WLCSP PATTERN DESIGN Search Results

WLCSP smt

Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Contextual Info: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None

Nihon handa rx303-92skho

Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
Contextual Info: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale

SAC405

Abstract: SAC405 Data sheet FAN5902UCX MO-229 for3g AN608 3g transistor
Contextual Info: FAN5902 800mA Buck Converter for 3G RFPAs Features Description ƒ ƒ ƒ ƒ ƒ ƒ ƒ 92% Efficient Synchronous Operation The FAN5902 is a high-efficiency, low-noise, synchronous, step-down DC-to-DC converter designed for powering the radio frequency power amplifiers

Contextual Info: Technical Article MS-1908 . Chip Scale Packaging Helps Portable Medical Devices Save Size and Weight by Mike Delaus and Santosh Kudtarkar, Analog Devices, Inc. IDEA IN BRIEF Wafer-level chip scale packages are allowing designers of portable healthcare equipment—such as invasive sensing,

SAC387

Abstract: IPC-7525 pcb warpage in ipc standard land pattern for WLCSP "x-ray machine" ROSIN FLUX TYPE ROL0 WLCSP stencil design FDZ191P sac105 IPC-9075
Contextual Info: www.fairchildsemi.com AN-6084 Surface Mount Assembly Guideline for WLCSP 1.0x1.5 Introduction The Wafer-Level Chip-Scale Package WLCSP is one of the smallest discrete MOSFET devices available in the market. Fairchild’s offering comes in two ultra-low profile

for3g

Abstract: FAN5903UCX FAN5903 FAN5903 2008
Contextual Info: PROVIDED UNDER NDA — PROPRIETARY AND CONFIDENTIAL — DO NOT DISTRIBUTE FAN5903 Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs Features Description • •  FAN5903 is a high-efficiency, low-noise, synchronous, step-down, DC-DC converter designed for powering

Contextual Info: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB

Contextual Info: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB

Contextual Info: MIC94161/2/3/4/5 3A High-Side Load Switch with Reverse Blocking General Description Features The MIC94161/2/3/4/5 is a family of high-side load switches designed to operate from 1.7V to 5.5V input voltage. The load switch pass element is an internal 14.5mΩ RDSON N-Channel MOSFET which enables the

Contextual Info: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc

Contextual Info: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc

Contextual Info: MIC94161/2/3/4/5 3A High-Side Load Switch with Reverse Blocking General Description Features The MIC94161/2/3/4/5 is a family of high-side load switches designed to operate from 1.7V to 5.5V input voltage. The load switch pass element is an internal 14.5mΩ RDSON N-Channel MOSFET which enables the

JEP95 MS-028

Contextual Info: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm

marking 201B

Abstract: 201B 201C ISL99201 ISL99201IRTAZ-T ISL99201IRTAZ-TK ISL99201IRTBZ-T ISL99201IRTBZ-TK ISL99201IRTCZ-T
Contextual Info: ISL99201 Data Sheet February 27, 2009 Filterless High Efficiency 1.5W Class D Mono Amplifier The ISL99201 is a fully integrated high efficiency class-D mono amplifier. It is designed to maximize performance for mobile phone applications. The application circuit requires a

JEP95 MS-028

Contextual Info: ES/SMM5723XZ Preliminary 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm

FAN4860UMP5X

Abstract: FAN4860UC5X LQM21PN1R0MC0 C1005X5R0J225M FAN4860 JESD22-A114
Contextual Info: FAN4860 3MHz, 5V Output Synchronous TinyBoost Regulator Features Description ƒ Operates with Very Small External Components: 1 H Inductor and 0402 Case Size Input and Output Capacitors ƒ ƒ ƒ ƒ ƒ ƒ ƒ ƒ Input Voltage Range from 2.3V to 4.5V The FAN4860 is a low-power boost regulator designed to

FSA642

Abstract: FDMA1024NZ diagram circuit usb mp3 player with radio fm lcd CFL inverter circuit schematic diagram FAN5646 FDC610PZ block diagram 3x3 matrix keypad and microcontroller FDC658AP CFL 12v inverter circuit schematic diagram free pwm DC-DC SC70-5
Contextual Info: PORTABLE SOLUTIONS w w w. f a i r c h i l d s e m i . c o m INTRODUCTION Fairchild Semiconductor provides complete portable design solutions to assist in your design challenges and accelerate time to market in the ever fast moving design cycle. We offer a large portfolio of leading-edge products

Contextual Info: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm

Contextual Info: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA

Contextual Info: ES/SMM5724XZ Preliminary 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm

Contextual Info: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA

Contextual Info: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm

Contextual Info: Preliminary ES/SMM5141XZ 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm

Contextual Info: ES/SMM5141XZ Preliminary 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm