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ALIVH datasheet (1)

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ALIVH Panasonic Accessories, Printed Wiring Board Original PDF

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ALIVH

Abstract: ml 94v-0 E36779
Text: Series: Type: ALIVH¨ ALIVHB Japan s - 10721 - mm 80.90 60.70 40.40 20.15 18 150 250 50/50Pad 40/40 4.0 1.4 198DMA 9 s q q q 1MHz Tg CTE m m m m - g/mL ppm/ s q MCMCSPBGA s UL (File No. E36779) UL ANSI Grade (mm) (mm) (mm) (mm) (¡C) (s) (¡C) EBKN1 B 94V-0 Ñ 0.305 0.051 0.102 19.8 260 20 120 UL s ALIVH CSP MCM s MCM CSP MCM ALIVHB ALIVH SMD s q q ACF, C4, SBB, " ALIVH ® " -


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PDF 50/50Pad 198DMA E36779) ALIVH ml 94v-0 E36779
EBKN7 94v-0

Abstract: EBKN7 ALIVH FR4 dielectric constant 4.6 ALIVH-G
Text: Printed Wiring Board Japan Series: ALIVHTM Type: ALIVHTM C-type Combination of ALVHTM G , Outer Layer's land have a higher pull strength than " ALIVHTM G-type" RoHS Compliant Item Base , Line/Space µm Build-up Dielectric Constant - (1 GHz) Recommended Applications ALIVHTM , g/mL 2.0 Recognized Standards UL Standard (File No. E36779) Type : ALIVH C-Type , . Construction ALIVH G Type ALIVH C Type Core ( ALIVH G-type Base) Build-up layer ALIVH G-type + Build


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PDF E36779) EBKN7 94v-0 EBKN7 ALIVH FR4 dielectric constant 4.6 ALIVH-G
EBKN7 94v-0

Abstract: EBKN7 ALIVH FR4 dielectric constant 4.6 ALIVH-G multilayer GHz -20/EBKN7 94v-0
Text: Printed Wiring Board Japan ¨ Series: ALIVH Type: ALIVH G Any layer IVH structure Multilayer Printed Wiring Board adopts a base material made of woven glass-epoxy resin. ÒALIVH GÓ have a , ALIVH technology. q Easy to design, for shorter design lead time. Items Unit Via Hole Size , modulus GPa 24(´2 Compared to ALIVH ) Land adhesion strength Mobile phone Digital Still Camera , Recommended Applications Line/Space N/2mm1 23(´1.4 Compared to ALIVH ) s Recognized Standards UL


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PDF UL94V-0 40ring EBKN7 94v-0 EBKN7 ALIVH FR4 dielectric constant 4.6 ALIVH-G multilayer GHz -20/EBKN7 94v-0
ALIVH

Abstract: aramid E36779
Text: Printed Wiring Board Japan Series: ALIVH Type: ALIVH Any Layer IVH structure Multilayer Printed Wiring Board adopts a base material made of nonwoven aramid and interconnects between arbitrary layers by filling the small via hole formed by laser with copper paste. Industrial Property ; Patent 153 n Properties Non-woven aramid fabric-epoxy resin Base Material n Features 8 Layer , . nBenefit of Any Layer IVH Structure Conventional PWB Through-hole Structure Device ALIVH Solder


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EBKN7 94v-0

Abstract: EBKN7 ALIVH ml 94v-0 FR4 dielectric constant 4.6 UL 94v-0 board fr4 94v0 ALIVH-G A/EBKN7 94v-0
Text: Printed Wiring Board Japan Taiwan Series: ALIVHTM Type: ALIVHTM Any Layer IVH structure , . Industrial Property ; Pending Application ­ 130 Registered Patents ­ 50 Type: ALIVHTM G-Type , ALIVHTM G-Type Non-woven aramid Glass-epoxy resin fabric-epoxy resin Base Material Smaller , PC cards µm Via Pad Size Recommended Applications ALIVHTM g/mL 1.4 2.0 Recognized Standards UL Standard (File No. E36779) Type : ALIVH Production site Type UL


