W6694 Search Results

W6694 Datasheets (4)

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
W6694		Winbond Electronics	PASSIVE USB-ISDN S-T-CONTROLLER	Original	PDF	466.35KB	33
W6694A		Winbond Electronics	TE mode S/T controller with USB 1.1 interface	Original	PDF	557.25KB	42
W6694ACD		Winbond Electronics	USB Bus ISDN S/T-Controller	Original	PDF	557.24KB	42
W6694CD		Winbond Electronics	S-T Controller with USB interface	Original	PDF	466.35KB	33

W6694 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
ut28615 Abstract: UT-28615 MRC D17 winbond dip8 rom chips DIP8 Plug SR2A DATA SHEET 100PPM 1N4148 W6694A SCHEMATIC mda monitor Contextual Info: Preliminary Data Sheet W6694A USB-ISDN S/T-Controller W6694A USB Bus ISDN S/T-Controller Preliminary Data Sheet -1Publication Release Date: May, 2001 Revision 1.03 Preliminary Data Sheet W6694A USB-ISDN S/T-Controller The information described in this document is the exclusive intellectual property of Winbond	Original	W6694A W6694A W6694A-based -42Publication ut28615 UT-28615 MRC D17 winbond dip8 rom chips DIP8 Plug SR2A DATA SHEET 100PPM 1N4148 SCHEMATIC mda monitor	PDF
GE monitor Abstract: 768-MHz DXDU re-enumeration Contextual Info: Preliminary Data Sheet W6694 Passive USB-ISDN S/T-Controller W6694 USB Bus ISDN S/T-Controller Data Sheet -1Publication Release Date: March., 2000 Revision 0.93 Preliminary Data Sheet W6694 Passive USB-ISDN S/T-Controller The information described in this document is the exclusive intellectual property of Winbond	Original	W6694 W6694-based -31Publication -32Publication GE monitor 768-MHz DXDU re-enumeration	PDF
ut28615 Abstract: UT-28615 MRC D17 siemens sx1 Winbond mda VDD23 W6694CD 1N4148 W6694 Contextual Info: Preliminary W6694 PASSIVE USB-ISDN S/T-CONTROLLER W6694 USB Bus ISDN S/T-Controller Data Sheet The information described in this document is the exclusive intellectual property of Winbond Electronics Corp and shall not be reproduced without permission from Winbond.	Original	W6694 W6694-based ut28615 UT-28615 MRC D17 siemens sx1 Winbond mda VDD23 W6694CD 1N4148 W6694	PDF
MS-6G Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f Contextual Info: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :	Original	Z200-PCN-PA20070101 14X20MM 14X14MM G600F) 48LQFP SB5627 W6694ACD SB5627001 MS-6G ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f	PDF