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L17H2EE1120TM
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 37/37 (Socket/Socket), 0.38m (15 in) Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 2*Arrowhead Boardlock, BL FP=16.41, Row Space=4.07mm |
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10018783-11120TLF
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Amphenol Communications Solutions
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PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch |
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10129187-51120TLF
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Amphenol Communications Solutions
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Minitek®, Board to Board, Receptacle, Through Hole, Vertical, 4 Row, 80 Positions, 2mm (0.079inch), Stacking height 15.05mm (0.593inch), Tail length 1.6mm (0.063inch). |
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10131319-061120TLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 6 Positions, LCP, Non GW Compatible, Tape and Reel with cap. |
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10131319-041120TLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 4 Positions, LCP, Non GW Compatible, Tape and Reel with cap. |
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