ZINC SULFIDE Search Results

Contextual Info: HM41-10812LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM41-12020LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM67-B5R0LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 2 3 4 5 ADHESIVE WIRE BODY SOLDER Epoxy NY UEW-H Header Lead Free Solder Element Composition Nickel Zinc Ferrite Manganese-Zinc Bisphenol Type Epoxy Resin

Contextual Info: HM41-11510LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM41-20105LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM41-21010LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM85-37102LF summary material content, BI Technologies Corporation Index 1 Item CORE Material Name Element Composition Ferric Oxide Zinc Oxide Toroid Core ACME Nickel Oxide Cupric Oxide Bisphenol F Epoxy Resin Latent Hardener Hardener Modified Epoxy Resin

Contextual Info: Multilayer Varistors Multilayer Varistors Chip Type EZJZ (Zinc Oxide) Series: EZJS (Strontium Titanate) Series: Handling Precautions Safety Precautions The Multilayer Varistors (hereafter referred to as “The Varistors”) may fail in a short circuit mode or in an

MatsuSHITA VARISTORS

Abstract: varistors matsushita chip varistor H63A RC-1009B active Zinc oxide "chip varistor"
Contextual Info: CLASSIFICATION SPECIFICATION SUBJECT MULTILAYER VARISTOR CHIP TYPE Zinc Oxide TEST METHOD (COMMON SPECIFICATION) Characteristics Standard test condition No. 151S-EZJZ-S-C01 6-2 Test Method Unless otherwise specified all test and measurements shall be made at a temperature

conductive plastic pot

Contextual Info: MATERIAL DECLARATION SHEET Model # 3900 Pot/ Push momentary Product Line Single turn panel control with switch Posted Date Compliance Date Q1 / 2005 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Body PPS 0.48 2 Bushing Zinc Alloy

Contextual Info: HM31-20050LF summary material content, BI Technologies Corporation Index Item Material Name Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide Material Mass mg Composition (mg) 1309-37-1 8051-03-4 1313-99-1 1317-38-0 2410 2048.5 120.5

Contextual Info: HM31-21050LF summary material content, BI Technologies Corporation Index Item Material Name Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide Material Mass mg Composition (mg) 1309-37-1 8051-03-4 1313-99-1 1317-38-0 1870 1589.5 93.5 93.5

Contextual Info: Optical Encoders 2: 100g for 6 mS, sawtooth wave with velocity change of 9.7 ft/s. Materials and Finishes Bushing: Cast zinc, nickel-plated Code Housing: Hiloy 610B Shaft: Stainless steel Rotor: Nylon Retaining Ring: Stainless steel Code Rotor and Aperture: Chemically etched

Contextual Info: HM31-30050LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 2 ADHESIVE Jet Melt NY UEW-H 3 WIRE TC-WIRE 4 BODY Holder 5 SOLDER Lead Free Solder Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide

Contextual Info: HM31-31050LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 2 ADHESIVE Jet Melt NY UEW-H 3 WIRE TC-WIRE 4 BODY Holder 5 SOLDER Lead Free Solder Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide

stahl

Abstract: 204209-1 din 41618 3C87-5 3c87
Contextual Info: AM AMP “M”-Serie AMP “M ”-Series | | ] i i j I ! “ M”-Serie-Produkte haben ihre unLibertroffene Zuverlassigkeit und Preiswurdigkeit in kommerziellen und militarischen Anwendungen seit vielen Jahren bewiesen. “ M”Serie Steckverbinder werden in

Contextual Info: MATERIAL DECLARATION SHEET Material Number 3547S Product Line Precision Potentiometer Compliance Date January 31, 2007 RoHS Compliant Yes No. 1 2 3 4 Construction Element subpart Wiper Terminal Cover Slider Contact Spring Headquarters Riverside CA MSL N/A

"Material Declaration Sheet"

Contextual Info: MATERIAL DECLARATION SHEET Material Number 3543S-L Product Line Precision Potentiometer Compliance Date May 31, 2006 RoHS Compliant Yes No. Construction Element subpart 1 Mandrel MSL N/A if applicable Materials Mass % Copper 0.676 Copper 7440-22-4 Coating

3549H

Contextual Info: MATERIAL DECLARATION SHEET Material Number 3549H Product Line Precision Potentiometer Compliance Date January 31, 2007 RoHS Compliant Yes No. 1 2 3 4 Construction Element subpart Wiper Terminal Cover Slider Contact Spring Headquarters Riverside CA MSL N/A

901-675

Contextual Info: MATERIAL DECLARATION SHEET Material Number 3548S Product Line Precision Potentiometer Compliance Date January 31, 2007 RoHS Compliant Yes No. 1 2 3 4 Construction Element subpart Wiper Terminal Cover Slider Contact Spring Headquarters Riverside CA MSL N/A

CONDUCTIVE INK

Abstract: C17200
Contextual Info: MATERIAL DECLARATION SHEET Model # 3900 Pot/Rotary Switch Product Line Single turn panel control with switch Posted Date Compliance Date Q1 / 2005 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Body PPS 0.48 Materials CAS

cyclohexene

Abstract: 82306 1010218 urea formaldehyde resin adhesive tetrabutyl tin zinc naphthenate hydroquinone manufacturing process calcium chloride p-chlorophenol pentaerythritol
Contextual Info: Matsushita Electric Group Chemical Substance Management Rank Guidelines Version 2 July 6, 2000 Matsushita Electric Industrial Co., Ltd. Contents 1. Purpose ････････････････････････････････････････････････････････1

Contextual Info: MATERIAL DECLARATION SHEET Material Number 39 Product Line Panel Controls Compliance Date March 31, 2005 RoHS Compliant Yes MSL N/A if applicable Materials Mass % Material Mass % of total unit wt. Subpart mass of total wt. % 17870-96-6 100 12.129 12.129

Contextual Info: MATERIAL DECLARATION SHEET Material Number 3545S-L Product Line Precision Potentiometer Compliance Date May 31, 2006 RoHS Compliant Yes No. Construction Element subpart 1 Mandrel MSL N/A if applicable Materials Mass % Copper 1.13 Copper 7440-22-4 Coating