The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
MSP430F2011TN Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 14-PDIP -40 to 105
TPS2011ADR Texas Instruments 1.2A, 2.7 to 5.5V Single High-Side MOSFET Switch IC, No Fault Reporting, Active-Low Enable 8-SOIC -40 to 85
BQ2011SN-D118 Texas Instruments NiCd Gas Gauge For High Discharge Rates (>5A), Small Pack Capacities (<2Ah) 16-SOIC 0 to 70
MSP430F2011TPW Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 14-TSSOP -40 to 105
TPS2011ADRG4 Texas Instruments 1.2A, 2.7 to 5.5V Single High-Side MOSFET Switch IC, No Fault Reporting, Active-Low Enable 8-SOIC -40 to 85
MSP430F2011TRSA Texas Instruments 16-BIT, FLASH, 16MHz, RISC MICROCONTROLLER, PQCC16, PLASTIC, QFN-16

B.A. private examination 2011 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
d 3151

Abstract: marking 1GL n437 FSC5960J marking rut mil-std-750 3076 2SA 1964 transistor marking 75s
Text: shall consist of the examination * and tests specified in 4.3. 4.4 and 4.5. 4.3 Group A inspection , iypc ¿Nil 65. MIL-S- 19500/178B(NA V Y) Tabi* I - Group A inspec ion. Examination or Test Subgroup 1 V dual and mechanical examination Subgroup 2 Emtter lu has* cutoff current Collector to ban , Limits | Examination or Teat MIL-OTD-750 Method Specific Conditions LTPD Symbol Mln Max 1 Unit 1 1 , record d values 5 1GL-S-19500/1788(NAVY) T bU m - ■roup C ln*p»ctloo. Examination or Test Cow


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PDF MIL-S-19500/17 MIL-S-19500/178A 2N11G5 MIL-S-19500, d 3151 marking 1GL n437 FSC5960J marking rut mil-std-750 3076 2SA 1964 transistor marking 75s
transistor 21Y

Abstract: 2N1556 2N1556A TRANSISTOR 3052 Germanium power 2N1553 J717 2N1555 2N1555A 2N1554A
Text: satisfaction of the Government. 4.3 Particular examination and test requirements.- 4.3.1 "Pulse , the device, upon examination after test. 4.3.5 Maximum current test.-With the base lead electrically , ) Table I. Qroup A inspection. lest Method per Examination of MTT -STn-7Sn f-eflt- Limits r.nnrH H nnn T.TPTi Svmhnl Mir» Miv TTn-if- W Subgroup 1 2071 Visual and mechanical examination 20 , A inspection - (Cont'd) Test Method per MIL-SID-750 Examination or test Conditions Limits


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PDF /331A MIL-S-19500/ 2N1553A 2N1556A 2N1554A 2N1555A 2N1556A transistor 21Y 2N1556 TRANSISTOR 3052 Germanium power 2N1553 J717 2N1555
MIL-STD-883C

Abstract: No abstract text available
Text: : Mechanical Tests 4(0) 2015 LTPD = 10 2003 LTPD = 15 2011 Pre Bum-ln Electrical 100% Dynamic Bum-ln , Examination 1004, 1010 Endpoint Electrical Applicable Device Spec. Subgroup 4 Mechanical Shock 2002, Cond. B Vibration 2007, Cond. A Constant Acceleration 2001, Cond. E Hermeticity 1014 Visual Examination 1010, 1011 , Visual Examination 1009 Subgroup 6 Internal Water Vapor 1018 < 5,000 PPM, 100°C Subgroup 7 Lead Finish


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PDF IL-STD-883C MILM-38510 MILI-45208. MIL-STD-883C
mmic

