WATER SOLUBLE FLUX Search Results

Contextual Info: CHEMTRONICS TDS #CW 8300 Technical Data Sheet CircuitWorks Water Soluble Flux Pen PRODUCT DESCRIPTION CircuitWorks Water Soluble Flux Pen is designed specifically to apply water soluble flux with precision control. The Water Soluble Flux consists of a neutral pH organic

SN100C

Abstract: Water soluble
Contextual Info: WS482 Water Soluble Cored Wire Solder Features: - Halide-Free - High Activity Level - Good Thermal Transfer - Good Wetting Properties - For Standard and High-Temperature Applications - Extended Cleaning Times, Safe Up to 2 to 3 Days Description: WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste

solder paste 63sn alpha metal

Abstract: failure of heating element in hot air gun making hot air gun 63SN 37PB SOLDER reworking guidelines
Contextual Info: Document 362-1 Soldering Surface Mount Components Types of Solder Concerns regarding the use of water-soluble flux Water soluble fluxes can leave weak organic acid WOA residues that must be thoroughly removed from all pc board components. All fine wire components, like many

2331-ZX

Abstract: Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650
Contextual Info: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than

2331-ZX

Abstract: IPC-TM-650 Sn62Pb36Ag02 IPC-TM650 Kester LIQUID FLUX
Contextual Info: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than

Contextual Info: !Notice other 1. Cleaning Conditions: The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (watersoluble flux, water-soluble cream solder, water-based cleaning

Murata ultrasonic

Contextual Info: !Notice other 1. Cleaning Conditions: The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (watersoluble flux, water-soluble cream solder, water-based cleaning

IEC-695

Abstract: TM9916 2741G2 2741H2 2745AF2 2745CA2 T130 T131 2745CA
Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Shielded Transformers TM9916 • Designed for DS1, DS1C, and CEPT applications • Compatible with water-soluble flux, total-immersion cleaning and machine insertion • Electrostatic shield provides improved longitudinal

multicore solder wire

Abstract: henkel solder Loctite multicore multicore solder J-STD-006 Water soluble flux Loctite multicore solder wire
Contextual Info: Technical Data Sheet Multicore“ Hydro-X September 2007 HIGH ACTIVITY WATER SOLUBLE CORED SOLDER WIRE Properties of Multicore Hydro-X solid flux cored solder wires: x Rapid soldering of most difficult to solder parts x Fast wetting x Water washable, no need for added neutralisers

SN63PB37

Contextual Info: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product

2664AM

Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single THT Shielded Hardened Transformer TM00122 • Designed for T1 carrier applications at 1.544 Mbps • Compatible with water-soluble flux, total-immersion cleaning, and machine insertion • Typical application is to isolate telecom equipment

IEC-695

Abstract: t127
Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Shielded Transformer TM9914 • Designed for T1 carrier applications at 1.544 Mbps • Compatible with water-soluble flux, total-immersion cleaning, and machine insertion • Typical application is to isolate telecom equipment

2741G2

Abstract: 2741H2 2745AF2 2745AJ2 2745AK2 2745CA2 2745G3 T7288 CEPT
Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Transformers • • Operate as pulse transformers at DS1 and CEPT rates • Perform impedance matching and voltage transformation • for line transceivers • TM9913 Compatible with water-soluble flux, total-immersion

Contextual Info: FASTECH SYSTEMS THROUGH-HOLE, THREE-ROW, PIN & SOCKET CONNECTORS 963M FEATURES • Right-angle interconnection • 24 pinouts per board-inch • Through the board tail • Approved for water-soluble-flux/totalimmersion-cleaning (WSF/TIC) • Available with 75 cavities completely

SN100C

Abstract: water soluble cleaning
Contextual Info: OAJ Water Soluble Cored Wire Solder Features: - Improved Wetting Properties - High Activity Level - Reduces Oxidation of Solder Iron Tip - Post-Process Residues Easily Cleaned - Good Thermal Transfer Description: OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide

Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Surface Mount Shielded Tranformers • Operate at the DS1 and CEPT rates of 1.544 and 2.048 Mbps • Shielded transformers reduce EMI • Meets IEC-695, 2-2 flammability requirements TM9920 • Compatible with water-soluble flux, total-immersion

T129

Abstract: IEC-695 2745AK2 2745G3
Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Shielded Transformer • Designed to operate at the DS1 rate of 1.544 Mbps • Shielded transformer reduces EMI • Qualified per Bellcore TR-TSY-000357-1 TM9915 • Compatible with water-soluble flux and total-immersion

Contextual Info: Push Switches Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.

Alps Tact Switch

Abstract: Small Slide Switch alps
Contextual Info: Rotary Switches Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.

alps encoder

Abstract: Alps Tact Switch alps rotary switch alps switch alps encoder 12 TACT Switch
Contextual Info: Dual In-line Package Type Switches Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.

Alps Tact Switch

Contextual Info: Switch Type Multi Control Devices Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.

Contextual Info: FASTECH SYSTEMS THROUGH-HOLE, TWO-ROW, PIN & SOCKET CONNECTOR 963G *• FEATURES • Right-angle interconnections • 16 pinouts per board-inch • Through the board tail • Attached to the PCB by heat staking • Wave-soldered terminals • Approved for water-soluble-flux/totalimmersion-cleaning (WSF/TIC)

GR-78-CORE

Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Contextual Info: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with

bga socket

Abstract: A814
Contextual Info: GHZ BGA Socket and SMT adaptor Page 1 of 2 Assembly Instructions 1. Apply water soluble or no clean flux on the target PCB lands. 2. Apply a small amount of TAC flux on opposite corners of the PCB lands. 3. Note the target board land pattern orientation and the adaptor's orientation mark. Place SMT adaptor solder ball side down onto