|
54112-409241000LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
54242-108241000LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 24 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
20021824-100A0T1LF
|
|
Amphenol Communications Solutions
|
Minitek127®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch. |
PDF
|
|
|
54122-410062300RLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
48241-000LF
|
|
Amphenol Communications Solutions
|
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle. |
PDF
|
|
