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2006 - Not Available

Abstract: No abstract text available
Text: A3RS91.1 High Power Chip Termination 100 Watts When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power capabilities to meet the demands of today's CDMA and WCDMA system requirements. Aluminum Nitride is featured for those , * Refer to average power derating curve chart. TYPICAL PERFORMANCE A3RS91.1 .050 [1,27] .040 REF


Original
PDF A3RS91 350REF
2007 - Not Available

Abstract: No abstract text available
Text: A3RS91 .1 High Power Chip Termination 1 00 Watts When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power capabilities to meet the demands of today's CDMA and WCDMA system requirements. Aluminum Nitride is featured for , * Refer to average power derating curve chart. TYPICAL PERFORMANCE A3RS91 .1 .050 [1,27] .040


Original
PDF A3RS91 350REF
2011 - A3RS91

Abstract: No abstract text available
Text: A3RS91.1 High Power Chip Termination 100 Watts When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power capabilities to meet the demands of today's CDMA and WCDMA system requirements. Aluminum Nitride is featured for those , curve chart. TYPICAL PERFORMANCE A3RS91.1 .050 [1,27] .040 REF [1,02] WRAP AROUND


Original
PDF A3RS91 350REF
2006 - nitride

Abstract: kdiresistor
Text: A3RS91.1 High Power Chip Termination RoHS 100 Watts When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power capabilities to meet the demands of today's CDMA and WCDMA system requirements. Aluminum Nitride is featured , . TYPICAL PERFORMANCE .050 [1,27] .040 REF [1,02] A3RS91.1 WRAP AROUND AVERAGE POWER


Original
PDF A3RS91 350REF nitride kdiresistor
2005 - Aeroflex KDI Resistor

Abstract: ppt 0020 A PPT Series 003-001
Text: A3RS91 .1 High Power Chip Termination 1 00 Watts When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power capabilities to meet the demands of today's CDMA and WCDMA system requirements. Aluminum Nitride is featured for , * Refer to average power derating curve chart. TYPICAL PERFORMANCE A3RS91 .1 .050 [1,27] .040


Original
PDF A3RS91 PCX050-F-150, PCX050-M-150, PCX100-F-150, PCX100-M-150, Aeroflex KDI Resistor ppt 0020 A PPT Series 003-001
2005 - Not Available

Abstract: No abstract text available
Text: A3RS91 .1 High Power Chip Termination 1 Watts 00 When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power capabilities to meet the demands of today's CDMA and WCDMA system requirements. Aluminum Nitride is featured , curve chart. TYPICAL PERFORMANCE .050 [1,27] .040 REF [1,02] A3RS91 .1 WRAP AROUND


Original
PDF A3RS91 PCX100-M-150, PCX050-M-50
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