ZD 4.1 Search Results

Contextual Info: 108-2409 Product Specification 29JUN12 Rev D FORTIS ZD* Modular Connector System 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the FORTIS ZD Connector. The FORTIS ZD is a modular right-angle connector designed for use in the Aerospace, Defense, and

114-1103 tyco

Abstract: 114-13059 Loctite 472 20GC015-1 LOCTITE 307 1469287-1 hmzd connector loctite 3616
Contextual Info: High Speed Backplane Connectors Table of Contents Z-PACK HM-Zd Connector 1 Product Line Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Z-PACK HM-Zd Connector 4, 3, and 2 Pair Right Angle Receptacle Assemblies . . . . . . . . . . . . . .7-9

Contextual Info: Instruction Sheet Seating Tools 91348- [ ], 91349- [ ], and 91375- [ ] for Hard Metric HM - Zd Header Connectors 408- 8501 21 JUN 10 Rev G Adapter Blade with Key(s) HM- Zd Header Connector (Ref) Printed Circuit (PC) Board Eye- of- Needle Contacts SEATING

Contextual Info: Instruction Sheet 408-8644 HM-Zd Receptacle Removal Tools 1583224-[ ] 1. INTRODUCTION 09 FEB 09 Rev B HM-Zd Receptacle HM–Zd Receptacle Removal Tools 1583224–[ ] are designed to be used in conjunction with HM–Zd Chicklet Removal Tools 1583248–1 or 1583249–1 to

smd zd 15

Abstract: Rogers 4350 8B10B
Contextual Info: ERmet ZD High Speed Differential Hard Metric Connector System www.erni.com Proposal for a System Simulation including the ERNI ERmet ZD Connector This is a proposal for a system simulation scenario of a high speed data communication backplane system. The goal of this investigation is to

hmzd connector

Abstract: 114-13059 EIA-364-20 EIA-364-21 EIA-364-27 EIA-364-28 EIA-364-23 EIA-364-23 connector
Contextual Info: 108-2055 Product Specification 04Apr05 Rev B EC 0990-0435-05 Two, Three and Four Pair HM-Zd Connectors | 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the Tyco Electronics ZPACK* HM-Zd connector system. This connector system uses a modular concept and interconnects 2

Contextual Info: Package Name HWSON-2 RENESAS Code PWSN0002ZA-B D Previous Code ⎯ MASS[Typ.] 0.048g A Lp B JEITA Package Code ⎯ 1.90 E 4.00 0.05 C0.40 ZD b M S Reference Symbol y S A A1 y1 S S x D E A A1 A2 b e Lp x y y1 ZD A B Dimension in Millimeters Min 4.9 3.9 0.70

Contextual Info: Tyco Electronics High Speed Backplane Connectors Table of Contents Z-PACK HM-Zd Connector. 55-94 Product Line O v e rv ie w .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2002/95/EC .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2011/65/EU .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. Adapted to the RoHS directive 2002/95/EC . ZR Smaller

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2002/95/EC .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2002/95/EC .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. Adapted to the RoHS directive 2002/95/EC . ZR Smaller

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2011/65/EU .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive 2011/65/EU .

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS ZD 3.0mmL Chip Type series Chip type with 3.0mmL height. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine using carrier tape. Adapted to the RoHS directive 2002/95/EC . ZR Smaller

philips 555

Abstract: sot596
Contextual Info: PDF: 2000 Oct 03 Philips Semiconductors Package outline Leadless surface mounted package; plastic cap; 8 terminations SOT596A Package under development e 8x ZD 1 2 3 ZE Philips Semiconductors reserves the right to make changes without notice. e (8×) l2

Contextual Info: ADVANCED INTERCONNECTIONS Socket Support For Motorola MC68360 Processor Family All Low Contact Insertion Force 1 oz. Average High Temperature Peel-A-Way® Polyimide Fi m Socket Features: T y p * -65 Term inal S how n 03- r ZD T °05 ( 13 125 (3.18) _ i_ U

Contextual Info: ZD*A H igh Density, Right Angle D High Density, Economy, .3 5 0 " Footprint Contacts Receptacle Assembly .246 6.25 082(208) Typ GROUNDING HOOKS 2 Places Receptacle 350 1 010 (8.89 ±0.25) 450 ± 010 (11.43 ± 0 25) .550 ±.010 (13.97 ±0.25) PCB Hole Pattern - Page 14-15

fm8w8p

Abstract: 67068-0000 fm8w8 152-FM8W8S fm3w3 FM11W1S 571-7877801 152-FMP320 152-FMX3067 2.0MM pitch pin single female
Contextual Info: Catalog No. 610 May 2002 to July 2002 sales@mouser.com www.mouser.com 800 346-6873 USB and IEEE 1394 Connectors, D-Sub Connectors, and Adapters D-SUB MIXED CONTACT CONNECTOR HOUSINGS AMP Z-PACK HM-Zd Specifications: • • • • • • Designed for high speed differential applications

Contextual Info: Current Regulator Diodes Regular Current @ V F = 25V Min. Nom. Max. Min Dynamic Impedance @ V F = 25V @ IF = 0.8 IF Max Min Peak Operation Voltage @ IF = 1.1 I F (Max) IF (mA) IF (mA) IF (mA) Zd (MΩ) ZK (MΩ) VL (V) POV(V) Bulk/Reel 0.198 0.216 0.243

Contextual Info: DASH NO. M CODE MADE FROM - PATCH THRU NORMAL THRU J3 ZD - Ji Y 9 < ^D J3 Y 75 OHMS BNC JI-WECO J4 <ÏEED J2 =H - MINI—WECO J4 Q 75 OHMS T— V W ^ l = 1 -2 -« Ji BNC ^ Q J2 TERMINATED RESISTOR BETWEEN TERMINAL & GROUND UNLESS OTHERWISE SPECIFIED

WSON

Contextual Info: JEITA Package Code P-WSON8-3.6x3-0.65 RENESAS Code PWSN0008JA-B Previous Code TNP-8DAV MASS[Typ.] 0.022g L1 D 5 E HE 0.16 0.31 ± 0.07 8 Reference Symbol 1 4 c ZD A S e b y S x M (Ni/Pd/Au plating) Dimension in Millimeters Min Nom D 2.90 3.00 E 3.50 3.60