X 0404 Search Results

Contextual Info: 10 ilB NOTES: 1 . IXEIRXX MATERIAL X X X T R *. UL94V-0 , s:m HOUSING: LIQUID CRYSTAL POLYMER, GLASS FILLED,UL94V-0,C0L0R:BLACK s - s p u uyms ct = o. 1 5) TERMINAL:PHOSPHOR BR0NZE t =0. I5) 2. X " J Apt PLATING X X x T 0 „2 5 X X X n x -R lD Y X ± (X X X X R R R )

72T36125

Abstract: IDT72T36105 IDT72T36115 IDT72T36125 IDT72T3645 IDT72T3655 IDT72T3665 IDT72T3675 IDT72T3685 IDT72T3695
Contextual Info: PRELIMINARY 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS IDT72T3645, IDT72T3655, IDT72T3665, IDT72T3675, IDT72T3685, IDT72T3695, IDT72T36105, IDT72T36115, IDT72T36125 1,024 x 36, 2,048 x 36, 4,096 x 36, 8,192 x 36, 16,384 x 36, 32,768 x 36, 65,536 x 36, 131,072 x 36 and 262,144 x 36

IDT72T36105

Abstract: IDT72T36115 IDT72T36125 IDT72T3645 IDT72T3655 IDT72T3665 IDT72T3675 IDT72T3685 IDT72T3695 2Kx36
Contextual Info: 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS 1,024 x 36, 2,048 x 36, 4,096 x 36, 8,192 x 36, 16,384 x 36, 32,768 x 36, 65,536 x 36, 131,072 x 36 and 262,144 x 36 FEATURES: • • • • • • • • • • • • • Choose among the following memory organizations:

IDT72T3645

Abstract: 72T36125
Contextual Info: 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS 1,024 x 36, 2,048 x 36, 4,096 x 36, 8,192 x 36, 16,384 x 36, 32,768 x 36, 65,536 x 36, 131,072 x 36 and 262,144 x 36 FEATURES: • • • • • • • • • • • • • Choose among the following memory organizations:

B223

Contextual Info: Extract from the online catalog AB2/SS Order No.: 0404431 Double support, insulating material, optionally for use with 3 mm x 10 mm or 6 mm x 6 mm busbar, height: 48 mm Product notes

Contextual Info: Extract from the online catalog AB2/SS Order No.: 0404431 Double support, insulating material, optionally for use with 3 mm x 10 mm or 6 mm x 6 mm busbar, height: 48 mm Product notes

Contextual Info: CBB, CBC www.vishay.com Vishay Electro-Films Thin Film Binary MOS Capacitors FEATURES • Wire bondable • User value selection • Five capacitors on a 0.019" x 0.048" CBB or 0.044" x 0.044" (CBC) chip • Case size: 0402, 0404 Product may not be to scale

B223

Contextual Info: Extract from the online catalog AB/SS Order No.: 0404428 Support made of insulating material, with retaining screw, for use with either 3 x 10 mm or 6 x 6 mm busbar, color: gray

0404428

Contextual Info: Extract from the online catalog AB/SS Order No.: 0404428 Support made of insulating material, with retaining screw, for use with either 3 x 10 mm or 6 x 6 mm busbar, color: gray

Contextual Info: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-3 A terminal 1 index area A E A1 c detail X C e1 1/2 e e 11 b y y1 C v M C A B w M C 20 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1

HY51V18164B

Contextual Info: H Y 51V 18164BSeries •HYUNDAI 1M X 16-bit CMOS DRAM with Extended Data Out DESCRIPTION The HY51V18164B is the new generation and fast dynamic RAM organized 1,048,576 x 16-bit. The HY51V18164B utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques

Contextual Info: “HYUNDAI HY51V16164B Series 1M x 16-bit CMOS DRAM with Extended Data Out DESCRIPTION The H Y51V16164B is the new generation and fast dynamic RAM organized 1,048,576 x 16-bit. The HY51V16164B utilizes Hyundai’s CM O S silicon gate process technology as well as advanced circuit techniques

M22-AK10

Abstract: M22-WRLK-Y M22-XST M22-PV Moeller M22-PV 216876 M22-DL-G-X1 M22-TC M22-WLK3-W M22-KC01 M22S-PVL
Contextual Info: 2/0 Control Circuit Devices Control Circuit Devices Moeller HPL0211-2004/2005 Control Circuit Devices 2/1 Control Circuit Devices Moeller HPL0211-2004/2005 2/2 Contents Control Circuit Devices Moeller HPL0211-2004/2005 RMQ-Titan Control Circuit Devices Grid dimensions: 30 x 40/30 x 50 mm

