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LM5111-3MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
LM5111-1MYX Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
LM5111-1MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
LM5111-2MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
LM5111-4M/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-SOIC
LM5111-4MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD

Amkor mold compound Datasheets Context Search

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8361J

Abstract: mp8000ch4 Ablestik sumitomo crm g700l R6786-24 EME-G700L sumitomo EME G700L SUMITOMO g700l SUMITOMO 7351LS
Text: in the tables below: 80 pin PQFP Assembly SubCon Mold Compound Die Attach Lead Frame Lead , Mold Compound Die Attach Lead Frame Lead Coating Wire Marking Old Skyworks, Mexico Sumitomo , Ablestik 8361J Cu 194 85/15 Sn/Pb 1.0 mil Au Ink Assembly SubCon Mold Compound Die Attach Lead , /Pb 1.0 mil Au Ink Assembly SubCon Mold Compound Die Attach Lead Frame Lead Coating Wire , Mold Compound Die Attach Lead Frame Lead Coating Wire Marking Old Skyworks, Mexico Sumitomo


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PDF CX28392-25 CX28394-25 CX28342-11 CX28343-11 CX28344-11 R6786-24 28XXX-PCN-002-A 8361J mp8000ch4 Ablestik sumitomo crm g700l R6786-24 EME-G700L sumitomo EME G700L SUMITOMO g700l SUMITOMO 7351LS
Amkor Wafer level mold compound

Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
Text: ) Internal Cu Planes Embedded Cu Heat Spreader (Grounded Option) Thermally Enhanced Mold Compound Shipping , Compound Dummy Si spacer www.amkor.com With respect to the information in this document, Amkor makes no , body sizes · Thin Au wire (0.5mil) or Cu wire compatible · Chip-on-Chip (CoC) · Large mold cap for , Pb-free solder balls Thermal Resistance Plastic Ball Grid Array (PBGA): Amkor 's PBGAs incorporate the , while maximizing the performance characteristics of semiconductors. Amkor 's PBGAs are designed for low


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IPC-9701

Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Text: Package Substrate Mold Compound Bumps Balls Test Services Build up and coreless laminates Fine filler , ) Packages: Amkor 's flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the package uses a molding compound , improved, especially for bare die and thin core substrates, because the molding compound ruggedizes the , compound locks the structure in place much like traditional underfill, extending solder joint reliability


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PDF MS-034 15mm-42 IPC-9701 Amkor mold compound coreless substrate amkor flip "IPC-9701"
PCN0414

Abstract: EME-G700 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
Text: assembled at Amkor Korea and ASE Malaysia will be standardized to this mold compound . Product , PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound for the mold compound , compound . Reason for Change: Apart from providing standardization of mold compound within all TQFP packages, the Sumikon EME-G700 series mold compound provides better yield and reliability performance


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PDF PCN0414 EME-G700 PCN0414 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
PCN0404

Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700* sumitomo
Text: 7320 series mold compound for TQFP packages assembled by Amkor and other assembly sites. Products , PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected , . Altera has successfully qualified this new mold compound and found it to meet the moisture rating , compound is offered as additional mold compound choice for this package due to improved performance and


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PDF PCN0404 G700L PCN0404 SUMITOMO g700l sumitomo EME G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700* sumitomo
Sumitomo G700K

Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K ablebond ablestik 8290 epoxy 8290 SUMITOMO-G600 SUMITOMO g600 UL
Text: Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA , Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh


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PDF DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K ablebond ablestik 8290 epoxy 8290 SUMITOMO-G600 SUMITOMO g600 UL
ABLEBOND

Abstract: No abstract text available
Text: Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA , Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh


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PDF DS1086L, JESD78, ABLEBOND
G700K

Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA , Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh


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PDF DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Sumitomo G700K

Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Text: : Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta , Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Information: Qualification Vehicle Assembly Site: Pin Count: Package Type: Body Size: Mold Compound , : Qualification Vehicle Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead , Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA


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PDF DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Nitto MP8000

Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach , Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA , Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh


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PDF DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
MS-029

Abstract: JEDEC Matrix Tray outlines copper heatsink JEDEC standard 033 MS-022 MS029 prime power 1230
Text: size) · Industry-accepted JEDEC package outlines · Low stress mold compound · Heatsink-up and , /TNR Mold Compound Gold Wire Cu Leadframe Die Test Services · Program generation/conversion · Product engineering · Wafer sort · Contact Amkor Test Services for more details Cu Heat , Mold Compound Gold Wire Inverted Configuration Options: MQFP POWERQUAD® 2 PACKAGE FAMILY , . VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION .


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PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the , manufacturing sites. The changes are summarized in Table 1. Table 1: Summary of Mold Compound Changes Current , supply of the G770 series mold compound materials. Products Affected Appendix 1 lists the products , Code Marking Format A XZ0801T Qualification Data The new mold compound materials have been fully


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PDF PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
l2aa

Abstract: tepbga-2 Amkor mold compound CO-029 Amkor Wafer level mold compound GE-100L GE-100-L Amkor Technology pbga moisture UM2219 mold compound
Text: (Grounded Option) Thermally Enhanced Mold Compound Process Highlights Die thickness (max) Bond pad , Available Standard Materials Package Substrate: Die attach: Au wire: Mold compound : Solder , Thin Au wire (0.5mil) or Cu wire compatible · Large mold cap for quality enhancement · Low Profile , solder balls Plastic Ball Grid Array (PBGA): Amkor 's PBGAs incorporate the most advanced assembly , characteristics of semiconductors. Amkor 's PBGAs are designed for low inductance, improved thermal operation


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PDF CO-029) l2aa tepbga-2 Amkor mold compound CO-029 Amkor Wafer level mold compound GE-100L GE-100-L Amkor Technology pbga moisture UM2219 mold compound
TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Text: Compound Mold Compound Gold Wire Gold Wire Film Adhesive Leadframe Die Die Die Die Die , LEADFRAME data sheet TSOP Features: Thin Small Outline Package (TSOP): Amkor offers a , and E2PROM find this package symbiotic with end-use products. Amkor answers the needs required by , applications. These products demand more of ICpackages and Amkor delivers. Thermal Resistance: g Amkor , hours · High temp storage 150 °C, 1000 hours visit amkor technology online for locations and to


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PDF MS-024 TSOP 48 thermal resistance TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
CS-007

Abstract: Amkor Electronics Amkor mold compound
Text: www.amkor.com DS587B Rev Date: 08`08 LEADFRAME data sheet FusionQuad® Mold Compound Gold , Mold Compound less than 1.00mm Seat Height SOH: .05 nominal Exposed Die Paddle Process , Resistance: IN Amkor 's FusionQuad® represents a breakthrough in leadframe-based plastic packaging , paddle. Y FusionQuad®: Amkor 's FusionQuad®VQFP ICpackage portfolio provides: · 12 x 12 mm to , , 1000 hours 150 °C, 1000 hours Applications: Amkor 's FusionQuad® provides an ideal package format


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JEDEC MS-026

Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: mm body thickness · Low stress die attach adhesive · Rapid cure mold compound · Power , Wafer backgrinding Available Mold Compound Gold Wire Leadframe Die Attach Pad Test , LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack (LQFP) Packages: Amkor , Boards Multi-Layer PCB Pkg 32 ld 100 ld 100 ld 144 ld 176 ld 208 ld* Applications: Amkor , . Amkor 's LQFP packaging portfolio provides: · 7 x 7 mm to 28 x 28 mm body size · 32 to 256 lead counts


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PDF MS-026 JEDEC MS-026 MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
CCL-HL832NX-A

Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS CCL-HL832NX GE-100-LFC GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Text: wire Cu wire: PCC Mold compound : Nitto GE100LFCS* (Au Wire) or Sumitomo G750 (Cu wire , ) Thermally Enhanced Mold Compound Test Services Program generation/conversion Product engineering , ): Amkor 's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This , maximizing the performance characteristics of semiconductors (silicon). Amkor 's PBGAs are designed for low , of Amkor 's PBGAs. Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics


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PDF CO-029) CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE100LFCS CCL-HL832NX GE-100-LFC GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
LMISR4

Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Text: Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA , Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh , : Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta


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PDF DS1685, LMISR4 J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
2009 - PCN0903

Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 EPC16UI88AA ablestik 2288a Ablestik 2025D sumitomo g700 type
Text: materials utilized by Amkor . These alternate materials include the mold compound , die attach epoxy, and , ) Package Type Mold Compound Die Attach Epoxy Kyocera G1270 Ablestik 2025D & QMI 536 UBGA 88 , CONFIGURATION FAMILY Change Description Altera is introducing Amkor , Philippines (ATP) and Amkor , Korea (ATK , multiple qualified locations. Amkor is an existing, fully qualified strategic manufacturing partner for , Additional Source ATP (Philippines) Item Package Type Existing Source ASEK (Taiwan) Mold


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PDF PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 EPC16UI88AA ablestik 2288a Ablestik 2025D sumitomo g700 type
JEDEC Jc-11 free

Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip mold cap 0.65mm pitch BGA Amkor Wafer level mold compound Amkor mold compound
Text: Encapsulant Epoxy mold compound Solder ball Pb free Test Services Program Generation / Conversion , : After three years of development in package stacking technology and infrastructure, Amkor launched the , , PSvfBGA had become the fastest growing new package platform in Amkor 's four decade history, reflecting the strong industry adoption of PoP and Amkor 's technology leadership. PSvfBGA supports single die , , which Amkor calls PSfcCSP. PSfcCSP has a thin exposed FC die enabling fine pitch stacked interfaces at


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PDF wirebon00 JEDEC Jc-11 free PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip mold cap 0.65mm pitch BGA Amkor Wafer level mold compound Amkor mold compound
sumitomo G700

Abstract: sumitomo epoxy 1076 0038 tsop Sumitomo 1076 8361J ablebond Die Attach epoxy stamping Compound c7025 sumitomo g700 type g700 mold compound
Text: available. Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound , Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size , : Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size , : Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond , : Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond


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2013 - Not Available

Abstract: No abstract text available
Text: — Strip test available Cross-sections Mold Compound Die Clear anti-static tube, 20 inch Tape , — ● Mold Compound Wirebond Cu Leadframe Die Attach Adhesive Die Die Attach , improved MSL capability ● Services and Support Amkor has a broad base of resources available to , testing and failure analysis Visit Amkor Technology online for locations and to view the most current , Results @ 100 MHz Reliability Qualification Amkor package qualification uses three independent


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PDF DS571J
2013 - PCN1205

Abstract: EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3
Text: Amkor and ASE. Altera also announced the use of Sumitomo mold compound for the Cyclone III and Cyclone , backwards compatible with existing devices. There is a slight increase to the mold compound coverage for , F780 package will transition to center pin gate mold and Sumitomo mold compound . 2. Samples for these , currently use pin gate mold , but will transition to Sumitomo mold compound . Table 1: Affected Product , the package “form” as the mold compound extends to the edge of the substrate; refer to Figure 1A


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PDF PCN1205; Reco0HF35I4 EP4SGX230HF35I4N EP4SGXHF35I3* EP4SGXKH40I3* EP4SGXKH40I3N* EP4SH40C2N* EP4SGF45I3* EP4SGX290NF45C2 PCN1205 EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3
GE100LFCS

Abstract: HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 AUS-308 JESD22-A110 HL832 nx-a
Text: : Cu wire Mold Compound : GE100LFCS Mold Compound : GE100LFCS Substrate: Aus308 HL832-NX-A , that IDT is adding Amkor , Philippines Die Technology as an alternate assembly facility for 8mm x 8 mm , Of Change: This notification is to advise our customers that IDT is adding Amkor , Philippines as an , : See Table below Description Existing Add Assembly Location SPIL, Taiwan Amkor


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PDF A1008-05 82V2082BFG 82V2082BFG8 CABGA-81 FPBGA-289 JESD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 GE100LFCS HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 AUS-308 JESD22-A110 HL832 nx-a
2004 - STMicroelectronics marking code date

Abstract: CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING
Text: bonding Mold Compound Type KE 3300 D G700 Toshiba Sumitomo Lead Finish Sn/Pb, 85/15 , Type Manufacturer Mould Compound Manufacturer Note: (*) "RoHS*" The AMKOR TSOP40 package is , , Singapore, location will be assembled in AMKOR , Shanghai, China, back-end location, and tested in both the ST Toa Payoh, Singapore, plant and AMKOR , Shanghai, location. The assembly location switch will be , growth of our customers on a long-term basis. In line with this commitment, the move to the AMKOR


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PDF MPG-EEP/04/578 M50FW, M50LPW, M50FLW TSOP40 MPG/EE/0086 MPG/EEP/04/450. STMicroelectronics marking code date CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING
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