X-GOLD 110 Search Results

RB95

Abstract: b30h
Contextual Info: 8 7 F A D G M N O P R S T V W X Y Z CONTACT .000015" GOLD .00003" GOLD .00001" GOLD .00003" GOLD .00005" GOLD .00003" GOLD GOLD FLASH .00002" GOLD .00001" GOLD .0001" TIN/LEAD .00003" GOLD GOLD FLASH .00003" GOLD .00003" GOLD .00001" GOLD 4 5 6 PLATING SPECIFICATIONS

10-Resistors

Contextual Info: THIN FILM MULTI TAP RESISTORS 117 SERIES MECHANICAL DATA .030" SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE .030" x .030" x .010" ± .0 03" SILICON TANTALUM NITRIDE 25,000 À MINIMUM GOLD; ALUMINUM OPTIONAL BARE SUBSTRATE GOLD BACK OPTIONAL ELECTRICAL DATA

PE44433

Contextual Info: BODY CONTACT INSULATOR MATERIALS STAINLESS STEEL GOLD PLATED GOLD PLATED PTFE 1100 ,0930 2 PLACES MOUNTING HOLES PASTERNACK ENTERPRISES, INC, P.O B O X 16759, IRVINE, C A 92623 P H O N E (949) 261-1920 F A X <949) 261-7451 W E B A D D R E S S : w w w .p asternackxo m

FA324

Contextual Info: Com bo D - C o a x ia l/75 Ohm Right Angle Receptacle for PC B Mounting for PC Board Thickness Up to .125 [3.18] 75 Ohm Impedance Contact Finish Compliant Boardlock Gold Over Ni No Gold Over Ni Yes 30/i in. Gold No 30/i in. Gold Yes DE-5W1 DEMP5C1SJA197

WTS 1.7 IC 28 PIN

Abstract: WTS 1.7 IC
Contextual Info: PRELIMINARY M IC R O N I 4 MEG X 36, 8 MEG 4 MEG DRAM MODULE X X M T12D 436 18 DRAM M OD ULE 36, 8 MEG X 18 FAST PAGE MODE FEATURES PIN ASSIGNMENT Top View OPTIONS M T 1 2 D 4 3 6 D M /G m r r n m r rm m T m SIMM SIM M (gold) SIM M low profile SIM M (gold) low profile

Contextual Info: 2I3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 1 1- X X X X X X X X X LF _ JR PLATING C_ = 0.76pm GOLD/GXT ON CONTACT AREA 2pm MIN MAHE TIN ON TAIL OVER 1.27pm Ni MIN INDICATES THE PRODUCT IS RoHS COMPATIBLE, NOTE 8 -TOTAL NB OF POSITIONS

Contextual Info: r 1 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 2 2 —X X X X X X X X X X LF PLATING _ r _ R : RETENTIVE LEG NOTE 8 8 = 0.38pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN .STACK HEIGHT, NOTE 6 -TOTAL NB OE POSITIONS

Contextual Info: r 4 2 I3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 541 21 —X X X X X X XX X LF PLATING JT1 0.76pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN TX TOTAL NB OP POSITIONS 02 TO 36 OAL A NOTES: 1. HOUSING MAT’L : HIGH TEMPERATURE

PCIB26W

Contextual Info: -2 X 23.75 [0.935]— .15 [0.045]OTES: AND FI GLASS FILLED POLYESTER, UL 94V-0. COLOR: BLUE. SIZE 16 CONTACTS: COPPER ALLOY WITH GOLD FLASH OVER NICKEL SIZE 22 CONTACTS: PRECISION MACHINED COPPER ALLOY WITH GOLD FLASH 2. ELECTRICAL CHARACTERISTICS: SIZE 16 POWER CONTACTS: 28 AMPERES CONTINUOUS,

marking 82 sot343

Abstract: zo 103 ma BFG197W DIN45004B MS80 Ghz dB transistor
Contextual Info: Product specification Philips Semiconductors BFG197W BFG197W/X; BFG197W/XR NPN 7 GHz wideband transistor MARKING FEATURES • High power gain TYPE NUMBER • Low noise figure • Gold metallization ensures excellent reliability. BFG197W BFG197W/X BFG197W/XR

Contextual Info: BCS-1XX-XXX-X-XX-XXX REVISION BV DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATIONS SEE TABLE 1 -T: MATTE TIN CONTACT AND TAIL -L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL -F: 3µ" FLASH SELECTIVE GOLD CONTACT AREA, MATTE TIN ON TAIL

Contextual Info: DM5000 50 Position Low Density Female x 68 Position High Density Female Part Number_Circuit_ Specifications_ DM5000 - 5068 - 01 Contact Material: Phosphor bronze, selective gold over nickel plated