Abstract: mwtinc MWT-A970 "Microwave Diodes" MWT-7 wirebond MIL-PRF-38534 fine leak MwT-LP770 MwT-170 LN-141510-H4
Text: Steady State Life n 1005 Final Electrical n n Wire-bond Evaluation 2011 SEM 2018 , Seal (Gross and Fine Leak) 1014 A1/C Radiographic Examination 2012 N/A 100 , Wire-bond strength 2011 n n 2019 or 2027 n n Die Shear 1000 Hr,125 C o


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PDF LN-162315-H4 LN-141510-H4 LN-141526-H4 mmic mwtinc MWT-A970 "Microwave Diodes" MWT-7 wirebond MIL-PRF-38534 fine leak MwT-LP770 MwT-170 LN-141510-H4
MC 3041

Abstract: MC 140 transistor MC 139 transistor 2N2378 2N496 2N2378 JAN "MC 140" transistor transistor mc 140
Text: until the defect(s) has been remedied to the satisfaction of the Government. 4.3 Particular examination , , or C tests. 4 Examination or test Conditions MIL-S-1?500/289(EL) Table I. Group A inspection , and mechanical examination Subgroup 2 Emitter-to-base cutoff current Collector-to-base cutoff , - "25 uAdc 5 MIL-S-l9500/289(EÜ Test Method per Examination or test MIL-STD-750 Table I. Group , (EL) Test Method per MIL-STD-750 Examination or test 1/ Table II. Group B inspection. Conditions '


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PDF L-S-19500/289 2N2378 MC 3041 MC 140 transistor MC 139 transistor 2N2378 2N496 2N2378 JAN "MC 140" transistor transistor mc 140
transistor kc 2026

Abstract: LDL8 sms ic 1SV50 kc 2026 mboc 2N916 N429
Text: of the examination and tests shown in table I. 4.2.2 Group B inspection.- Group B inspection snail , . Limita Examination or teat ML-STD-750 method Specific Coodttlane LTPO rtj. No. Symbol Mm. Max. Unita , «USINES PENALTY FOR PRIVATE USE »300 BUSINESS REPLY MAIL pirst class permit no. 12503 Washington o c


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PDF MIL-S-19500/27U KEL-S-19500/271 2N916 MIL-S-19500, transistor kc 2026 LDL8 sms ic 1SV50 kc 2026 mboc 2N916 N429
2011 - Not Available

Abstract: No abstract text available
Text: 225 -200 2.7 5.0 195 Unit ns ns mA Rev: 1.04 8/ 2011 1/26 © 2011 , GSI Technology , : 1.04 8/ 2011 2/26 © 2011 , GSI Technology Specifications cited are subject to change without , supply Rev: 1.04 8/ 2011 3/26 © 2011 , GSI Technology Specifications cited are subject to , Note: Only x36 version shown for simplicity. Rev: 1.04 8/ 2011 4/26 © 2011 , GSI Technology , wraps to initial state on the 5th clock. BPR 1999.05.18 Rev: 1.04 8/ 2011 5/26 © 2011 , GSI


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PDF GS88237CB-xxxV 119-Bump 882V37C
2011 - Not Available

Abstract: No abstract text available
Text: mA Rev: 1.04 8/ 2011 1/25 © 2011 , GSI Technology Specifications cited are subject to , VDDQ Rev: 1.04 8/ 2011 2/25 © 2011 , GSI Technology Specifications cited are subject to , Control Core power supply I/O and Core Ground Output driver power supply Rev: 1.04 8/ 2011 3/25 © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , simplicity. Rev: 1.04 8/ 2011 4/25 © 2011 , GSI Technology Specifications cited are subject to


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PDF GS88237CB-333/300/250/200 119-Bump x18/x36 88237C
2011 - Not Available

Abstract: No abstract text available
Text: 8/ 2011 -333 2.0 3.0 -300 2.2 3.3 -250 2.3 4.0 -200 2.7 5.0 Unit ns ns , to change without notice. For latest documentation see http://www.gsitechnology.com. © 2011 , GSI , / DNU A PE T NC NC A10 A11 A12 NC ZZ U Rev: 1.04 8/ 2011 2 VDDQ , notice. For latest documentation see http://www.gsitechnology.com. © 2011 , GSI Technology , supply Rev: 1.04 8/ 2011 3/25 Specifications cited are subject to change without notice. For


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PDF GS88237CB-333/300/250/200 119-Bump x18/x36 119-BGA 88237C
2011 - Not Available

Abstract: No abstract text available
Text: : 1.05 6/2012 1/26 © 2011 , GSI Technology Specifications cited are subject to change without , DQB VDDQ DQB DQB VDDQ DQA DQA VDDQ DQA DQA PE ZZ VDDQ Rev: 1.05 6/2012 2/26 © 2011 , GSI , Core Ground Output driver power supply Rev: 1.05 6/2012 3/26 © 2011 , GSI Technology , 6/2012 4/26 © 2011 , GSI Technology Specifications cited are subject to change without , Rev: 1.05 6/2012 5/26 © 2011 , GSI Technology Specifications cited are subject to change


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PDF GS88237CB-xxxV 119-Bump 882V37C
2011 - Not Available

Abstract: No abstract text available
Text: : 1.05a 11/2012 1/26 © 2011 , GSI Technology Specifications cited are subject to change without , DQB VDDQ DQB DQB VDDQ DQA DQA VDDQ DQA DQA PE ZZ VDDQ Rev: 1.05a 11/2012 2/26 © 2011 , GSI , driver power supply Rev: 1.05a 11/2012 3/26 © 2011 , GSI Technology Specifications cited are , © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , /2012 5/26 © 2011 , GSI Technology Specifications cited are subject to change without notice


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PDF GS88237CB-xxxV 119-Bump 882V37C 119-BGA
2011 - Not Available

Abstract: No abstract text available
Text: : 1.05a 11/2012 1/26 © 2011 , GSI Technology Specifications cited are subject to change without , DQB VDDQ DQB DQB VDDQ DQA DQA VDDQ DQA DQA PE ZZ VDDQ Rev: 1.05a 11/2012 2/26 © 2011 , GSI , driver power supply Rev: 1.05a 11/2012 3/26 © 2011 , GSI Technology Specifications cited are , © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , /2012 5/26 © 2011 , GSI Technology Specifications cited are subject to change without notice


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PDF GS88237CB-xxxIV 119-Bump 882V37C 119-BGA
2011 - Not Available

Abstract: No abstract text available
Text: 1/25 © 2011 , GSI Technology Specifications cited are subject to change without notice. For , DQB4 DQB3 VDDQ DQB2 DQB1 VDDQ DQA1 DQA2 VDDQ DQA3 DQA4 PE ZZ VDDQ Rev: 1.05 7/2012 2/25 © 2011 , supply Rev: 1.05 7/2012 3/25 © 2011 , GSI Technology Specifications cited are subject to , : Only x36 version shown for simplicity. Rev: 1.05 7/2012 4/25 © 2011 , GSI Technology , wraps to initial state on the 5th clock. BPR 1999.05.18 Rev: 1.05 7/2012 5/25 © 2011 , GSI


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PDF GS88237CB-xxx 119-Bump x18/x36 88237C
2011 - Not Available

Abstract: No abstract text available
Text: : 1.05 6/2012 1/26 © 2011 , GSI Technology Specifications cited are subject to change without , DQB VDDQ DQB DQB VDDQ DQA DQA VDDQ DQA DQA PE ZZ VDDQ Rev: 1.05 6/2012 2/26 © 2011 , GSI , Core Ground Output driver power supply Rev: 1.05 6/2012 3/26 © 2011 , GSI Technology , 6/2012 4/26 © 2011 , GSI Technology Specifications cited are subject to change without , 1999.05.18 Rev: 1.05 6/2012 5/26 © 2011 , GSI Technology Specifications cited are subject to


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PDF GS88237CB-xxxIV 119-Bump 882V37C
2011 - Not Available