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ALIVH

Abstract: 15D18
Text: Printed Wiring Board Series: ALIVH¨ Type: Japan ALIVIL "ALIVIL" have a high pattern accommodation by building "VIL" on any layer IVH structure " ALIVH " s Property of Product q q q q q q q q q q Mobile phone Digital video camera Digital still camera Notebook type Personal , Development Concept Any Layer IVH Build-up ALIVH+VIL Technology Integration Integration Core Layers , 0.019 Density s Recommended Applications ALIVH G(Core Layers) Dielectric constant (1 GHz


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ALIVH

Abstract: E36779 8095 1072-1 .B- 94v-0 ml 94v-0
Text: Series: Type: ALIVH¨ ALIVH Japan 10721 n 1MHz - mm m m m - g/mL 80.95 60.70 150 300 60/70 4.1 1.4 n l l n l l l n UL (File No. E36779) UL ANSI Grade (mm) (mm) (mm) (mm) (¡C) (s) (¡C) EBKN1 B 94V-0 Ñ 0.305 0.051 0.102 19.8 260 20 120 UL n IVH ALIVH IVH 100 ALIVHâ -


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PDF E36779) ALIVH E36779 8095 1072-1 .B- 94v-0 ml 94v-0
ALIVH

Abstract: E36779 min60 aramid
Text: Printed Wiring Board Japan Series: ALIVH Type: ALIVH Any Layer IVH structure Multilayer Printed Wiring Board adopts a base material made of nonwoven aramid and interconnects between arbitrary layers by filling the small via hole formed by laser with copper paste. Industrial Property ; Patent 128 s Properties Non-woven aramid fabric-epoxy resin Base Material 8 Layers:0.95 , Conventional PWB ALIVH Through-hole Structure Any Layer IVH Structure Unable to package on


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PDF E36779) ALIVH E36779 min60 aramid
1998 - ALIVH

Abstract: No abstract text available
Text: Printed Wiring Board ALIVH ® for Bare Chip Mounting Development of new application Industry/Field: AV,OA/Information,Mobile communication The most suitable for Bare Chip Mounting · Development goals: High density, low impedance and high reliability Substrate q Suitable for Substrate of BGA, CSP and MCM q · Features: High density by any layer L/S=50/50µm Low impedance by via in pad and , L/S ALIVH MCM Via Pad Density (g/cc) Tg (°C) CTE (ppm/°C) MST (JEDEL Level 2) PCT ·


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PDF 168hr 168hr ALIVH
ALIVH

Abstract: 2 94v-0 board aramid E36779
Text: Printed Wiring Board Japan Series: ALIVH Type: ALIVH-B Any Layer IVH structure Multilayer Printed Wiring Board adopts a base material made of high heat resistance nonwoven aramid and interconnects between arbitrary layers by filling the small via hole formed by laser with copper paste. Industrial Property ; Patent 128 s Properties Non-woven aramid fabric-epoxy resin Base Material 8 , 120 These values are not for PWB designing. s ALIVH for Bare chip mounting s Application q


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PDF Pad40/40) E36779) ALIVH 2 94v-0 board aramid E36779
1998 - ALIVH

Abstract: No abstract text available
Text: ® µ µ µ µ µ ALIVH 1 2 3 E K W Panasonic


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2008 - ALIVH PCB

Abstract: ALIVH JESD22-B111 1NSMD IPC-SM-785 AN-1412 JESD22B111
Text: RCC ALIVH Note 7: 2mm 3mm 5. PCB : PCB PCB / PCB www.national.com/jpn


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PDF 34Figure AN-1412 ALIVH PCB ALIVH JESD22-B111 1NSMD IPC-SM-785 AN-1412 JESD22B111
2010 - IPC-SM-785

Abstract: ALIVH JESD22-B111 pitch 0.4mm BGA JESD22B111 AN-1412 1NSMD ALIVH PCB
Text: 5: PCB : ENIG Note 6: PCB RCC ALIVH Note 7: 2mm 3mm 7


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PDF AN-1412 IPC-SM-785 ALIVH JESD22-B111 pitch 0.4mm BGA JESD22B111 AN-1412 1NSMD ALIVH PCB
2007 - ALIVH

