ZIF SOCKET 1.27MM PITCH Search Results

Contextual Info: m o l e x 1.27mm .050" Pitch ZIF PGA Socket Sockets and Edge Connectors FEATURES AND SPECIFICATIONS Features and Benefits Electrical • Size 321 circuits ■ Accepts Intel Pentium P55CT 3V microprocessors ■ ZIF actuator enables easy replaCement/upgrade of

17X17

Contextual Info: 74.00mm [2.913"] 45.20mm [1.780"] 27.58mm [1.086"] 55.00mm [2.165"] Top View Bottom View LGA Package 25.40mm [1.000"] 1.27mm pitch 1.16mm 23mm Side View Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"],

socket 754

Abstract: "Socket 754"
Contextual Info: 10 CLOSED CONDITION QUALITY SYMBOLS Y=0 P/N CO N TACT A R E A GOLD PLA TIN G 05 v = ° : </] : 67766-1002 LEAD FREE 67 7 6 6 - 0 0 0 2 'tb .fra m e .A B .P .A M .T Rev. D 2004/06/28 15 MICROINCH ‘“ y Z D o ; m 3 D0^ uj □ u 4 PLACES 3 PLACES ± — 2 PLACES ±0.25

PGA socket 479

Contextual Info: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: Replacement Part Number: 0471719110 Obsolete 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)

PA-SOD-2006-D310-08/2

Abstract: PA-SOD-2006-D310-14/2 PA-SOD-2006-D310-16/2 PA-SOD-2006-D310-18/2 PA-SOD-2006-D310-20/2 SOD2006-2
Contextual Info: PA-SOD-2006-D310-xx/2 Data Sheet 8-20 pin SO socket/8-20 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 4.9mm - 5.4mm and lead pitch of 1.27mm can be socketed over their PCB footprints.

Contextual Info: SPECIFICATIONS mPGA604 socket BGA Series CPU Socket Vertical, SMT Type 1.27mm [.050”] Pitch 604 Pos. Mechanical Contact Retention Force: 0.13Kg min. Durability: 50 Cycles Electrical Contact Resistance: 25mΩ max. Dielectric Withstanding Voltage: 360V VRMS min.

PA-DSO-1403

Abstract: PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6
Contextual Info: DIP to SO-Plug Prototyping Adapter Kits These adapters will convert a small outline land pattern to a DIP package. The adapter provides a solder down SOplug on the bottom and a detachable 300 or 600 mil wide open-frame DIP socket on the top. They are also available

Contextual Info: PA28SO1-15B-3 6 Data Sheet 28 pin SO socket/28 pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, 28 pin SO packages with a body width of 8.6mm - 9.1mm and lead pitch 1.27mm can be programmed on DIP programmers.

Contextual Info: Electronics Micro PGA 700 Position Socket DESCRIPTION 05/02 1654000 A P P LIC A T IO N This socket is for the next generation IA-64 Intel Architecture - 64 bit Itanium (McKinley) servers and workstations. K EY FEA TU R ES_H • 1.27mm x 1.27mm contact spacing.

amp pga socket

Abstract: zif socket 1.27mm pitch amp micro pga socket 1364657-2
Contextual Info: Micro PGA 700 Position Socket 05/02 DESCRIPTION 1654000 APPLICATION This socket is for the next generation IA-64 Intel Architecture – 64 bit Itanium (McKinley) servers and workstations. KEY FEATURES • 1.27mm x 1.27mm contact spacing. • Zero Insertion Force for device socketing.

intel xeon socket 604

Abstract: amp pga socket zif socket 1.27mm pitch pga socket 604 amp micro pga socket PGA604 PGA zif socket
Contextual Info: Micro PGA 604 Position Socket 02/02 DESCRIPTION 1309305 DESCRIPTION This socket is for the next generation IA-32 Intel Architecture – 32 bit XEON servers and workstations. This socket will replace the current Micro PGA 603 position socket, P/Ns 1364448, 1364994 and 1364674.

Turn-Key

Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Contextual Info:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25

ht 13003

Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196
Contextual Info: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature

CA-SO16B-Z-J-T-01

Contextual Info: 39.37mm [1.550"] 2.86mm typ. [0.113"] 26.97mm [1.062"] Top View 3 16.48mm [0.649"] 9.97mm [0.393"] 1 1 28.23mm[1.111"] assembled 6.03mm [0.237"] 2 Side View 1.27mm typ. [0.050"] 9.93mm [0.391"] End View 1.27mm typ. [0.050"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

Socket 754

Contextual Info: 't b _ fr a m e _ A 3 _ P _ A M _ T Rev. □ 2 0 0 4 / 0 6 / 2 8 o o o □o -nt> 1 o zo I o m o o o a K r - M cn c_> i u m o r~ o Tl I > 7) _L Tl I> <n I l- Z - l n C) / H > n H fTI n iu 2.42 co VÛ o UJ u I > H > ~7 X I CD I II > ï l ï ï ï ï l H n

3.5mm PCB SMA

Abstract: 3.5MM JACK SOCKETS, PCB MOUNT xlr to mini jack 6.35mm 4 pin pcb mount jack DVI-D connector LOW PROFILE VERTICAL 6.35mm jack pcb 2.1mm DC power jack 6.35mm jack sma straight pcb mount DVI-I smd connectors
Contextual Info: CONNECTORS PRODUCT OVERVIEW A brief overview of the large range of products appearing in the Connectors section. PCB INTERCONNECT SIGNAL/DATA D SUB-MIN HEADERS/SOCKETS ● Commercial, industrial & high density ranges ● 2mm and 2.54mm pitches ● 9 to 50 way types

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits • 495 circuit for Mobile Pentium* III processors ■ Ultra low profile of 2.00mm .079" ■ Over 60% PCB space savings versus previous module-style mobile processor packaging ■ Easy-to-use cam mechanism provides smooth contact

A7647

Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Contextual Info: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package

Contextual Info: 48.26mm [1.900"] 2.54mm typ. [0.100"] 48.26mm [1.900"] Top View 20.89mm [0.823"] 3 1 32.73mm Assembled [1.289"] 6.03mm [0.237"] 2 1.27mm [0.050"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

CA-SO16B-Z-J-01

Contextual Info: 26.97mm [1.062"] Pin 1 25.40mm [1.000"] Top View 1 28.22mm[1.111"] assembled 2 5.71mm[0.225"] assembled 3 9.93mm [0.391"] 1.27mm typ. [0.050"] End View Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

snap on tools for electronic

Abstract: E41447 diagram JC20-J68S-NC2 pcb connectors SAEJ1962 JC26A-FSN16 JC26A-BB16-E800 JC20-J68S-NB2 FRC connector availability IL-402R
Contextual Info: Short Form Catalog Connector Products Introduction J apan Aviation Electronics Industry, Ltd. JAE is an international manufacturer and supplier of electronic components and systems. For over four decades, JAE has provided the electronics industry with solutions to complex design requirements.

CA-SO18A-Z-J-T-01

Contextual Info: 39.37mm [1.550"] 2.54mm typ. [0.100"] 26.97mm [1.062"] Top View 4 9.97mm [0.393"] 1 5.78mm [0.227"] 3 27.94mm[1.100"] assembled 2 9.93mm [0.391"] 0.43mm typ. [0.017"] Side View End View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

CA-SO20D-Z-J-T-01

Contextual Info: 29.97mm [1.180"] 22.86mm [0.900"] 2.54mm typ. [0.100"] Top View 5 1 3 26.40mm[1.039"] assembled 2 11.47mm[0.452"] assembled 4 0.43mm typ. [0.017"] 8.66mm [0.341"] End View Side View 1.27mm typ. [0.050"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

CA-SO28A-Z-J-T-01

Contextual Info: 40.64mm [1.600"] 2.54mm typ. [0.100"] 26.97mm [1.062"] 22.86mm [0.900"] 7.49mm 10.32mm Top View 5 16.48mm [0.649"] 9.97mm [0.393"] 1 5.80mm [0.229"] 3 2 5.70mm[0.224"] assembled 4 0.43mm typ.[0.017"] 9.93mm [0.391"] End View Side View 1.27mm typ.[0.050"] Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]