X-GOLD 110 Search Results

Contextual Info: .156" 3.96mm Series 179 Right Angle Connector .156 (3.96) Centers Card Edge Tuning Fork Contacts PART NUMBER CODING 1 79- X X X - X X CONTACT PLATING CONTACT SURFACE AND TERMINATION 30 = .000010 GOLD OVERALL 32 = 000020 GOLD OVERALL ALL GOLD PLATED OVER .000050

RB95

Abstract: b30h
Contextual Info: 8 7 F A D G M N O P R S T V W X Y Z CONTACT .000015" GOLD .00003" GOLD .00001" GOLD .00003" GOLD .00005" GOLD .00003" GOLD GOLD FLASH .00002" GOLD .00001" GOLD .0001" TIN/LEAD .00003" GOLD GOLD FLASH .00003" GOLD .00003" GOLD .00001" GOLD 4 5 6 PLATING SPECIFICATIONS

10-Resistors

Contextual Info: THIN FILM MULTI TAP RESISTORS 117 SERIES MECHANICAL DATA .030" SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE .030" x .030" x .010" ± .0 03" SILICON TANTALUM NITRIDE 25,000 À MINIMUM GOLD; ALUMINUM OPTIONAL BARE SUBSTRATE GOLD BACK OPTIONAL ELECTRICAL DATA

PE44433

Contextual Info: BODY CONTACT INSULATOR MATERIALS STAINLESS STEEL GOLD PLATED GOLD PLATED PTFE 1100 ,0930 2 PLACES MOUNTING HOLES PASTERNACK ENTERPRISES, INC, P.O B O X 16759, IRVINE, C A 92623 P H O N E (949) 261-1920 F A X <949) 261-7451 W E B A D D R E S S : w w w .p asternackxo m

FA324

Contextual Info: Com bo D - C o a x ia l/75 Ohm Right Angle Receptacle for PC B Mounting for PC Board Thickness Up to .125 [3.18] 75 Ohm Impedance Contact Finish Compliant Boardlock Gold Over Ni No Gold Over Ni Yes 30/i in. Gold No 30/i in. Gold Yes DE-5W1 DEMP5C1SJA197

T-1000-1

Abstract: 110A 202
Contextual Info: MICROWAVE CHIP RESISTORS MSMW SERIES MECHANICAL DA TA DAT W T L Shown with optional Gold Back SERIES MSMW 110 MSMW 112 MSMW 115 MSMW 118 MSMW 120 MSMW 121 MSMW 122 MSMW 124 L 0.040" 0.050" 0.050" 0.021" 0.100" 0.100" 0.020" 0.150" x x x x x x x x W 0.020"

Contextual Info: NON-MICROWAVE CHIP RESISTORS MSTF SERIES MECHANICAL DA TA DAT W T L Shown with optional Gold Back SERIES MSTF 110 MSTF 112 MSTF 115 MSTF 118 MSTF 120 MSTF 121 MSTF 122 MSTF 124 L 0.037" 0.050" 0.050" 0.021" 0.100" 0.100" 0.020" 0.150" x x x x x x x x W 0.017"

Contextual Info: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold

J708

Abstract: 2X3-16 99 LM4
Contextual Info: PART NO. QQg n to .M Scries No.- X X & Q _ l - Tail Type SA: Slot 1KT D: No Kink No Of Pins- 02: 2 Pnlr Kinks Contort.- 04-: 4 P a ir Kinks • Gold Plating B! B ra ss P: Phosphor Bronze 01: Cold Flash Rating- 10: IQ u ' Gold

Infineon X-GOLD 110

Abstract: Infineon X-GOLD 618 infineon x-gold xmm 6180 X-GOLD 618 MIPI CSI-2 Parallel X-GOLD 110 smarti UE MIPI csi-2 MIPI csi
Contextual Info: Product Brief X-GOLD 618 TM Cost efficient HSPA Baseband for Multimedia enabled Cellular Phones Main Features THE Infineon X-GOLD 618 is a cellular system on chip comprising the 2G/3G digital and analog baseband and the power management functions monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd

Contextual Info: NON-MICROWAVE CHIP RESISTORS MSTF SERIES MECHANICAL DA TA DAT W T Shown with optional Gold Back x x x x x x x x x W 0.010" 0.017" 0.050" 0.025" 0.017" 0.050" 0.100" 0.016" 0.085" x x x x x x x x x T 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010"

Contextual Info: NON-MICROWAVE CHIP RESISTORS MSTF SERIES MECHANICAL DA TA DAT W T Shown with optional Gold Back x x x x x x x x x W 0.010" 0.017" 0.050" 0.025" 0.017" 0.050" 0.100" 0.016" 0.085" x x x x x x x x x T 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010"

