X-GOLD 110 Search Results

RB95

Abstract: b30h
Contextual Info: 8 7 F A D G M N O P R S T V W X Y Z CONTACT .000015" GOLD .00003" GOLD .00001" GOLD .00003" GOLD .00005" GOLD .00003" GOLD GOLD FLASH .00002" GOLD .00001" GOLD .0001" TIN/LEAD .00003" GOLD GOLD FLASH .00003" GOLD .00003" GOLD .00001" GOLD 4 5 6 PLATING SPECIFICATIONS

10-Resistors

Contextual Info: THIN FILM MULTI TAP RESISTORS 117 SERIES MECHANICAL DATA .030" SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE .030" x .030" x .010" ± .0 03" SILICON TANTALUM NITRIDE 25,000 À MINIMUM GOLD; ALUMINUM OPTIONAL BARE SUBSTRATE GOLD BACK OPTIONAL ELECTRICAL DATA

Contextual Info: 2I3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 1 1- X X X X X X X X X LF _ JR PLATING C_ = 0.76pm GOLD/GXT ON CONTACT AREA 2pm MIN MAHE TIN ON TAIL OVER 1.27pm Ni MIN INDICATES THE PRODUCT IS RoHS COMPATIBLE, NOTE 8 -TOTAL NB OF POSITIONS

Contextual Info: r 1 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 2 2 —X X X X X X X X X X LF PLATING _ r _ R : RETENTIVE LEG NOTE 8 8 = 0.38pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN .STACK HEIGHT, NOTE 6 -TOTAL NB OE POSITIONS

Contextual Info: r 4 2 I3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 541 21 —X X X X X X XX X LF PLATING JT1 0.76pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN TX TOTAL NB OP POSITIONS 02 TO 36 OAL A NOTES: 1. HOUSING MAT’L : HIGH TEMPERATURE

PCIB26W

Contextual Info: -2 X 23.75 [0.935]— .15 [0.045]OTES: AND FI GLASS FILLED POLYESTER, UL 94V-0. COLOR: BLUE. SIZE 16 CONTACTS: COPPER ALLOY WITH GOLD FLASH OVER NICKEL SIZE 22 CONTACTS: PRECISION MACHINED COPPER ALLOY WITH GOLD FLASH 2. ELECTRICAL CHARACTERISTICS: SIZE 16 POWER CONTACTS: 28 AMPERES CONTINUOUS,

Contextual Info: DM5000 50 Position Low Density Female x 68 Position High Density Female Part Number_Circuit_ Specifications_ DM5000 - 5068 - 01 Contact Material: Phosphor bronze, selective gold over nickel plated

V 904 RL 805

Abstract: BFG520W N4 TAM transistor fp 1016 DIN45004B
Contextual Info: Philips Semiconductors Product specification NPN 9 GHz wideband transistor FEATURES BFG520W BFG520W/X; BFG520W/XR MARKING • High power gain TYPE NUMBER • Low noise figure BFG520W N3 • High transition frequency BFG520W/X N4 • Gold metallization ensures

Transistor S 40443

Contextual Info: bbS3T31 0024T37 flOO « A P X Philips Semiconductors NPN 7 GHz wideband transistor £ BFG197; BFG197/X; BFG197/XR AMER PHILIPS/ DIS CRETE FEATURES Product specification b?E D PINNING PIN • High power gain • Low noise figure • Gold metallization ensures

1-104655-1

Contextual Info: Catalog 1307515 Issued 9-99 AMPMODU 50/50 Grid Connectors C ontinued AM PM O DU Vertical Headers, 1.27 x 1.27 [.050 x .050] Centers With Standard Holddowns Photo 91588 For 6.35 [.250] Stacking Height r 1.27 [.050] Localized Gold Plate Area 1.27 [.050] [.030]

Contextual Info: ADAM TECH CARD EDGE CONNECTORS . 100" X .200" [2.54 X 5.08] CENTERLINE ADAM TECHNOLOGIES INC. CE SERIES INTRODUCTION: Adam Tech C E Series Card Edge Connectors feature .100" x .200" Centerlines. They are dual readout, have bifurcated cantilever beam contacts and conform to all applicable requirements of MIL-C21097. The selectively gold plated precision formed contacts pro­

Contextual Info: ^ V IV IF * Catalog 1307612 Flexible Film Products Revised 7-01 FFC Contacts, .050 x .100 [1.27 x 2.54] Centerline Receptacle Solder Tab l=J Accepts .015 [0.38] Sq. Post .125-.350 [3.18-8.89] Long Material and Finish: Phosphor bronze; plated gold duplex or bright tin-lead overall

3508-0000T

Contextual Info: .100" x .600" DIP 40 Position Fits standard IC sockets Strong legs, less susceptible to bending or breaking Gold or tin lead plating options Round or rectangular contact leg options Low profile TS-0618-05 Sheet 1 of 2 110 Physical Insulation Material: Flammability:

Contextual Info: USB-A-S-X-X-SM2-XX REVISION P I 6.40 [.646] CONFIGURATION -S: SINGLE 0.65[.026] _ TYP n n n [ T&R OPTION -TR: TAPE AND REEL (LEAVE BLANK FORTRAY PACKAGING) TYPE -A @ ] TERMINATION -SM2: SURFACE MOUNT 2 COLOR -B: BLACK -W: WHITE PLATING SPECIFICATION -F: GOLD FLASH ON MATING AREA,

Contextual Info: SUPER HIGH-POWER GaAlAs IR EMITTERS OD-110L FEATURES • Ultra high optical output • Four wire bonds on die corners • Very narrow optical beam • Standard 3-lead TO-39 hermetic package • Chip size: 0.026 x 0.026 All surfaces are gold plated. Dimensions are nominal

ic ns 4263

Contextual Info: MICRON 512K □PAM M O n ill m V U U U 51 2K _ X X MT20D51240 40 DRAM MODULE 40 DRAM FAST-PAGE-MODE MT20D51240 LOW POWER, EXTENDED REFRESH (MT20D51240 L) F L . FEATURES • • • • • • • OPTIONS M T20D 51240G • Packages Leadless 7 2 -pin SIM M (gold)

Contextual Info: 4 V1.1 SYM A A SPECIFICATION CURRENT RATING : 1 A INSULATOR RESISTANCE: 5000M 0 MIN. DIELECTRIC WITHSTANDING : AC 500V. OPERATING TEMPERATURE: - 4 0 ‘C~+105'C. CONTACT MATERIAL : BRASS INSULATOR MATERIAL : STANDARD : P.B.T FINISH : GOLD FLASH X _ ✓S_ A

nylon6

Contextual Info: 9600 Series Headers CCS .050 [1.27] x .100 [2.54] SMT Specifications Insulator Material: Glass filled polyester, Thermoplastic, 94V-O Nylon-6T, UL Recognized. Contact Material: Copper Alloy Contact Plating: Gold or Tin over .000050” Ni See contact plating options .

SD1411

Contextual Info: SD1411 RF & MICROWAVE TRANSISTORS HF SSB APPLICATIONS . . . 30 MHz 40 VOLTS IMD −30 dB COMMON EMITTER GOLD METALLIZATION POUT = 200 W MIN. WITH 16 dB GAIN .400 x .425 6LFL M153 epoxy sealed ORDER CODE SD1411 BRANDING SD1411 PIN CONNECTION DESCRIPTION

B2XXXX

Contextual Info: 9600 Series Headers CCS .050 [1.27] x .100 [2.54] Specifications Insulator Material: Glass filled polyester, Thermoplastic, 94V-O Nylon-6T, UL Recognized. Contact Material: Copper Alloy Contact Plating: Gold and/or Tin over .000050” Ni See contact plating thicknesses .

Contextual Info: 13,2 max. 95 max. 85-0.2 8,5-0.1 mimi ru a H o i a a o e v m 2,54 ffl , m , ffl, 2.54 5.08 31 x 2,54 = 78,74 0,6 x 0,6 90±0.1 SPECIAL PART ND.s 59 8457 096 000 529 CONTACT ARRANGEMENT : ASSEMBLED IN ROW a + b + c FULLY LOADED PLATING GOLD CONTACT AREA ONLY

TR-TSY-00078

Contextual Info: CCS 4100 Series Card Edge Connector .150” X .200” Contact Spacing Specifications Features Insulator Material: Glass filled polyester, type PBT, 94 V-O, UL Rated. Contact Material: Phosphor Bronze Alloy Contact Plating: Gold and/or Tin over .000050” Nickel,

4684

Abstract: TR-TSY-00078
Contextual Info: CCS 3500 Series Card Edge Connector .156” X .188” Contact Spacing Specifications Features Insulator Material: Glass filled polyester, type PBT, 94 V-O, UL Rated. Contact Material: Phosphor Bronze Alloy Contact Plating: Gold and/or Tin over .000050” Nickel,

Contextual Info: .100" and .100" X .100" Pin Strip Header .2357.318" Mating Length, Straight & Right Angle Solder/Wrap Tails 929 Series Tin lead or gold plating available Board pin retention feature available Choice of tail lengths available for solder, wire, wrap, or board stacking