WCSP QUALIFICATION Search Results

W-CSP footprint

Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
Contextual Info: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

TLV5614IYZ

Contextual Info: TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die Wafer Chip Scale Package—Pb-Free/Green FEATURES APPLICATIONS • Four 12-Bit D/A Converters • Programmable Settling Time of Either 3µs or 9µs Typ

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389 – JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • • • • • • • •

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

wcsp qualification

Abstract: TLV5610 TLV5610IDW TLV5610IYE TLV5610IYZ TMS320
Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

WCSP-20

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

WCSP-20

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

WCSP-20

Abstract: Application-SBVA017
Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

TLV5610

Abstract: TLV5610IDW TLV5610IYE TLV5610IYZ TMS320 Application-SBVA017
Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

TLV5614IYZ

Contextual Info: TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die Wafer Chip Scale Package—Pb-Free/Green FEATURES APPLICATIONS • Four 12-Bit D/A Converters • Programmable Settling Time of Either 3µs or 9µs Typ

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

Contextual Info: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •

SN74LVC2G04-EP

Contextual Info: SN74LVC2G04-EP DUAL INVERTER GATE www.ti.com SGLS365 – AUGUST 2006 FEATURES • • • • • • • • • • • • • • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C

SN74LVC2G04-EP

Contextual Info: SN74LVC2G04-EP DUAL INVERTER GATE www.ti.com SGLS365 – AUGUST 2006 FEATURES • • • • • • • • • • • • • • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C

Contextual Info: SN74LVC1G02-EP SINGLE 2-INPUT POSITIVE-NOR GATE www.ti.com SGLS370 – AUGUST 2006 • • • • • • FEATURES • • • • • • 1 Controlled Baseline – One Assembly – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C

Contextual Info: SN74LVC1G02-EP SINGLE 2-INPUT POSITIVE-NOR GATE www.ti.com SGLS370 – AUGUST 2006 • • • • • • FEATURES • • • • • • 1 Controlled Baseline – One Assembly – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C

SN74LVC2G04-EP

Contextual Info: SN74LVC2G04-EP DUAL INVERTER GATE www.ti.com SGLS365 – AUGUST 2006 FEATURES • • • • • • • • • • • • • • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C

SN74LVC2G04-EP

Contextual Info: SN74LVC2G04-EP DUAL INVERTER GATE www.ti.com SGLS365 – AUGUST 2006 FEATURES • • • • • • • • • • • • • • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C