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    XG-BGA-5000 Search Results

    XG-BGA-5000 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-092
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-002LF
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-092LF
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF

    XG-BGA-5000 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    XG-BGA-5000
    		Ironwood Electronics High Density GHz BGA Sockets; IC Size X (mm): 8; IC Size Y (mm): 8; IC Size Tolerance (mm): 0.08; Top Pitch (mm): 0.5; IC Array X: 16; IC Array Y: 16; Max Pincount: 216; IC Ball Height Min (mm): 0.18; IC Ball Height Max (mm): 0.28; IC Total Height Max (mm): 2.5; IC Ball Coplanarity (mm): 0.08; IC Ball Diameter Max (mm): 0.35; Backing Plate: yes; Part Description: GHz BGA Socket (ZIF); Max Package Code: BGA216; Cavity Down: no; IC Top Surface: Flat; Socket Lid: Swivel; Heat Sink: no Original PDF 59.38KB 4