 0.4, 0.5, 0.5, 0.65, 0.8 10 10 GHz MLF Socket , Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent , BGA High Density Sockets . . . . . . . . . . . . . . . . . . . . . . . . . page SG.5 Ghz MLF High


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PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 SG-BGA-6094 1mm pitch BGA socket BGA Solder Ball compressive force SG-MLF-7003 SG-BGA-6033 17X17* BGA 289
SnPb36Ag2

Abstract: Lead Free reflow soldering profile BGA semiconductors cross reference Infineon diffusion solder FeNi42 BGA Ball Crack philips pb-free products STD-020C BGA and QFP Package freescale 020C
Text: >> 0.10mN/ mm Ageing : 8H Steam Source ST Microelectronics Immersion 10seconds Lead-Frame Package , Roadmap ( BGA excluded) ST Philips IFX Freescale1 Q2 05 Q2 05 Q2 05 Q2 05 Q2 05 , . Roadmap IC Package Conversion Roadmap L/T/F BGA ST Q2 05 Philips Q2 05 IFX Q2 05 , Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST , about ST / Philips SC / IFX / Freescale (E4) activities on lead-free packaging · Collect feedback


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PDF 2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA semiconductors cross reference Infineon diffusion solder FeNi42 BGA Ball Crack philips pb-free products STD-020C BGA and QFP Package freescale 020C
2004 - SG-BGA-6109

Abstract: torque of screw for pcb
Text: GHz BGA Socket - Direct mount, solderless 60 mm Top View Features Directly mounts to , : 4/9/04 File: SG-BGA-6109 Dwg Modified: 5/19/09 PAGE 2 of 5 Compatible BGA Spec X , elastomer 60 mm Heat sink lid for power dissipation 1 2 Heatsink Lid: Black anodized Aluminum , anodized Aluminum. Thickness = 6.35mm. 9 A Elastomer: 40 micron dia gold plated brass filaments , 6 2 3 BGA IC Side View (Section AA) 5 Target PCB 9 4 8 SG-BGA


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PDF 725mm. 525mm SG-BGA-6109 torque of screw for pcb
2004 - BGA reflow guide

Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire sn63pb37 0.4mm fine BGA thermal profile 23M1 20mm light dependent resistors ultra fine pitch BGA
Text: . In the table, select the part number corresponds to your IC size (length mm x width mm ), array size (rows x columns) and pitch ( mm ) (Note: More than one part number will match your criteria). You will , . The elastomer consists of fine pitch matrix (0.1mm x 0.1mm) of gold plated wires ( 40 micron diameter , PO Box 21151 · St . Paul, MN 55121 · USA www.ironwoodelectronics.com 2. Place BGA package (solder , 35 30 25 20 15 10 5 0 0 10 20 30 40 IC Size ( mm ) Socket+Fan Socket Only


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PDF
M25P08

Abstract: MD2800-D08 pmc flash pm49fl004t-33jc MD2810-D08 m25p04 SDTB-128 MD2811-D32-V3 M25P08-V-MN-6-T Sandisk TSOP EPROM databook am27c256 120
Text: programmer with support for SST (Refer Notes:#1) M27256-70-B ST Micro 32K x 8 12V/ 5V 70 , programmer with support for SST (Refer Notes:#1) M27256-70-C ST Micro 32K x 8 12V/ 5V 70 , -70-3C-WH Different package and pinout, same functionality M29F512B-45/70-NZ ST Micro 64K x 8 5.0V , software command, different sector size M29F512B-45/70-NZ ST Micro 64K x 8 5.0V-only 45, 70 , , different sector size M29W512B-55/70/90-K ST Micro 64K x 8 2.7-3.6V only 55, 70, 90 Bulk


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PDF SST39SF512; SST29EE512 AM28F512 M29F512 AT49F512, AT29C512 W29EE512 SST39SF010; SST29EE010 AM29F010, M25P08 MD2800-D08 pmc flash pm49fl004t-33jc MD2810-D08 m25p04 SDTB-128 MD2811-D32-V3 M25P08-V-MN-6-T Sandisk TSOP EPROM databook am27c256 120
2005 - SG-BGA-6170

Abstract: No abstract text available
Text: : 12/5/05 File: SG-BGA-6170 Dwg Modified: PAGE 2 of 5 Compatible BGA Spec D X , 45mm Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to , Guide: Cirlex or equivalent. Thickness = 0.75mm. 6 20 watt heatsink Elastomer: 40 micron dia , . IC Frame: FR4/G10 1 2 6 10 5 BGA IC Target PCB 4 8 9 3 SG-BGA-6170 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST . PAUL, MN 55121 Tele: (651) 452-8100


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PDF 525mm FR4/G10, SG-BGA-6170
2004 - STMicroelectronics smd marking code

Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL ST TSSOP Marking TQFP 14X20 STMicroelectronics pentawatt date code STMicroelectronics date code tssop-14 infineon msl HiQuad package opto mold compound
Text: CDIP CDIP F/S 32 PLCC 32 PLCCs PBGA40x40 CDIP F/S 40 BGA 10.53X6.29 CDIP F/S 42 , PDIP 32 SHRINK BGA 8X11.6 PDIP 40 BGA 8X12 PDIP 42 .6 STD PITCH .100 SO 8 BGA 8x8 , WITH RoHS PCN # CRP 04/744 Product Family / Commercial Product All ST Products are involved , describes ST conversion program for the second level interconnect 2 change and the way ST supports its , . Therefore, once converted to ECOPACKTM, ST devices will be RoHS compliant and have a Lead-free Second level


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PDF CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL ST TSSOP Marking TQFP 14X20 STMicroelectronics pentawatt date code STMicroelectronics date code tssop-14 infineon msl HiQuad package opto mold compound
2004 - STMicroelectronics smd marking code

Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 23X23 BGA 15X15 INFINEON package tqfp PART MARKING HEPTAWATT SMD PLCC Part Marking STMicroelectronics Marking STMicroelectronics tqfp Date Code Marking STMicroelectronics PACKAGE DPAK
Text: PLCC 32 PLCCs PBGA40x40 CDIP F/S 40 BGA 10.53X6.29 CDIP F/S 42 PLCC 52 BGA 10x10 , SHRINK BGA 8X11.6 PDIP 40 BGA 8X12 PDIP 42 .6 STD PITCH .100 SO 8 BGA 8x8 PDIP 42 , CONVERSION PROGRAM FOR COMPLIANCE WITH RoHS This document describes ST conversion program for the second level interconnect 2 change and the way ST supports its customers to meet the RoHS directive with this , of certain Hazardous Substances) directive 2002/95. Therefore, once converted to ECOPACKTM, ST


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PDF MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 23X23 BGA 15X15 INFINEON package tqfp PART MARKING HEPTAWATT SMD PLCC Part Marking STMicroelectronics Marking STMicroelectronics tqfp Date Code Marking STMicroelectronics PACKAGE DPAK
2005 - SG-BGA-6150

Abstract: b 6150
Text: Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec DETAIL X D Y e E 3 Øb , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , 1 5 9 3 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a , , 1.59mm thick. 7 10 6 5 Customer's BGA IC SG-BGA-6150 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST . PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 11


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PDF 225mm SG-BGA-6150 725mm 725mm 025mm 125mm. b 6150
2004 - SG-BGA-6140

Abstract: 6140
Text: 4 Compatible BGA Spec DETAI L X D Y e E 3 Øb Ø0.15 Z Ø0.30 Z X Y 0.20 , Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB , . 4 1 5 9 3 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically , Plate: FR4/G10, 1.59mm thick. 7 10 6 Customer's BGA IC SG-BGA-6140 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST . PAUL, MN 55121 Tele: (651) 452-8100


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PDF 225mm SG-BGA-6140 725mm 725mm 025mm 125mm. 6140
2004 - FP-X4KPG223-01

Abstract: reflow profile FOR LGA COMPONENTS CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA292 BGA165 bga96 SO8A CA-QFE100RB-L-Z-T-01 BGA480B
Text: are gold plated throughout. BGA Probe Board BGA ARRAY HEADER TYPE: A: R X C = 0.05" X 0.1" B: R X C = 0.05" X 0.05" C: R X C = 0.1" X 0.1" C R Top Interface - BGA Land Socket with Female Interface ( BGA SMT to Female) Y LS-BGA -02 VERSION SMT TO FEMALE X 0.296" 0.150 , "X3.50" 3.40"x3. 40 " 3.40"x3. 40 " 3.40"x3. 40 " 3.40"x3. 40 " 3.90"x5.30" N/A N/A N/A 2.60" x 6.20" N/A , x 1.55 in. 1.75 x 1.75 in. 1.75 x 1.75 in. 1.95 x 1.95 in. PO Box 21151, St Paul, MN 55121 ·


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PDF XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA292 BGA165 bga96 SO8A CA-QFE100RB-L-Z-T-01 BGA480B
2015 - GS12141

Abstract: No abstract text available
Text: Input Dual Data Temp Power Size MUX Output Range (ºC) (mW) ( mm ) Pkg 4:1 YES - 40 to +85 , BGA 100 GS2962 270, 1485, 2970 YES YES YES NO YES 3G: 40 HD: 50 SD: 200 10 or 20 YES - 40 to +85 350 YES BGA 100 GS1672 270, 1485 YES YES YES YES YES HD: 50 SD: 200 10 or 20 YES - 40 to +85 350 YES BGA 100 , 545 YES BGA 100 - 40 to +85 515 YES BGA 100 YES - 40 to +85 350 YES


