ZD 5.6 Search Results

18MM

Contextual Info: 107-68729 Packaging Specification 08Feb09 Rev B HM-ZD VERT RECPT ASSY 18MM 1. PURPOSE 目的 Define the packaging specifiction and packaging method of HM-ZD VERT RECPT ASSY 18MM . 订定 HM-ZD VERT RECPT ASSY 18MM 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

114-1103 tyco

Abstract: 114-13059 Loctite 472 20GC015-1 LOCTITE 307 1469287-1 hmzd connector loctite 3616
Contextual Info: High Speed Backplane Connectors Table of Contents Z-PACK HM-Zd Connector 1 Product Line Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Z-PACK HM-Zd Connector 4, 3, and 2 Pair Right Angle Receptacle Assemblies . . . . . . . . . . . . . .7-9

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. ZR Smaller ZD Specifications Item Performance Characteristics

MCR 22-b

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. ZR Smaller ZD Specifications Item Performance Characteristics

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. ZR Smaller ZD Specifications Item Performance Characteristics

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. ZR Smaller ZD Specifications Item Performance Characteristics

tyco mep 6t

Abstract: bmep-5t setup instructions bmep 3t MEP-12T bmep 5t 114-1103 tyco 91378-1 1469025-2 bmep 12t ZD 222
Contextual Info: Z- PACK* Hard Metric HM- Zd and HM- Zd Plus 2- , 3- , and 4- Pair Connector Systems NOTE Application Specification 114- 13059 29 MAR 10 Rev J All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless

msds lubricant

Abstract: hmzd connector bmep 5t tyco mep 6t calling card thickness bmep 6t bmep 3t BMEP 13059 extraction tools tyco
Contextual Info: Z- PACK* Hard Metric HM- Zd and HM- Zd Plus 2- , 3- , and 4- Pair Connector Systems Application Specification 114- 13059 22 AUG 11 Rev L All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless

ZD75-0524

Abstract: ZD75-0024 ZD120-1205 ZD75-0512 EMI FILTER 24V ZD50 ZD50-1205 ZD120 24v dual power supply Power Supply Board 24V 5V
Contextual Info: ZD-SERIES Dual output 30W ~ 120W Ⅵ Model name ZD 30-2405 [ex.] 24 05 Nominal output voltage CH1: 24V output Name of series Output power CH2: 5V output PC Board Type Power Supply Ⅵ Features ZD30 ZD50 ZD75 ZD120 Low Voltage Directive 1 year warranty ⅷ

ZD75-0524

Abstract: ZD120-2405 Densei-Lambda WIRE JUMPER ZD75 8v2a
Contextual Info: LAMBDAA _ _ ZD-SERIES DENSEI-LAMBDA Dual output 30W ~ 120W • Model name ZD 30-2405 [«■] 24 05 | | Nominal output voltage CH1: 24V output Name of series Output power j CH2:5V output PC Board Type Power Supply ■ Features • C € marking Low Voltage Directive

20GC015-1

Contextual Info: METRIC Dimensions are millimeters Z-PACK HM-Zd Catalog 1308658 Issued 11-02 Product Facts • Z-PACK HM-Zd is an extension of the Z-PACK 2mm HM product line ■ Designed specifically for high speed differential applications ■ A modular connector system with a standard module size

1469001-1

Abstract: Z-PACK 20GC015-1 150TYP
Contextual Info: METRIC Dimensions are millimeters Z-PACK HM-Zd Catalog 1308658 Issued 12-01 Product Facts • Z-PACK HM-Zd is an extension of the Z-PACK 2mm HM product line ■ Designed specifically for high speed differential applications ■ A modular connector system with a standard module size

DZC50

Abstract: DZB10C DZB11C DZB15C DZB20C DZB22C DZB24C DZB27C
Contextual Info: DZB15C DZB18C DZB20C D2B16C DZB22C DZB24C DZB27C D Z C 50 DZB30C D Z C 30 DZD2. 0 DZD2. 2 D Z D 2 .4 DZD2. 7 D Z D 3 .0 DZD3. 3 D Z D 3 .6 D Z D 3 .9 D ZD 4.3 o o o o o C~i S'S N N N O O ^ O O D Z D 4 .7 DZD8. 2 D Z D 9 .1 D ZD 10 DZD 11 D ZD 12 n m n o o

BB639E7904

Abstract: DZC30 DZB10C DZB11C DZB15C DZB20C DZB22C DZB24C DZB27C
Contextual Info: DZB15C DZB18C DZB20C D2B16C DZB22C DZB24C DZB27C D Z C 50 DZB30C D Z C 30 DZD2. 0 DZD2. 2 D Z D 2 .4 DZD2. 7 D Z D 3 .0 DZD3. 3 D Z D 3 .6 D Z D 3 .9 D ZD 4.3 o o o o o C~i S'S N N N O O ^ O O D Z D 4 .7 DZD8. 2 D Z D 9 .1 D ZD 10 DZD 11 D ZD 12 n m n o o

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2002/95/EC .

24P2F-A

Abstract: 24P2F
Contextual Info: JEITA Package Code P-LSSOP24-5.6x7.8-0.65 RENESAS Code PLSP0024JB-A Previous Code 24P2F-A 13 *1 E HE 24 MASS[Typ.] 0.1g NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. F Reference Symbol 12 1 ZD

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2011/65/EU .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. Adapted to the RoHS directive 2002/95/EC . ZR Smaller

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2002/95/EC .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2002/95/EC .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. Adapted to the RoHS directive 2002/95/EC . ZR Smaller

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. Adapted to the RoHS directive 2002/95/EC . ZR Smaller

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2002/95/EC .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2011/65/EU .