Abstract: No abstract text available
Text: 1/25 © 2011 , GSI Technology Specifications cited are subject to change without notice. For , © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , : 1.05a 11/2012 3/25 © 2011 , GSI Technology Specifications cited are subject to change without , x36 version shown for simplicity. Rev: 1.05a 11/2012 4/25 © 2011 , GSI Technology , wraps to initial state on the 5th clock. BPR 1999.05.18 Rev: 1.05a 11/2012 5/25 © 2011 , GSI


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PDF GS88237CB-xxx 119-Bump x18/x36 88237C
2011 - Not Available

Abstract: No abstract text available
Text: Pipeline 3-1-1-1 Flow Through 2-1-1-1 Rev: 1.00 1/ 2011 1/39 © 2011 , GSI Technology , BGA-14 x 22 mm2 Body-1 mm Bump Pitch Rev: 1.00 1/ 2011 2/39 © 2011 , GSI Technology , ]) Scan Test Mode Select Scan Test Data In Scan Test Data Out Scan Test Clock Rev: 1.00 1/ 2011 3/39 © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , and Core Ground Output driver power supply Rev: 1.00 1/ 2011 4/39 © 2011 , GSI Technology


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PDF GS832218/36 -225M GS832272C-225M 209-Pin x18/x36 8322xx-225M
2011 - Not Available

Abstract: No abstract text available
Text: Rev: 1.00 1/ 2011 Unit tKQ(x18/x36) tKQ(x72) tCycle 2.7 3.0 4.4 ns ns ns Curr (x18 , change without notice. For latest documentation see http://www.gsitechnology.com. © 2011 , GSI , TCK DQE DQE W 11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch Rev: 1.00 1/ 2011 , ://www.gsitechnology.com. © 2011 , GSI Technology GS832218/36(B/E)-225M GS832272C-225M GS832272 209-Bump BGA Pin , Scan Test Data In TDO O Scan Test Data Out TCK I Scan Test Clock Rev: 1.00 1/ 2011


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PDF GS832218/36 -225M GS832272C-225M 209-Pin x18/x36 8322xx-225M
2011 - Not Available

Abstract: No abstract text available
Text: Unit ns ns mA mA ns ns mA mA © 2011 , GSI Technology Pipeline 3-1-1-1 Flow Through 2-1-1-1 Rev: 1.02 8/ 2011 Specifications cited are subject to change without notice. For latest documentation see , NC Rev: 1.02 8/ 2011 LBO A A A A A1 A0 TMS TDI VSS VDD TDO TCK A A A A A A A 2/34 © 2011 , DQA DQA VSS VDDQ DQA DQA DQPA LBO A A A A A1 A0 TMS TDI VSS VDD Rev: 1.02 8/ 2011 3/34 TDO TCK A A A A A A A © 2011 , GSI Technology Specifications cited are subject to change without notice


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PDF GS8161ExxD 100-Pin 165-Bump 8161ExxD
Not Available

Abstract: No abstract text available
Text: CONDUCTIVE POLYMER ALUMINUM SOLID ELECTROLYTIC CAPACITORS CK Chip Type, Ultra-low ESR series Ultra-low ESR, Higher Capacitance, High ripple current. Load life of 2000 hours at 105°C. SMD type : Lead free reflow soldering condition at 260°C peak correspondence. Compliant to the RoHS directive ( 2011 /65/EU). CJ CK Low ESR Specifications Item Performance Characteristics Category , value : The value before test of examination of resistance to soldering. Dimensions 0.5 MAX. 1


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PDF 2011/65/EU) 120Hz, 100kHz, PCK0G102MCO1GS PCK0G182MCO1GS PCK0J221MCO1GS PCK0J331MCO1GS PCK0J391MCO1GS PCK0J821MCO1GS
2015 - Not Available

Abstract: No abstract text available
Text: CONDUCTIVE POLYMER ALUMINUM SOLID ELECTROLYTIC CAPACITORS CK Chip Type, Ultra-low ESR series Ultra-low ESR, Higher Capacitance, High ripple current. Load life of 2000 hours at 105°C. SMD type : Lead free reflow soldering condition at 260°C peak correspondence. Compliant to the RoHS directive ( 2011 /65/EU). CJ CK Low ESR Specifications Item Performance Characteristics Category , value : The value before test of examination of resistance to soldering. Dimensions 1 0.5 MAX


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PDF 2011/65/EU) 120Hz, 100kHz, PCK0G102MCO1GS PCK0G182MCO1GS PCK0J221MCO1GS PCK0J331MCO1GS PCK0J391MCO1GS PCK0J821MCO1GS
220uF 16V Electrolytic Capacitor smd

Abstract: No abstract text available
Text: CONDUCTIVE POLYMER ALUMINUM SOLID ELECTROLYTIC CAPACITORS CS Chip Type, Long Life Assurance series Load life of 5000 hours at 105°C. SMD type : Lead free reflow soldering condition at 260°C peak correspondence. Compliant to the RoHS directive ( 2011 /65/EU). CS CF Long Life Specifications Item Performance Characteristics Category Temperature Range – 55 to +105°C Rated , examination of resistance to soldering. Dimensions 1 0.5 MAX. E Type numbering system (Example


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PDF 2011/65/EU) 120Hz, 100kHz, 100kHz PCS1C121MCL1GS 100kHz 8100C 220uF 16V Electrolytic Capacitor smd
2015 - Not Available

Abstract: No abstract text available
Text: CONDUCTIVE POLYMER ALUMINUM SOLID ELECTROLYTIC CAPACITORS CS Chip Type, Long Life Assurance series Load life of 5000 hours at 105°C. SMD type : Lead free reflow soldering condition at 260°C peak correspondence. Compliant to the RoHS directive ( 2011 /65/EU). CS CF Long Life Specifications Item Performance Characteristics Category Temperature Range – 55 to +105°C Rated , of examination of resistance to soldering. Dimensions Type numbering system (Example : 6.3V


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PDF 2011/65/EU) 120Hz, 100kHz, 100kHz PCS1C121MCL1GS 100kHz 8100D
2011 - Not Available

Abstract: No abstract text available
Text: Pipeline 3-1-1-1 Flow Through 2-1-1-1 Rev: 1.02 8/ 2011 1/34 © 2011 , GSI Technology , VDDQ DQA DQA VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA NC NC VSS VDDQ NC NC NC Rev: 1.02 8/ 2011 LBO A A A A A1 A0 TMS TDI VSS VDD TDO TCK A A A A A A A 2/34 © 2011 , GSI Technology , LBO A A A A A1 A0 TMS TDI VSS VDD Rev: 1.02 8/ 2011 3/34 TDO TCK A A A A A A A © 2011 , GSI , driver power supply Rev: 1.02 8/ 2011 4/34 © 2011 , GSI Technology Specifications cited are


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PDF GS8161xxD 100-Pin 165-Bump 8161xxD
2011 - Not Available

Abstract: No abstract text available
Text: © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , /37 © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , A A A © 2011 , GSI Technology Specifications cited are subject to change without notice. For , floating. TDO TCK A A A A A A A © 2011 , GSI Technology Specifications cited are subject to change , I I I I I I O I I I I I I Rev: 1.04 6/2012 5/37 © 2011 , GSI Technology Specifications


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PDF GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC
2011 - Not Available

Abstract: No abstract text available
Text: © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , /36 © 2011 , GSI Technology Specifications cited are subject to change without notice. For latest , A A A © 2011 , GSI Technology Specifications cited are subject to change without notice. For , left floating. TDO TCK A A A A A A A © 2011 , GSI Technology Specifications cited are subject , supply - I I - I I I I I I I I I I O I I I I I I Rev: 1.04 6/2012 5/36 © 2011 , GSI


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PDF GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC
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