CS44

Contextual Info: CS44 www.vishay.com Vishay Sfernice High Value up to 100 M Wirebondable 1 mm2 Thin Film Chip Resistors FEATURES • Small size 40 mil x 40 mil (1 mm x 1 mm) • Very high ohmic value up to 100 M • Good stability 0.1 % (2000 h, rated power at + 70 °C)

u357

Abstract: t3d 56 t3d 68 t3d 5_6 LS 2027
Contextual Info: CSR23 MIL-C-39003/03 • MallorY Solid Tantalum Capacitors GENERAL SPECIFICATIONS Extended Capacitance G raded Failure Rates DC Leakage: A t+ 2 5 °C - See Table Lim it A t+ 8 5 °C - 10 x Table Lim it A t+ 1 2 5 °C - 12.5 x Table Limit C apacitance C hange M aximum :

Contextual Info: W25P022A Gyinbond V fm v 64K x 32 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM Electronics Corp. GENERAL DESCRIPTION The W25P022A is a high-speed, low-power, synchronous-burst pipelined CMOS static RAM organized as 65,536 x 32 bits that operates on a single 3.3-volt power supply. A built-in two-bit burst

NTC 2200-15

Abstract: plc ic 08382 rel 14 a1 5.5 erni K.50 E Type siemens relay plc wiring home diagram wago OF 8 pin optocoupler EL B17 wago 231 IEC 60060-1 schneider transformer 750 kVA wago 793-566
Contextual Info: Interface Modules Full Line Catalog 2010/2011 4 WAGO Registered Trademarks WAGO CAGE CLAMP® CAGE CLAMP®@ POWER CAGE CLAMP FIT CLAMP® PUSH WIRE® TOPJOB® TOPJOB®@ X-COM® X-COM®@ WINSTA® JUMPFLEX® TO-PASS® ProServe® WAGO trademarks are registered brand names or regionally registered

Contextual Info: MTT www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Resistance range: 1.1 k to 275 k • Chip size: 0.038" x 0.038" • Case: 0404 • Resistor

Contextual Info: CTM www.vishay.com Vishay Electro-Films Thin Film M Center-Tap Chip Resistor Divider Network FEATURES • Wire bondable • Resistance range total: 200 k to 10 M • Center tap • Chip size: 0.040" x 0.040" • Case: 0404 Product may not be to scale

MSCQ2

Abstract: t 317 transistor
Contextual Info: Microsemi W ntertown, M A 0Î172 PH: S17 S26-0404. F A X <617) #24-1235 2N2369A Features 40 Volts 200mAmps • Meats MIL-S-19500/317 • Iiolector-Sase Voftage 40V • (Jollector Current 200 mA • I-ast Switching 3 0 nS NPN BIPOLAR TRANSISTOR Maximum Ratings

MIL-STD-202G method 103

Abstract: S0623 HCD80 PRS-1238
Contextual Info: I-PE X CO.,LTD PRODUCT m sheet 1 of SPECIFICATION & No.PRS- m » 1238 MHFin Connector Qualification Test Report No. TR-04044 S07029 S06235 S06002 S05175 S04139 REV. u Y .H Y .H Tom N ov/20/’06 Jan /1 9 /’06 0 c t/1 3 /’05 N ov/26/’04 S04031 Tom A pr/12/’04

Contextual Info: 10 a NOTES 1. 2. 3. 5 2 8 8 5 - * * * 2 < D I¥ f f l\ K la c X V C I3 S D - 5 2 8 8 5 - * * * 2 IN THE PACKAGE . PART NO. 52 8 8 5 -»«2 DETAILED DIMENSIONS . SEE SD-52885-««2 * : 1 0 0 O f i S / ' J — JL NUMBER OF CONNECTORS : 1000 PCS/REEL U — K x —A S S

Contextual Info: 8 6 7 3 5 2 C\J E D RECOMMENDED PCB PATTERN LAYOUT 5C A LE :2- I if f 0E( , NO LU < — O a) N 0TES 1. m MATERIAL 00 PPSx&Ss ( t = 0.2 ) VACUUM C0 V ER ;5T A IN LES5 STEEL 2. X y lf tS k PLATING CONTACT AREA:G0LD 0 .2 5 p m M I N . ¥ f fltti:m p : m > < ^ + PS n /P b = 9 0 /l0 (X )

Contextual Info: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm D B SOT856-1 A ball A1 index area E A2 A A1 C e1 e ∅v ∅w b L K J H G F E D C B A M M y y1 C C A B C e e2 ball A1 index area 1 2 3 4 5 6 7 8 9 10 11