Abstract: 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA 185M SMD CODE SMD Devices wlcsp SMT
Text: : PCB RCC ALIVH 9 www.national.com/jpn/ AN-1112 ( ) FIGURE 10. Flex Test PCB Layout


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PDF AN-1112 ALIVH 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA 185M SMD CODE SMD Devices wlcsp SMT
2010 - JESD22-B111

Abstract: JESD22B111 IPC-SM-785 ALIVH PCB ALIVH IPC-SM785 AN-1412 1412 SMD NI
Text: 5: PCB : ENIG Note 6: PCB RCC ALIVH Note 7: 2mm 3mm 7


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PDF AN-1412 JESD22-B111 JESD22B111 IPC-SM-785 ALIVH PCB ALIVH IPC-SM785 AN-1412 1412 SMD NI
2010 - AN-1112

Abstract: 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national
Text: 4: First Fails : PCB Note 5: PCB : ENIG Note 6: PCB RCC ALIVH FIGURE


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PDF AN-1112 AN-1112 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national
2010 - 0.3mm pitch csp package

Abstract: 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA AN1112 ic micro ALIVH
Text: 4: First Fails : PCB Note 5: PCB : ENIG Note 6: PCB RCC ALIVH FIGURE


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PDF AN-1112 0.3mm pitch csp package 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA AN1112 ic micro ALIVH
2007 - JESD22-B111

Abstract: ALIVH national semiconductor pb-free marking AN-1412 B111 JESD22 JESD22B111 400um ALIVH PCB
Text: , Immersion Gold) Note 6: Test is not sensitive to PCB build-up type (RCC or ALIVH ) Note 7: 2 mm & 3 mm


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PDF AN-1412 JESD22-B111 ALIVH national semiconductor pb-free marking AN-1412 B111 JESD22 JESD22B111 400um ALIVH PCB
2006 - ALIVH

Abstract: pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball
Text: build-up type (RCC or ALIVH ) Note 7: 2 mm & 3 mm displacement are accelerated test deflection levels, not


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PDF AN-1412 ALIVH pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball
2009 - ALIVH

Abstract: JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement
Text: , Immersion Gold) Note 6: Test is not sensitive to PCB build-up type (RCC or ALIVH ) Note 7: 2 mm & 3 mm


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PDF AN-1412 ALIVH JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement
2007 - ALIVH

Abstract: national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING
Text: sensitive to PCB build-up type (RCC or ALIVH ) 9 www.national.com AN-1112 10092662 FIGURE 10


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PDF AN-1112 ALIVH national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING
2005 - ALIVH

Abstract: HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
Text: sensitive to PCB build-up type (RCC or ALIVH ) www.national.com 8 Not Recommended AN


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PDF CSP-9-111S2) CSP-9-111S2. AN-1112 ALIVH HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
2010 - ALIVH

Abstract: AN-1112 AN1112 ALIVH PCB joint JESD51-3
Text: (RCC or ALIVH ) www.national.com 10 Not Recommended AN-1112 10092662 FIGURE 12. Flex


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PDF AN-1112 ALIVH AN-1112 AN1112 ALIVH PCB joint JESD51-3
2009 - ALIVH

Abstract: WLCSP smt 250 B 340 smd Transistor national semiconductor pb-free marking AN-1112 WLCSP stencil design smd marking code eg smd diode ED MARKING SMD IC CODE 9221 MARKING
Text: : Test is not sensitive to PCB build-up type (RCC or ALIVH ) 10092662 FIGURE 11. Flex Test PCB


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PDF AN-1112 ALIVH WLCSP smt 250 B 340 smd Transistor national semiconductor pb-free marking AN-1112 WLCSP stencil design smd marking code eg smd diode ED MARKING SMD IC CODE 9221 MARKING
2010 - AN-1112

Abstract: ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC
Text: (Electroless Ni, Immersion Gold) Note 6: Test is not sensitive to PCB build-up type (RCC or ALIVH


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PDF AN-1112 AN-1112 ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC
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