UP BOARD INTERMEDIATE SCHEME Search Results

IPC-9592

Abstract: GR-1274-CORE
Contextual Info: 5:1 Intermediate Bus Converter Module: Up to 650 W Output IB048Q096T64N1-00 Features • Input: 38 – 55 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 64 A • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB048Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features • Input: 38 – 55 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 64 A • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB048Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features • Input: 38 – 55 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 64 A • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB054Q096T70N1-00 5:1 Intermediate Bus Converter Module: Up to 750 W Output Features • Input: 36 – 60 Vdc • 98.2% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 70 A • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB054Q096T70N1-00 5:1 Intermediate Bus Converter Module: Up to 750 W Output Features • Input: 36 – 60 Vdc • 98.2% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 70 A • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB050Q096T70N1-00 5:1 Intermediate Bus Converter Module: Up to 750 W Output Features • Input: 36 – 60 Vdc • 98.2% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 70 A • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB0xxQ096T80xx-xx 5:1 Intermediate Bus Converter Module: Up to 850 W Output Features • Input: 36 – 60 Vdc • 98.0% peak efficiency 38-55 Vdc for IB048x • Low profile: 0.42” height above board • Output: 9.6 Vdc at 48 Vin • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB048Q096T70N1-00 5:1 Intermediate Bus Converter Module: Up to 750 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 38 – 55 Vdc • 98.2% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board

Contextual Info: IBC Module IB0xxQ096T64xx-xx 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features • Input: 36 – 60 Vdc • 98.1% peak efficiency 38 – 55 Vdc for IB048x • Low profile: 0.42” height above board • Output: 9.6 Vdc at 48 Vin • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB050Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 36 – 60 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board

Contextual Info: IBC Module IB050Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 36 – 60 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board

GR-1274-CORE

Contextual Info: IBC Module IB054Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 36 – 60 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board

Contextual Info: IBC Module IB054Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 36 – 60 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board

Contextual Info: IBC Module IB048Q096T70N1-00 5:1 Intermediate Bus Converter Module: Up to 750 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 38 – 55 Vdc • 98.2% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board

Contextual Info: FPA WHITE PAPER Factorized Power Architecture and V•I Chips Flexible, High Performance Power System Solutions Introduction Contents Page Introduction 1 The Architectural Problems of Power Conversion 1 Factorized power 2 Architecture FPA : Solving the Contemporary

DB437

Abstract: DB354 SDIP32 ST72141 DB374 ita6v1u1
Contextual Info: ST7MDT5-EMU2B HDS2 Series Emulator User Manual Release 2.1 June 2000 Ref: DOC-ST7MDT5-EMU2B USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED. STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF

eqfp64

Abstract: TQFP64 footprint QFP44 footprint bnc to probe clips QFP64 TQFP64 DB411
Contextual Info: ST7MDT7-EMU2B HDS2 Series Emulator User Manual Release 2.1 June 2000 Ref: DOC-ST7MDT7-EMU2B 1 USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED. STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF

epc10

Abstract: JZM7100 JZM7108 JZM7116 JZM7132 JZY7115 SR-332
Contextual Info: JZM7100 Series OBSOLETE PRODUCT NOT T RECOMMENDED RECOM MMENDE ED FOR R NEW NEW DESIGNS DE ESIGNS Digital Power Manager Contact Factory for Replacement Model Fe Features • Programs, controls, and manages up to 32 independent Z-series POL converters via the

CLA60000

Abstract: zarlink cla5000 CLA5000 16-LINE TO 4-LINE PRIORITY ENCODERS 4 bit binary multiplier CLA5000 Series Zarlink gate array RAD32D MVA50
Contextual Info: CLA60000 Series Channel less CMOS Gate Arrays This new family of gate arrays uses many innovative techniques to achieve 110K gates per chip with system clock speeds of up to 70MHz. The combination of high speed, high gate complexity and low power operation places Zarlink Semiconductor

QFN64

Abstract: ZM7300G zetex 1053 ZM7332
Contextual Info: ZM7300G Series Digital Power Manager Data Sheet Member of the Family Features •      Applications    Low voltage, high density systems utilizing Z-OneTM Digital Intermediate Bus Architectures Broadband, networking, optical, and wireless

iPB48004A120V

Abstract: VDE0805 dc-dc converter 48vdc 400vdc 1-800-LAMBDA-4 dc-dc converter 48vdc 400vdc 3kw brick up board intermediate scheme
Contextual Info: iPB Series 33-41W Pico Brick Converter ‹ Compact 30.5 x 29.3 x 8.1 mm ‹ 36-75VDC Input ‹ 3.3V 10A, 15V 2.75A Nominal Outputs ‹ Surface Mount ‹ Low 8.81mm Profile ‹ 1500VDC Basic Isolation Features and Benefits Feature ‹ ‹ ‹ High operating efficiency up to 89%

ZM00056

Abstract: MO-220 VMMD-3 pc3x DPM 60 ZM00056-KIT QFN64 ZM7300G 16-node 220 tmp ZM7300
Contextual Info: ZM7300G Series Digital Power Manager Data Sheet Member of the Family Features • • • • • • Applications • • • Low voltage, high density systems utilizing Z-OneTM Digital Intermediate Bus Architectures Broadband, networking, optical, and wireless

TQFP64 footprint

Abstract: st72334 qfp64 TQFP44 footprint 72334 72311 TQFP64 package EQFP64 QFP44 footprint rainbow Centronics connector footprint ST72C171
Contextual Info: ST7MDT2-EMU2B HDS2 Series Emulator User Manual Release 1.2 June 2000 Ref: DOC-ST7MDT2-EMU2B USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED. STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF

ZM7332

Abstract: ZM7332G QFN64 ZM7300G ZM7316G-65507
Contextual Info: ZM7300G Series Digital Power Manager Data Sheet Member of the Family Features • • • • • • Applications • • • Low voltage, high density systems utilizing Z-OneTM Digital Intermediate Bus Architectures Broadband, networking, optical, and wireless