WTS 1.7 IC 28 PIN

Abstract: WTS 1.7 IC
Contextual Info: PRELIMINARY M IC R O N I 4 MEG X 36, 8 MEG 4 MEG DRAM MODULE X X M T12D 436 18 DRAM M OD ULE 36, 8 MEG X 18 FAST PAGE MODE FEATURES PIN ASSIGNMENT Top View OPTIONS M T 1 2 D 4 3 6 D M /G m r r n m r rm m T m SIMM SIM M (gold) SIM M low profile SIM M (gold) low profile

relay omron G2E

Abstract: G2E-184P-M-US omron g2e G2E-184P-M G2E-184P-H-M G2E-184P-H-M-US G2E-134P-H-M-US omron G2E-184p G2E184PHM E41515
Contextual Info: PCB Relay G2E Miniature, Single-pole PCB Relay Miniature: 15.5 x 10.5 x 11.5 mm W x L x H . Low power consumption: 200 mW. Bifurcated crossbar contacts available. Gold-clad contacts. Ideal for telecommunications equipment and security systems. Ordering Information

G2E-184P-M-US

Abstract: E41515 G2E-134P-H-M-US G2E-184P-H-M-US G2E-134P-M-US g2e184pmusdc G2E-184P-M-US12VDC
Contextual Info: Back PCB Relay G2E Miniature, Low-cost, Single-pole PCB Relay Miniature: 15.5 x 10.5 x 11.5 mm L x W x H . Low power consumption: 200 mW. Bifurcated crossbar contacts. Gold-clad contacts. Plastic-sealed type available. Ideal for telecommunications equipment and

Contextual Info: 2I3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 1 1- X X X X X X X X X LF _ JR PLATING C_ = 0.76pm GOLD/GXT ON CONTACT AREA 2pm MIN MAHE TIN ON TAIL OVER 1.27pm Ni MIN INDICATES THE PRODUCT IS RoHS COMPATIBLE, NOTE 8 -TOTAL NB OF POSITIONS

Contextual Info: REVISION E SMA-J-C-X-ST-SR2 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] GENDER -J: JACK DO NOT SCALE FROM THIS PRINT TERMINATION -SR2: SEALED REVERSE POLARITY BULKHEAD RG178 TYPE -C: CABLE ORIENTATION -ST: STRAIGHT PLATING SPECIFICATION E -H: HEAVY GOLD / FLASH GOLD

G2E-184P-M-US

Abstract: G2E-134P-H-M-US Crossbar contact E41515 G2E-134P-M-US relay omron G2E AT-110 G2E-184P-H-M mw 137 G2E-184P-H-M-US
Contextual Info: PCB Relay G2E Miniature, Low-cost, Single-pole PCB Relay Miniature: 15.5 x 10.5 x 11.5 mm L x W x H . Low power consumption: 200 mW. Bifurcated crossbar contacts. Gold-clad contacts. Plastic-sealed type available. Ideal for telecommunications equipment and

Contextual Info: r 1 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 2 2 —X X X X X X X X X X LF PLATING _ r _ R : RETENTIVE LEG NOTE 8 8 = 0.38pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN .STACK HEIGHT, NOTE 6 -TOTAL NB OE POSITIONS

Contextual Info: CATALOG 126 backup:CATALOG 126.qxd 3/29/2011 11:09 AM ELECTRONICS & TECHNOLOGY, INC. Page 64 Vectorbord Plugbordtm 8801-1 S-100 Bus 10.50”H x 5.3”L x .062” TH Plugbord 0.100” grid on 0.42” diameter holes. Gold-plated edge contacts only. Bare prototyping board allows unrestricted component placement. 100 gold-plated edge contacts 50 on

CED-61108-02A-2-GDXX

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C D D E F SPECIFICATIONS Contact material: Lock link material: Series CED DIN41612 Brass, gold plated Brass, nickel plated Type Gender Dimension øA Plating Options 61108 02A X GDXX Power contact 02A=Straight female, 2=ø2.85mm .110” , 20 amps GD=Gold flash

E41515

Abstract: G5A-234P G5AU-234P
Contextual Info: Back PCB Relay G5A Subminiature Relay 16 x 9.9 x 8.4 mm (L x W x H with DPDT Contact Unique moving-loop armature reduces relay size, magnetic interference and contact bounce time. Miniature permissible load: 0.01 mA 10 mVDC. Bifurcated gold-clad crossbar contact.

Contextual Info: REVISION M SMA-J-C-X-ST-BH2 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] GENDER -J: JACK DO NOT SCALE FROM THIS PRINT TERMINATION -BH2: BULKHEAD RG178 TYPE -C: CABLE ORIENTATION -ST: STRAIGHT PLATING SPECIFICATION M (VALUES GIVEN ARE IN MICRO-INCHES) -H: HEAVY GOLD / FLASH GOLD

Contextual Info: REVISION C GRFS-P-C-X-ST-CA2 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] GENDER -P: PLUG DO NOT SCALE FROM THIS PRINT TERMINATION -CA2: RG-178 CABLE TYPE -C: CABLE ORIENTATION -ST: STRAIGHT PLATING SPECIFICATION -H: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT