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54112-106661000LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 66 Positions, 2.54mm (0.100in) Pitch. |
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10127721-066LF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 4.5mm Straight Tail (100u\\ Tin) plating, Non GW Compatible LCP, Black Color, Tray Packing. |
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10127721-066NPLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 4.5mm Straight Tail (100u\\ Tin) plating, Non GW Compatible LCP, Natural Color, Tray with PE Bag. |
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10127721-066TLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 4.5mm Straight Tail (100u\\ Tin) plating, Non GW Compatible LCP, Black Color,Tape and Reel without cap. |
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10127721-066SRLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 4.5mm Straight Tail (100u\\ Tin) plating, GW Compatible LCP, Natural Color,Tape and Reel with cap. |
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10127721-066GRLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 4.5mm Straight Tail (100u\\ Tin) plating, GW Compatible LCP, Black Color, Tape and Reel with cap. |
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