WACKER SILICONE PASTE Search Results

WACKER SILICONE PASTE Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
FLA2N04BP		Amphenol Communications Solutions	FLA Panel Gasket NEMA ANSI C136.41, Silicone Rubber, Black	PDF
FLBP77012		Amphenol Communications Solutions	FLB Base NEMA ANSI C136.41, 76mm, 3 Power, 4 Signal, Vented, Silicone Gasket	PDF
FLA016230R1		Amphenol Communications Solutions	FLA Receptacle NEMA ANSI C136.41, 3 Power, No Signal, 16AWG, 150C, with Panel Gasket Silicone Rubber	PDF
FLA414130R1		Amphenol Communications Solutions	FLA Receptacle NEMA ANSI C136.41, 3 Power, 4 Signal, 14AWG, 105C, with Panel Gasket Silicone Rubber	PDF
FLBP75012		Amphenol Communications Solutions	FLB Base NEMA ANSI C136.41, 76mm, 3 Power, 2 Signal, Vented, Silicone Gasket	PDF

WACKER SILICONE PASTE Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: MiniSKiiP copyright Vincotech Handling Instructions  for MiniSKiiP These handling instructions apply to all types of MiniSKiiP modules. Handling Instruction 04 03 Ver Thermal paste thickness, pattern modified housing; doc. update Alteration 09.26.2014. Tokes A.	Original	v23990-k-m118-	PDF
wacker silicone paste Abstract: silicone paste p 12 IEC 326-3 Wacker Silicones P-12 Wacker Silicones pcb board of miniskiip 2 Wacker miniskiip board SEMIKRON BOARD wacker rubber Contextual Info: MiniSKiiP - Technical Explanations Assembly Instructions 1 Preparation, surface specification To obtain the maximum thermal conductivity of the module, heat sink and module must fulfil the following specifications. 1.1 Heat sink ≤ 20 µm Heat sink > 10 µm	Original	wacker silicone paste silicone paste p 12 iec 326-3 wacker silicones p-12 +6wacker silicones pcb board of miniskiip 2 wacker miniskiip board semikron board wacker rubber	PDF
pcb board of miniskiip 2 Abstract: miniskiip board MiniSKiiP 1 Package MiniSKiiP MiniSKiiP Package SEMIKRON BOARD Wacker silicone paste p 12 wacker rubber Wacker Silicones Contextual Info: MiniSKiiP Assembly Instructions 1. Preparation, surface specification 1.2 Heat sink ≤ 20 µm Heat sink > 10 µm ≤ 6,3 µm Fig. 1: Heat sink surface specification ♦ Heat sink must be free from grease and particles ♦ unevenness of heat sink mounting area must be ≤ 20 µm	Original	pcb board of miniskiip 2 miniskiip board miniskiip 1 package miniskiip +6miniskiip package semikron board wacker silicone paste p 12 wacker rubber wacker silicones	PDF
30g 122 igbt Abstract: SEMIKRON type designation PCIM 176 display CALCULATION SemiSel 3.1 PCIM 176 pure sinus inverter circuit 60749 IGBT cross reference semikron CALCULATION SemiSel PCIM 95 Contextual Info: SEMiX - Technical Explanations SEMiX ® IGBT Modules & Bridge Rectifier Family Technical Explanations Version 2.0 / January 2008 Christian Daucher 1 Version 2.0 2008-01-22 by SEMIKRON SEMiX® - Technical Explanations Content 1 Introduction . 3	Original	30g 122 igbt semikron type designation pcim 176 display calculation semisel 3.1 +6pcim 176 pure sinus inverter circuit 60749 igbt cross reference semikron calculation semisel pcim 95	PDF
PCIM 176 Abstract: PCIM 95 CALCULATION SemiSel 30g 122 igbt PCIM 176 display IGBT rectifier theory IGBT cross reference semikron pure sinus inverter circuit makrolon 9425 T100 Contextual Info: SEMiX - Technical Explanations SEMiX ® IGBT Modules & Bridge Rectifier Family Technical Explanations Version 2.0 / January 2008 Christian Daucher 1 Version 2.0 2008-01-22 by SEMIKRON SEMiX® - Technical Explanations Content 1 Introduction . 3	Original	pcim 176 pcim 95 calculation semisel 30g 122 igbt +6pcim 176 display igbt rectifier theory igbt cross reference semikron pure sinus inverter circuit makrolon 9425 t100	PDF