WATER SOLUBLE CLEANING Search Results

Contextual Info: CHEMTRONICS TDS #CW 8300 Technical Data Sheet CircuitWorks Water Soluble Flux Pen PRODUCT DESCRIPTION CircuitWorks Water Soluble Flux Pen is designed specifically to apply water soluble flux with precision control. The Water Soluble Flux consists of a neutral pH organic

kraft paper technical

Contextual Info: Water-Soluble Wave Solder Tape 5414 page 1 of 2 Technical Data Product Description Tape 5414 has a poly-vinyl alcohol backing which is water soluble and a synthetic water soluble adhesive to mask gold fingers on printed circuit boards during wave soldering.

SN100C

Abstract: Water soluble
Contextual Info: WS482 Water Soluble Cored Wire Solder Features: - Halide-Free - High Activity Level - Good Thermal Transfer - Good Wetting Properties - For Standard and High-Temperature Applications - Extended Cleaning Times, Safe Up to 2 to 3 Days Description: WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste

Kester 197

Contextual Info: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder

kester Sn62Pb36Ag02

Abstract: Sn63pB37 temp profile
Contextual Info: R500 Dispensable Water-soluble Solder Paste for Leaded Alloys Product Description Physical Properties Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting

solder paste 63sn alpha metal

Abstract: failure of heating element in hot air gun making hot air gun 63SN 37PB SOLDER reworking guidelines
Contextual Info: Document 362-1 Soldering Surface Mount Components Types of Solder Concerns regarding the use of water-soluble flux Water soluble fluxes can leave weak organic acid WOA residues that must be thoroughly removed from all pc board components. All fine wire components, like many

2331-ZX

Abstract: Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650
Contextual Info: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than

2331-ZX

Abstract: IPC-TM-650 Sn62Pb36Ag02 IPC-TM650 Kester LIQUID FLUX
Contextual Info: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than

Contextual Info: !Notice other 1. Cleaning Conditions: The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (watersoluble flux, water-soluble cream solder, water-based cleaning

Murata ultrasonic

Contextual Info: !Notice other 1. Cleaning Conditions: The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (watersoluble flux, water-soluble cream solder, water-based cleaning

IEC-695

Abstract: TM9916 2741G2 2741H2 2745AF2 2745CA2 T130 T131 2745CA
Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Shielded Transformers TM9916 • Designed for DS1, DS1C, and CEPT applications • Compatible with water-soluble flux, total-immersion cleaning and machine insertion • Electrostatic shield provides improved longitudinal

SN63PB37

Contextual Info: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product

multicore solder wire

Abstract: henkel solder Loctite multicore multicore solder J-STD-006 Water soluble flux Loctite multicore solder wire
Contextual Info: Technical Data Sheet Multicore“ Hydro-X September 2007 HIGH ACTIVITY WATER SOLUBLE CORED SOLDER WIRE Properties of Multicore Hydro-X solid flux cored solder wires: x Rapid soldering of most difficult to solder parts x Fast wetting x Water washable, no need for added neutralisers

2664AM

Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single THT Shielded Hardened Transformer TM00122 • Designed for T1 carrier applications at 1.544 Mbps • Compatible with water-soluble flux, total-immersion cleaning, and machine insertion • Typical application is to isolate telecom equipment

Contextual Info: FASTECH SYSTEMS THROUGH-HOLE, THREE-ROW, PIN & SOCKET CONNECTORS 963M FEATURES • Right-angle interconnection • 24 pinouts per board-inch • Through the board tail • Approved for water-soluble-flux/totalimmersion-cleaning (WSF/TIC) • Available with 75 cavities completely

2741G2

Abstract: 2741H2 2745AF2 2745AJ2 2745AK2 2745CA2 2745G3 T7288 CEPT
Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Transformers • • Operate as pulse transformers at DS1 and CEPT rates • Perform impedance matching and voltage transformation • for line transceivers • TM9913 Compatible with water-soluble flux, total-immersion

c 6090

Abstract: IPC-A-610 k type thermocouple Thermocouple Type K oven 65psi
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimpot Products Process Description Materials 1. Apply solder paste to test board 8 - 10 mil thick Temperature Time Interval • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste

SN100C

Abstract: water soluble cleaning
Contextual Info: OAJ Water Soluble Cored Wire Solder Features: - Improved Wetting Properties - High Activity Level - Reduces Oxidation of Solder Iron Tip - Post-Process Residues Easily Cleaned - Good Thermal Transfer Description: OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide

Multicore Solders

Contextual Info: TEMPORARY SOLDER RESISTS SPOT-ON, COPPER SPOT-ON & AQUA SPOT-ON Multicore Temporary Solder Resists are designed to be used on printed circuit boards prior to soldering and will withstand fluxing and wave soldering operations. l Peelable and water soluble versions available

C 6090

Abstract: g10 smd transistor SMD g10 Water soluble water soluble cleaning reflow profile 245 solder paste
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimmers Process Description 1. Apply solder paste to test board 8 - 10 mil thick Materials Time Interval Temperature • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste (see note 1)

Contextual Info: FASTECH SYSTEMS THROUGH-HOLE, TWO-ROW, PIN & SOCKET CONNECTOR 963G *• FEATURES • Right-angle interconnections • 16 pinouts per board-inch • Through the board tail • Attached to the PCB by heat staking • Wave-soldered terminals • Approved for water-soluble-flux/totalimmersion-cleaning (WSF/TIC)

Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Surface Mount Shielded Tranformers • Operate at the DS1 and CEPT rates of 1.544 and 2.048 Mbps • Shielded transformers reduce EMI • Meets IEC-695, 2-2 flammability requirements TM9920 • Compatible with water-soluble flux, total-immersion

T129

Abstract: IEC-695 2745AK2 2745G3
Contextual Info: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Shielded Transformer • Designed to operate at the DS1 rate of 1.544 Mbps • Shielded transformer reduces EMI • Qualified per Bellcore TR-TSY-000357-1 TM9915 • Compatible with water-soluble flux and total-immersion

Contextual Info: Push Switches Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.