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PDF Broadcast-SG15 GS12141
2013 - Not Available

Abstract: No abstract text available
Text: 24 bits. The SAM9G25 is available in a 217-ball BGA package with 0.8 mm ball pitch, as well as in 247-ball TFBGA and 247-ball VFBGA packages with 0.5 mm ball pitch, making it ideally suited for , -ball BGA , pitch 0.8 mm 247-ball TFBGA, pitch 0.5 mm 247-ball VFBGA, pitch 0.5 mm SAM9G25 [DATASHEET] 11032BS–ATARM–09-Jul-13 3 Block Diagram PC T TS 1 CK -P K0 FIQ IRQ XD DR D X DT , solution for industrial applications. The multi-layer bus matrix is linked to 2 x 8 DMA channels as well


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PDF AT91SAM SAM9G25 ARM926EJ-Sâ SAM9G25 12-bit
SnPb36Ag2

Abstract: J-STD-020B Lead Free reflow soldering profile BGA Infineon diffusion solder lead-free solder joint reliability thermal cycle reflow temperature bga FeNi42-leadframe FeNi42 JSTD020B bga thermal cycling reliability
Text: °C · Zero cross time << 3 seconds · Wetting force >> 0.10mN/ mm Ageing : 8H Steam Source ST , BGA On board Reliability LFBGA-208, Ball SnAgCu, solder SnPbAg - 40 °C/+125°C, 2000 cycles Results , balls +SnAgCu paste (245C) SnAgCu balls +SnAgCu paste (250C) - 40 °C/+125°C cycles Source ST , Lead-free packaging for semiconductor devices E3 presentation Infineon Technologies / ST , mm3 and a body thickness < 2.5 mm and "large" packages having a body volume >= 350 mm3 or a body


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PDF 2002/95/EC SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA Infineon diffusion solder lead-free solder joint reliability thermal cycle reflow temperature bga FeNi42-leadframe FeNi42 JSTD020B bga thermal cycling reliability
2004 - IC 651

Abstract: 6113 SG-BGA-6113 bga socket
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , . Thickness = 5mm, Hex socket = 3mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged , ) 11 10 6 Customer's BGA IC SG-BGA-6113 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST . PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 5 11 12 Customer , *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout


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PDF 725mm. SG-BGA-6113 5M-1994. IC 651 6113 bga socket
2002 - SG-BGA-6063

Abstract: No abstract text available
Text: PAGE 2 of 4 Compatible BGA Spec DETAIL D X Y e E 3 Øb Ø0.25 Z X Y Ø0 , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , socket = 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone , thick. 2 8 7 Side View (Section AA) 10 11 5 6 Customer's BGA IC SG-BGA-6063 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST . PAUL, MN 55121 Tele: (651) 452-8100


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PDF 225mm 725mm 725mm 025mm SG-BGA-6063 125mm.
2013 - Not Available

Abstract: No abstract text available
Text: (IP) blocks • Up to 40 % lower power consumption than the previous generation device Improved , for up to three signal processing precision levels (three 9 x 9, two 18 x 18, or one 27 x 27 , SE, SX, and ST devices only) • Interface peripherals—10/100/1000 Ethernet media access control , integrated ARM-based HPS and 3.125 Gbps transceivers Cyclone V ST SoC FPGA with integrated ARM-based , Code and Available Options for Cyclone V E Devices—Preliminary Package Type F : FineLine BGA (FBGA


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PDF CV-51001
2002 - 6068

Abstract: SG-BGA-6068
Text: : 5/19/09 PAGE 2 of 4 Compatible BGA Spec X D DETAIL Y e E 3 Øb Ø0 , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone , thick. 2 8 7 Side View (Section AA) 10 11 5 6 11 Customer's BGA IC SG-BGA-6068 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST . PAUL, MN 55121 Tele: (651) 452-8100


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PDF 225mm 725mm 725mm 025mm SG-BGA-6068 125mm. 6068
2010 - EIA standards 783

Abstract: smd diode order marking code stmicroelectronics EIA 481-C EIA standards 763 bulk id EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
Text: a 5 x 5 bump matrix array (sample). 500 µm ± 50 650 µm ± 65 695 µm ± 70 2.42 mm ± 50 µm 500 µm ± 50 310 µm ± 50 2.42 mm ± 50 µm Note: 2/13 Optional coating 250 µm ± 40 250 µm ± 40 The package height of 0.65 mm (0.695 mm for optionally coated packages) is valid for a , ST xxz yww ST xxz xxz yww ST ST 1.24 4.0 0.73 User direction of unreeling , ones in standard plastic packages (such as TSSOP, SSOP or BGA ). Figure 1. Typical Flip-Chip package


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PDF AN1235 AN2348. EIA standards 783 smd diode order marking code stmicroelectronics EIA 481-C EIA standards 763 bulk id EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
32PIN

