WT 3 ZENER Search Results

Contextual Info: WT-224DV06 Zener Diode Chips for ESD Bidrectional Protection 1. Feature: 1-1 chips, Device NO. WT-224DV06 2. Structure: 3. Size: 2-1. Planar type : N/P/N Diode. 2-2. Electrodes : Top side : Aluminum Alloy. Back side : Gold Layer. 3-1. Chip size : 24 mils x 24 mils 600 m x 600 μm .

Contextual Info: WT-110DP55 Zener Diode Chips for ESD Protection 1. Feature: 1-1 This specification applies to P/N silicon zener diode chips. 2. Structure: 2-1 planar type. 2-2 Electrodes : P Anode side : Aluminum alloy. N (Cathode) side : Gold Layer. 3. Size: 3-1. Chip Size : 9.5 mils x 9.5 mils (240 µm x 240 µm ).

Contextual Info: WT-108DP100 Zener Diode Chips for ESD Protection 1. Feature: 1-1 This specification applies to P/N silicon diode chips. 2. Structure: 2-1 planar type. 2-2 Electrodes : P Anode side : Aluminum alloy. N (Cathode) side : Gold Layer. 3. Size: 3-1. Chip Size : 7.9 mils x 7.9 mils (200 µm x 200 µm ).

Contextual Info: WT-106DN06 A Zener Diode Chips for ESD Protection 1. Feature: 1-1 This specification is suitable for N/P zener single-direction structure chips use. 2. Structure: 2-1 Paralleled the LED 2-2 Unity pad metal (one wire bonding applied only) 2-3 One-way Zener diode protection

Contextual Info: WT-106DN09 A Zener Diode Chips for ESD Protection 1. Feature: 1-1 This specification is suitable for N/P zener single-direction structure chips use. 2. Structure: 2-1 Paralleled the LED 2-2 Unity pad metal (one wire bonding applied only) 2-3 One-way Zener diode protection

Contextual Info: WT-106DP09 A Zener Diode Chips for ESD Protection 1. Feature: 1-1 This specification is suitable for P/N zener single-direction structure chips use. 2. Structure: 2-1 Paralleled the LED 2-2 Unity pad metal (one wire bonding applied only) 2-3 One-way Zener diode protection

Contextual Info: WT-106CP12 A Zener Diode Chips for ESD Protection 1. Feature and Application: 1-1 This specification is suitable for P/N zener single-direction structure chips use. 1-2 Paralleled the LED. 1-3 Unity pad metal (one wire bonding applied only). 1-4 One-way Zener diode protection.

Contextual Info: WT-106DP13 A Zener Diode Chips for ESD Protection 1. Feature: 1-1 This specification is suitable for P/N zener single-direction structure chips use. 2. Structure: 2-1 Paralleled the LED 2-2 Unity pad metal (one wire bonding applied only) 2-3 One-way Zener diode protection

Contextual Info: WT-U3A8BP TOP LED White Color Product Specification Specification Iv Material Quantity 3600mcd-8000mcd Each chip@20mA O Ta= 25 C Tolerance±10% Color Refer to page 3~4 Temperature Each chip@20mA/ Ta= 25 C Vf White:2.9-3.9V O Each chip@20mA Tolerance±0.05V

Contextual Info: Zener Diode Assortment Kits A A mini min i Ki ts kits 25 V nines Each 25 \ allies Each MLL Series SOD80 ±5% Mini MELF BZX84/MMBZ Series SOT23 ±5 % 2.4V 2.7V 3.0V 3.3V 3.9V 4.3V 4.7V 5.1V 5.6V 6.2V 6.8V 7.5V 8.2V 3.0V 3.3V 3.6V 3.9V 4.3V 4.7V 5.1V 5.6 V 6.0V

marking W6 zener Diode

Abstract: diode Marking code WT
Contextual Info: BZT52C2V4 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C36 BZT52C43 BZT52C47 BZT52C51 BZT52C8V2 BZT52C9V1 Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current

Contextual Info: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C10 BZT52C13 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C36 BZT52C43 BZT52C47 BZT52C51 BZT52C8V2 BZT52C9V1 Features • · · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current

marking W6 diode

Abstract: marking code w6
Contextual Info: BZT52C2V4 - BZT52C39 SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOD-123 · · · · · · · · Maximum Ratings

Contextual Info: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C10 BZT52C13 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C36 BZT52C43 BZT52C47 BZT52C51 BZT52C8V2 BZT52C9V1 Features • · · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current

marking WM

Abstract: BZT52C7v5 spice transistor marking WY BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C39 BZT52C3V0 BZT52C3V3 BZT52C3V6
Contextual Info: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16

wm 294

Contextual Info: BZT52C2V0S - BZT52C39S Lead-free SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S

marking code zener diode wl

Abstract: diode marking code W4
Contextual Info: BZT52C2V4 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C10 BZT52C13 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C36 BZT52C43 BZT52C47 BZT52C51 BZT52C8V2 BZT52C9V1 Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current

DIODE marking W4 38

Abstract: marking W4 DS18004 diode marking code W4
Contextual Info: BZT52C2V4 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C10 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C36 BZT52C43 BZT52C47 BZT52C51 BZT52C8V2 BZT52C9V1 Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current

marking code zener diode wl

Abstract: marking WM MARKING w5 BZT52C36 BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C39 BZT52C3V0 BZT52C3V3
Contextual Info: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16

wm 294

Contextual Info: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE Lead-free SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16

BZT52C6V8

Contextual Info: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE Lead-free SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16

marking code zener diode wl

Abstract: marking WM diode marking w8 BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C39 BZT52C3V0 BZT52C3V3 BZT52C3V6
Contextual Info: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16

Zener diode wz 130

Contextual Info: WTE POWER SEMICONDUCTORS BZT52C2V4S – BZT52C51S Pb 200mW SURFACE MOUNT ZENER DIODE Features Planar Die Construction 200mW Power Dissipation 2.4 – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application C Plastic Material – UL Recognition Flammability

MARKING CODE diode sod123 Wk

Abstract: diode zener w5
Contextual Info: WTE POWER SEMICONDUCTORS BZT52C2V4 – BZT52C51 Pb 410mW SURFACE MOUNT ZENER DIODE Features  Planar Die Construction      410mW Power Dissipation 2.4 – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application C Plastic Material – UL Recognition Flammability