WAFER WIN Search Results

SPANSION date code format

Abstract: AM29 T0003 Am29f 405 gde 8 905 959 252
Contextual Info: ‹ Chapter 8 Die and Wafer Shipments CHAPTER 8 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Storage Conditions for Die and Wafer Carrier Designs for Singulated Die Waffle Pack Surftape and Reel Carrier Designs for Wafers Wafer Jar

AM29

Abstract: 29f800bb AMD xp
Contextual Info: u Chapter 11 Die and Wafer Shipments CHAPTER 11 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Carrier Designs for Singulated Die Waffle Pack Surftape and Reel GEL-PAK Die Tray Carrier Designs for Wafers Wafer Jar GEL-PAK Wafer Tray

60Co

Contextual Info: Intersil White Paper Specialty Products Space and Defense Wafer by Wafer Low Dose Rate Acceptance Testing in a Production Environment Abstract—This White Paper describes technical details of a wafer by wafer low dose rate acceptance testing program being implemented for all Intersil radiation hardened products. We

Contextual Info: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.

two leg infrared receiver led

Abstract: EE9-C01 IT16 power window construction details ethylene gas sensor
Contextual Info: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 CSM_EE-SPY801_802_DS_E_3_1 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. • The contact surface with the wafer carrier uses a special chemicalresistant fluororesin.

IC weight sensor

Abstract: chloride ups circuit diagram relay 24v omron two leg infrared receiver led 12V ENERGY LIGHT CIRCUIT DIAGRAM EE-SPX303 hydrocarbon sensor hydrogen gas sensor omron plc Pulsating photoelectric Optical Sensor datasheet
Contextual Info: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.

scfm 50 10 kv

Contextual Info: APS/SPS200TESLA 200 mm Fully-Automated On-Wafer Probing Solution for High-Power Devices DATA SHEET The APS/SPS200TESLA is the industry’s irst fully-automated on-wafer probing solution focused on production performance for high-power semiconductors. The APS/SPS200TESLA improves productivity and yield at inal test by enabling production wafer

MIFARE Card IC Coil Design Guide

Abstract: MIFARE s70 chip Philips MF1 IC S70 General Wafer Specification MF1 IC S70 k 1356 12NC ordering code philips MIFARE s70 philips application notes philips 15601
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Wafer Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Wafer Specification Rev. 3.1 October 2002 Standard 4Kbyte Card IC MF1 IC S70 01

Contextual Info: PRESS RELEASE CYPRESS RESTRUCTURES: SAN JOSE WAFER FACILITY TO BE R&D ONLY SAN JOSE, California. . .October 14, 1996. . .Cypress Semiconductor Corporation [NYSE: CY] today announced a restructuring of its San Jose wafer fabrication facility, including a workforce

MIFARE Card IC Coil Design Guide

Abstract: Philips MF1 IC S50 Mifare MF1 S50 Philips Mifare 1 S50 Philips Mifare 1 S50 specifications philips S50 MF1 S50 mifare s50 MIFARE card MF1 IC S50 S5005
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Wafer Specification Revision 3.0 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Rev. 3.0 October 2002 Wafer Specification Standard Card IC MF1 IC S50 05 CONTENTS 1 SCOPE 3 2 REFERENCE DOCUMENTS

Ablebond 84-1*SR4

Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Contextual Info: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:

MIFARE s70 chip

Abstract: Philips MF1 IC S70 General Wafer Specification MIFARE s70 UV-tape MIFARE Card IC Coil Design Guide S7001 MIFARE Card Coil Design Guide
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Specification “sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 Sawn wafer on UV-tape MF1 IC S70 01

uv-tape

Abstract: Philips MF1 IC S50 Philips Mifare 1 S50 Mifare MF1 S50 MF1 S50 mifare s50 mifare s50 MIFARE mifare mf1 ic s50 MF1 IC S50 MF1ICS5005
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification “sawn wafer on UV-tape” Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 CONTENTS

QCI-39000

Abstract: QCI-30014 SPI-41014 microchip lot code
Contextual Info: M PACKAGING Overview of Microchip Die/Wafer Support INTRODUCTION ELECTRICAL SPECIFICATIONS Microchip Technology Inc. devices are available in wafer form and in die form. All products sold in die or wafers have been characterized and qualified according to the requirements of Microchip Technology Inc.

cpc9909

Abstract: 6-pin smps power control ic cpc1943 MXHV9910 0-10v to 4-20ma Line Driver SHDSL IX2127 CPC1230 opamps catalog deutsch relays inc
Contextual Info: Clare, a wholly owned subsidiary of IXYS Corporation, located 20 miles north of Boston, Massachusetts, USA, designs, manufactures, and markets a wide variety of semiconductor devices. Clare’s wafer fabrication facility features a 600V BCDMOS process on a bonded-wafer, silicon-on-insulator, trench-isolated

QCI-39000

Abstract: QCI-30014 30014 dry cooling tower RG41 200B
Contextual Info: M PACKAGING Overview of Microchip Die/Wafer Support INTRODUCTION ELECTRICAL SPECIFICATIONS Microchip Technology Inc. devices are available in wafer form and in die form. All products sold in die or wafers have been characterized and qualified according to the requirements of Microchip Technology Inc.

Contextual Info: 10 53261-* 51021-* WAFER ASSY REC.HOUSING A W LEAK MATING LENGTH PLUG TERMINAL 50079-* REC.TERMINAL 53261-* 50079-* 51D21-* G ENERAL U N L E S S TO LERAN C ES S P E C IF IE D DIMENSION STYLE WAFER ASSY TERMINAL REC. HOUSING SCALE MM ONLY

abb traction motor

Abstract: diode 6.5 kv 5SMY 12M4500 76E-12 IGBT 6500 V 86M1280 5SMY86J1280 ABB IGBT 76J1280 76M12
Contextual Info: IGBT and Diode dies ABB Semiconductors ABB IGBT and Diode dies from stateof-the-art SPT planar technology platform. Fig.1 Un-sawn wafer, sawn wafer die on frame and pick-and-place dies in waffle-packs ABB Semiconductor has a well established reputation in the

Contextual Info: 10 53261-* 51021-* WAFER ASSY REC.HOUSING A W LEAK MATING LENGTH PLUG TERMINAL 50079-* REC.TERMINAL 53261-* 50079-* 51D21-* G ENERAL U N L E S S TO LERAN C ES S P E C IF IE D DIMENSION STYLE WAFER ASSY TERMINAL REC. HOUSING SCALE MM ONLY

HP8341B

Abstract: HP4145 hp11612a 8970B TRANSISTOR noise figure measurements footprint transistor Plessey
Contextual Info: On Wafer Noise Measurement Using Bipolar Transistor RF Test Structures S.D. Connor Bipolar Characterization Group, Central R&D, G.E.C. Plessey Semiconductors, Tweedale Way, Oldham, Lancs OL9 7LA, England. Abstract:- We present here a technique for on wafer noise we measurements using bipolar R.F. cell structures. Measurements were taken

Contextual Info: 10 53261-* 51021-* WAFER ASSY REC.HOUSING A W LEAK MATING LENGTH PLUG TERMINAL 50079-* REC.TERMINAL 53261-* 50079-* 51D21-* G EN ERAL TO LERAN C ES U N L E S S S P E C IF IE D DIMENSION STYLE WAFER ASSY TERMINAL REC. HOUSING SCALE MM ONLY

TSMC 0.35um

Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
Contextual Info: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:

Contextual Info: 12 13 11 10 NOTES UNLESS OTHERWISE SPECIFIED : 1. MATERIALS: WAFER MATERIAL NUMBER CONTACT PLATING MINIMUM GOLD THICKNESS WAFER PLASTIC COLOR 7 5 1 8 7 -0 0 0 5 0.00076m m OOuin) BLACK 7 5 1 S 7-0055 0.00127mm (50uh) GRAY 751 87-1005 0.00076m m OOuin) BLACK

dycostrate

Abstract: CH-2074 without underfill
Contextual Info: Wafer Level CSP with Solder Support Structure Jörg Jasper EM-Marin S.A., Rue des Sors 3, CH-2074 Marin, Switzerland Jürgen Simon Technical University of Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany Abstract Chip scale package CSP and flip chip interconnects proliferate in telecommunication and other portable products. Wafer level CSP