V 904 RL 805

Abstract: BFG520W N4 TAM transistor fp 1016 DIN45004B
Contextual Info: Philips Semiconductors Product specification NPN 9 GHz wideband transistor FEATURES BFG520W BFG520W/X; BFG520W/XR MARKING • High power gain TYPE NUMBER • Low noise figure BFG520W N3 • High transition frequency BFG520W/X N4 • Gold metallization ensures

3H2 philips

Abstract: marking B5T BFG197W D054 DIN45004B TT5 marking
Contextual Info: Philips Semiconductors Product specification BFG197W BFG197W/X; BFG197W/XR NPN 7 GHz wideband transistor MARKING FEATURES • High power gain TYPE NUMBER • Low noise figure BFG197W V5 • Gold metallization ensures excellent reliability. BFG197W/X V8 BFG197W/XR

Contextual Info: 1 PRELIMINARY M IC R O N • 8 MEG X StMlCOMCUCTOR. INC MT16D832 32,16 MEG x 16 DRAM MODULE 8 MEG x 32,16 MEG X16 DRAM MODULE FAST PAGE MODE FEATURES OPTIONS MARKING • Timing 60ns access 70ns access -6 -7 Packages Leadless 72-pin SIMM Leadless 7 2 -pin SIMM gold

Contextual Info: 19.09 17.54 1.02x9 = 9.18 IL 1.37 1.55 27.46 ORDER NO. M J 9 3 - 14.9MAX x x C X 1 14.9MAX 14.8MIN 2 3 CD j w! Z; 1. NO. OF POSITIONS & CONTACTS: "66" 6P6C "88" 8P8C "00" 10P10C 2. GOID PLATING: "C" 30 MICROINCH GOLD 3. COLOR OF HOUSING: "B" BLACK STANDARD

Transistor S 40443

Contextual Info: bbS3T31 0024T37 flOO « A P X Philips Semiconductors NPN 7 GHz wideband transistor £ BFG197; BFG197/X; BFG197/XR AMER PHILIPS/ DIS CRETE FEATURES Product specification b?E D PINNING PIN • High power gain • Low noise figure • Gold metallization ensures

transistor vc 548

Abstract: transistor C 548 B Philips
Contextual Info: bbSBTBl DDSMflDT Tb5 « A P X P hilips Sem iconductors NPN 12 GHz wideband transistor BFG33; BFG33/X N AUER PHILIPS/DISCRETE FEATURES Product specification b7E J> PINNING PIN • High power gain • Low noise figure • Gold metallization ensures excellent reliability.

1-104655-1

Contextual Info: Catalog 1307515 Issued 9-99 AMPMODU 50/50 Grid Connectors C ontinued AM PM O DU Vertical Headers, 1.27 x 1.27 [.050 x .050] Centers With Standard Holddowns Photo 91588 For 6.35 [.250] Stacking Height r 1.27 [.050] Localized Gold Plate Area 1.27 [.050] [.030]

Contextual Info: WT-110DP55 Zener Diode Chips for ESD Protection 1. Feature: 1-1 This specification applies to P/N silicon zener diode chips. 2. Structure: 2-1 planar type. 2-2 Electrodes : P Anode side : Aluminum alloy. N (Cathode) side : Gold Layer. 3. Size: 3-1. Chip Size : 9.5 mils x 9.5 mils (240 µm x 240 µm ).

Contextual Info: ADAM TECH CARD EDGE CONNECTORS . 100" X .200" [2.54 X 5.08] CENTERLINE ADAM TECHNOLOGIES INC. CE SERIES INTRODUCTION: Adam Tech C E Series Card Edge Connectors feature .100" x .200" Centerlines. They are dual readout, have bifurcated cantilever beam contacts and conform to all applicable requirements of MIL-C21097. The selectively gold plated precision formed contacts pro­

Contextual Info: PRELIMINARY M IC R O N 1 4 M EG DRAM MODULE X MT8D432 32, 8 M EG x 16 DRA M M O D U LE 4 MEG x 32, 8 MEG x 16 FAST PAGE MODE FEATURES PIN ASSIGNMENT Top View OPTIONS MARKING • Timing 60ns access 70ns access -6 -7 • Packages Leadless 72-pin SIMM Leadless 72 -pin SIMM (gold)

Contextual Info: ^ V IV IF * Catalog 1307612 Flexible Film Products Revised 7-01 FFC Contacts, .050 x .100 [1.27 x 2.54] Centerline Receptacle Solder Tab l=J Accepts .015 [0.38] Sq. Post .125-.350 [3.18-8.89] Long Material and Finish: Phosphor bronze; plated gold duplex or bright tin-lead overall

3508-0000T

Contextual Info: .100" x .600" DIP 40 Position Fits standard IC sockets Strong legs, less susceptible to bending or breaking Gold or tin lead plating options Round or rectangular contact leg options Low profile TS-0618-05 Sheet 1 of 2 110 Physical Insulation Material: Flammability: