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2005 - Lead Free reflow soldering profile BGA

Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Text: 20050524 Application note AN10365_1 Contact information For additional information, please visit , AN10365 Surface mount reflow soldering description Rev. 01 - 24 May 2005 Application note , application note provides guidelines for the board mounting of IC packages. AN10365 Philips , : sales.addresses@www.semiconductors.philips.com AN10365 Application note © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 24 May 2005 2 of 26 AN10365 Philips Semiconductors Surface mount reflow


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PDF AN10365 AN10365 Lead Free reflow soldering profile BGA HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
2006 - Cu3Sn

Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Text: sales office addresses, please send an email to: sales.addresses@www.semiconductors.philips.com AN10365_2 , , provided that they are in accordance with the specifications. AN10365_2 Application note , of a PCB footprint, as found on the Philips Semiconductors web site. AN10365_2 Application , (SSOP20) AN10365_2 Application note © Koninklijke Philips Electronics N.V. 2006. All rights , . AN10365_2 Application note © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev


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PDF AN10365 AN10365 Cu3Sn Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
2008 - Cu3Sn

Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Text: : salesaddresses@nxp.com AN10365_3 Application note © NXP B.V. 2008. All rights reserved. Rev. 03 - 22 April , . AN10365_3 Application note © NXP B.V. 2008. All rights reserved. Rev. 03 - 22 April 2008 3 of , shows an example of a PCB footprint, as found on the NXP Semiconductors web site. AN10365_3 , 001aaf255 Fig 2. PCB footprint for the SOT266-1 package (SSOP20) AN10365_3 Application note , resist defined and partially Cu defined. AN10365_3 Application note © NXP B.V. 2008. All rights


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PDF AN10365 AN10365 Cu3Sn HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3
2012 - Cu3Sn

Abstract: ipc 610 non-wetting
Text: AN10365 Surface mount reflow soldering Rev. 6 - 30 July 2012 Application note Document , . NXP Semiconductors AN10365 Surface mount reflow soldering description Revision history Rev 06 , ://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com AN10365 All , . Application note Rev. 6 - 30 July 2012 2 of 31 NXP Semiconductors AN10365 Surface mount reflow , from bottom, via encroached from bottom AN10365 All information provided in this document is


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PDF AN10365 Cu3Sn ipc 610 non-wetting
2009 - AN10365

Abstract: ipc 610D JEDEC J-STD-033b.1 Cu3Sn SSOP20 LAND PATTERN J-STD-033b.1 Cu6Sn5 JEDEC J-STD-033b ipc 610 non-wetting J-STD-020D
Text: For sales office addresses, please send an email to: salesaddresses@nxp.com AN10365_4 Application , from bottom AN10365_4 Application note © NXP B.V. 2009. All rights reserved. Rev. 04 - 13 , site. AN10365_4 Application note © NXP B.V. 2009. All rights reserved. Rev. 04 - 13 August , (SSOP20) AN10365_4 Application note © NXP B.V. 2009. All rights reserved. Rev. 04 - 13 August , resist defined and partially Cu defined. AN10365_4 Application note © NXP B.V. 2009. All rights


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PDF AN10365 AN10365 ipc 610D JEDEC J-STD-033b.1 Cu3Sn SSOP20 LAND PATTERN J-STD-033b.1 Cu6Sn5 JEDEC J-STD-033b ipc 610 non-wetting J-STD-020D
2007 - UN-D1400

Abstract: WLCSP stencil design AN10439 EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14
Text: AN10365 (Surface mount reflow soldering description). AN10439 NXP Semiconductors Wafer Level , reflow soldering processes will be provided by reference to application note AN10365 (Surface mount reflow soldering description). It is strongly recommended to read AN10365 prior to, or in conjunction , . Assembly process The application note AN10365 describes the surface mounting assembly process. WLCSPs are , cannot be reused. Please take notice of chapter 'Inspection and repair' in application note AN10365 to


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PDF AN10439 AN10365 AN10439 UN-D1400 WLCSP stencil design EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14
2009 - WLCSP flip chip

Abstract: IP3338CX24 AN10439
Text: note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this , components For further information on temperature profiles, refer to application note AN10365 "Surface , . To reflow the solder, use the solder profile shown in application note AN10365 "Surface mount reflow


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PDF IP3337CX18 IP3337CX18 WLCSP flip chip IP3338CX24 AN10439
2007 - AN10439

Abstract: IP4064CX8LF ip4064cx8lf_ip4364cx8lf_1
Text: in application note AN10365 "Surface mount reflow soldering description". Wave soldering is not , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering


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PDF IP4064CX8/LF; IP4364CX8/LF IEC61000-4-2, IP4064CX8/LF IP4364CX8/LF AN10439 IP4064CX8LF ip4064cx8lf_ip4364cx8lf_1
2009 - IP5311CX5/LF

Abstract: WLCSP flip chip IP5311CX5 AN10439
Text: Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave , application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The stand off , AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning Cleaning can be done after reflow


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PDF IP5311CX5 IP5311CX5 IP5311CX5/LF WLCSP flip chip AN10439
2009 - WLCSP18

Abstract: AN10439
Text: "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning


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PDF IP4337CX18/LF IP4337CX18/LF IP4337CX18LF WLCSP18 AN10439
2009 - IP4338CX24

Abstract: AN10439
Text: note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this , AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The stand off between the , in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning


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PDF IP4338CX24/LF 10-channel IP4338CX24/LF IP4338CX24LF IP4338CX24 AN10439
2009 - IP3338CX24

Abstract: AN10439
Text: "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning


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PDF IP3338CX24 10-channel IP3338CX24 10-channel1 AN10439
2009 - wlcsp inspection

Abstract: No abstract text available
Text: note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this , AN10365 "Surface mount reflow soldering description". 8.3.1 Stand off The stand off between the , application note AN10365 "Surface mount reflow soldering description". 8.3.4 Cleaning Cleaning can be


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PDF IP4060CX16/LF IP4060CX16/LF IP4060CX16LF wlcsp inspection
2011 - NX2-00001

Abstract: No abstract text available
Text: "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering , AN10365 "Surface mount reflow soldering description". 14.3.4 Cleaning Cleaning can be done after , complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 , temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description". 16


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PDF LD6806 OT886. LD6806xxxH NX2-00001
2014 - transistor SMD MOSFET 2033

Abstract: No abstract text available
Text: technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface , AN10365 “Surface mount reflow soldering description”. 20. Soldering of WLCSP packages 20.1 , note AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface mount , information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering , , use the solder profile shown in application note AN10365 “Surface mount reflow soldering


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PDF PCF8883 PCF8883 transistor SMD MOSFET 2033
2011 - smd transistor 25H

Abstract: No abstract text available
Text: note AN10365 “Surface mount reflow soldering description”. Wave soldering is not suitable for , temperature profiles, refer to application note AN10365 “Surface mount reflow soldering descriptionâ , shown in application note AN10365 “Surface mount reflow soldering description”. 14.3.4 Cleaning , Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering , Application Note AN10365 “Surface mount reflow soldering description”. 16. Mounting 16.1 PCB design


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PDF LD6806 OT886. LD6806xxxH smd transistor 25H
2011 - NX2-00001

Abstract: LD6806 smd transistor 25H
Text: "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering , AN10365 "Surface mount reflow soldering description". 14.3.4 Cleaning Cleaning can be done after , complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 , temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description". 16


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PDF LD6806 OT886. LD6806xxxH NX2-00001 smd transistor 25H
2010 - SD card footprint PCB

Abstract: IP4350CX24 wlcsp inspection
Text: application note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount , For further information on temperature profiles, refer to application note AN10365 "Surface mount , the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering


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PDF IP4350CX24 IP4350CX24 SD card footprint PCB wlcsp inspection
2009 - IP5311CX5

Abstract: ip5311 AN10439
Text: AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this package. All , AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The stand off between the , solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering


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PDF IP5311CX5 IP5311CX5 integra12 ip5311 AN10439
2010 - IP3088CX10

Abstract: CX20 WLCSP10
Text: Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , shown in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning


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PDF IP3088CX5; IP3088CX10; IP3088CX15; IP3088CX20 IP3088CX5, IP3088CX10, IP3088CX15 IP3088CX20 IP3088CX10 CX20 WLCSP10
2012 - Not Available

Abstract: No abstract text available
Text: note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow , AN10365 "Surface mount reflow soldering description". 10.3.1 Stand off The stand off between the , profile shown in application note AN10365 "Surface mount reflow soldering description". 10.3.4 Cleaning


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PDF IP4340CX15
Not Available

Abstract: No abstract text available
Text: € and in application note AN10365 “Surface mount reflow soldering description”. Wave soldering is , application note AN10365 “Surface mount reflow soldering description”. 10.3.1 Stand off The stand off , AN10365 “Surface mount reflow soldering description”. 10.3.4 Cleaning Cleaning can be done after


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PDF IP4340CX15
2010 - IP5306CX8

Abstract: microphone filter AN10365
Text: note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow , information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering , , use the solder profile shown in application note AN10365 "Surface mount reflow soldering description


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PDF IP5306CX8 IP5306CX8 microphone filter AN10365
2010 - IP4064CX8

Abstract: IP4364CX8 wlcsp inspection
Text: "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , shown in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning


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PDF IP4064CX8; IP4364CX8; IP4366CX8 IP4064CX8, IP4364CX8 IP4366CX8 IP4064CX8 wlcsp inspection
2009 - portable dvd player schematic diagram of video

Abstract: class d power amplifier SA58672TK ipod repair SA58672UK MPZ1608S221A MO-229 HVSON10 BLM21PG221SN1 schematic circuit usb mp3 player
Text: found in Application Note AN10365 "Surface mount reflow soldering description". 14.1 Introduction to , AN10365 "Surface mount reflow soldering description". 15. Soldering of WLCSP packages 15.1 , note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow , application note AN10365 "Surface mount reflow soldering description". 15.3.1 Stand off The stand off , the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering


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PDF SA58672 SA58672 10-terminal portable dvd player schematic diagram of video class d power amplifier SA58672TK ipod repair SA58672UK MPZ1608S221A MO-229 HVSON10 BLM21PG221SN1 schematic circuit usb mp3 player
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