Abstract: GLT6020L08 GLT6020L08I
Text: is available in a 32-pin sTSOP-I ( 8 X 13.4 mm )package. The chip enable signals,/CE1 is provided , : 2.0V POWER T : PDIP(300mil) TS : TSOP(Type I) ST : sTSOP(Type I) TC : TSOPll ( 40 /44) PL , G -LINK (Preliminary datasheet) 256K X 8 Bit GLT6020L08 SEPT 20, 2004(Rev.0.3) 2Mb Low , ~85°C/ - 40 °C~85 °C · CMOS low operating voltage :3.0V(2.7~3.3V) · Package:sTSOP I 32Pin( 8 X13 , (Rev.0.3) Functional Block Diagram A0 ROW Decoder Address Input Buffer 256K X 8


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PDF GLT6020L08 32Pin( GLT6020L08 32PIN GLT6020L08I
2013 - 11063FS

Abstract: No abstract text available
Text: Open-drain, Pull-up and Pull-down Resistor, Synchronous Output z Packages: 217-ball BGA , pitch 0.8 mm , and 247-ball BGA , pitch 0.5 mm z z z z z z SAM9N12/SAM9CN11/SAM9CN12 [DATASHEET , features. Table 0-1. Devices Device Standard Boot with BSC Secured Boot TRNG AES SHA SAM9N12 X X SAM9CN11 X X X X SAM9CN12 X X X X 11063GS­ATARM­17-Apr-13 1. Features z Core ARM926EJ-STM ARM , Frame Sync SSC Receive Frame Sync Timer Counter - TCx x =0.5 TCLKx TIOAx TIOBx TC Channel x External


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PDF SAM9N12 SAM9CN11 SAM9CN12 ARM926EJ-STM SAM9N12/CN11/CN12 32-Kbyte SAM9CN12, 11063GS 17-Apr-13 11063FS
2004 - R50-E2Y2-24

Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Text: Number DC-BGA/ BGA -750-S-B-01 DC-BGA/ BGA -750-S-B-02 DC-BGA/ BGA-750-S-T -01 DC-BGA/ BGA , 1.60 x 0.70 32/32 0.30 0.40 1.60 x 0.40 40 / 40 0.60 0.70 2.00 x 0.80 40 / 40 0.60 0.30 2.00 x 0.70 40 / 40 0.60 0.40 2.00 x 0.70 64/64 0.90 0.60 3.20 x 1.00 64/64 0.60 0.90 3.20 x 1.00 64/64 0.90 0.30 3.20 x 1.00 40 / 40 0.60 0.60 2.10 x .900 40 / 40 0.60 0.60 2.10 x .900 D , , however, device converters are typically developed to your unique specs. PO Box 21151, St Paul, MN


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PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
2003 - SG-BGA-6083

Abstract: No abstract text available
Text: IC BGA IC SG-BGA-6083 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST . PAUL, MN 55121 , Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec DETAIL X 0.5mm min D Y e E , GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 , subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA


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PDF 225mm SG-BGA-6083 725mm 125mm.
2006 - EIA 763

Abstract: AN2348 STMicroelectronics smd marking code EIA standards 783 EIA-481-C ANTISTATIC AN1235 10E8 STMicroelectronics TRACEABILITY code 10E12
Text: requirements. Figure 1. Mechanical dimensions of a 5 x 5 bump matrix array (sample). 400 µm ± 40 605 µm ± 55 650 µm ± 60 1.97 mm ± 30 µm 400 µm ± 40 255 µm ± 40 1.97 mm ± 30 µm Note , ST E E E All dimensions in mm xxx yww ST xxx yww 8 +/- 0.3 0.71 +/- 0.05 , TSSOP, SSOP or BGA ). 1 2 3 4 5 A B C D E The Flip-Chip package family has been , BGA packages) and makes it also compatible with the PCB design rules used for standard ICs. Optional


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PDF AN2348 AN1235. EIA 763 AN2348 STMicroelectronics smd marking code EIA standards 783 EIA-481-C ANTISTATIC AN1235 10E8 STMicroelectronics TRACEABILITY code 10E12
2009 - BOX21151

Abstract: SG-BGA-6153 fillister head screw st 6153
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB , ) 5 4 1 3 9 Elastomer: 40 micron dia gold plated brass filaments arranged , : FR4/G10, 1.59mm thick. 2 12 8 7 10 6 Customer's BGA IC SG-BGA-6153 Drawing © 2009 IRONWOOD ELECTRONICS, INC. PO BOX21151 ST . PAUL, MN 55121 Tele: (651) 452-8100 , Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes


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PDF 225mm SG-BGA-6153 725mm 725mm 025mm BOX21151 fillister head screw st 6153
Supplyframe Tracking Pixel