ULTRASONIC BOND Search Results

Contextual Info: Bolt Clamped High Power Transducers Dimensions Model: 30402S Features l High efficiency & high output l Large amplitude l Low heat generation l Durability & stability l Easy connection Model: 45402H Applications l Ultrasonic cleaners l Ultrasonic welders l Ultrasonic processing machines: bonding,

ultrasonic transducer circuit

Abstract: ultrasonic transducers 50w 40 khz Ultrasonic Generator Circuit application of ultrasonic sound waves Ultrasonic welding circuit "Piezoelectric transducer" ultrasonic Ultrasonic cleaner circuit 40 khz ultrasonic transducer Ultrasonic welding generator Ultrasonic Cleaning Transducer
Contextual Info: Bei ji ng Ul tra s oni c Tra ns ducer,PCB Genera tor & Pi ezoel ectri c Cera mi c 2012-4-24 We are China Piezo Products Manufacturer who are specialists in Ultrasonic Cleaning transducer,Piezoelectric Ceramic,Ultrasonic Cleaner and Ultrasonic Generator. Ultrasonic Transducer Technical

polaroid 6500

Abstract: Ultrasonic Transducer application notes MHZ ULTRASONIC transducers polaroid ultrasonic transducer circuit ultrasonic transducer polaroid ULTRASONIC transducers Mhz Ultrasonic transmitter receiver ultrasonic transducers distance measure ultrasonic transducer
Contextual Info: M AN597 Implementing Ultrasonic Ranging Author: THEORY OF OPERATION Robert Schreiber Microchip Technology Inc. INTRODUCTION Object ranging is essential in many types of systems. One of the most popular ranging techniques is ultrasonic ranging. Ultrasonic ranging is used in a wide

Contextual Info: AXS2 SEALED TYPE µIC SOCKETS AXS2 µSOCKET SERIES FEATURES 1. Sealed µIC sockets compatible with ultrasonic cleaning (for 30 seconds) 3bath cleaning (boiling, ultrasonic, vapor) and hot water cleaning. 2. The socket is sealed by the hot melt method for high bonding strength.

ic socket DIP

Abstract: ic base for 40 pin DIP ic
Contextual Info: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE Compliance with RoHS Directive ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic,

AXS210611K

Abstract: AXS210811K AXS211411K AXS211611K AXS211811K AXS212011K AXS212411K AXS212471K AXS212811K AXS213211K
Contextual Info: AXS2 SEALED TYPE µIC SOCKETS AXS2 µSOCKET SERIES FEATURES PRODUCT TYPES 1. Sealed µIC sockets compatible with ultrasonic cleaning (for 30 seconds) 3bath cleaning (boiling, ultrasonic, vapor) and hot water cleaning. 2. The socket is sealed by the hot melt

AXS212811

Abstract: AXS210611K AXS210811K AXS211411K AXS211611K AXS211811K AXS212011K AXS212411K AXS212471K AXS212811K
Contextual Info: AXS2 SEALED TYPE µIC SOCKETS AXS2 µSOCKET SERIES FEATURES PRODUCT TYPES 1. Sealed µIC sockets compatible with ultrasonic cleaning (for 30 seconds) 3bath cleaning (boiling, ultrasonic, vapor) and hot water cleaning. 2. The socket is sealed by the hot melt

Contextual Info: Order Discontinued as of August 31, 2009 AXS2 SEALED TYPE µIC SOCKETS AXS2 µSOCKET SERIES FEATURES 1. Sealed µIC sockets compatible with ultrasonic cleaning (for 30 seconds) 3bath cleaning (boiling, ultrasonic, vapor) and hot water cleaning. 2. The socket is sealed by the hot melt

8 pin ic base socket round pin type lead

Abstract: 40 pin ic base socket round pin type lead 28 pin ic base socket round pin type lead 18 pin ic base socket round pin type lead ic base for 40 pin DIP ic Socket IC 24 pin AXS110819 AXS110811 AXS111411 AXS111811
Contextual Info: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE Compliance with RoHS Directive http://www.mew.co.jp/ac/e/ ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic,

Contextual Info: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic, vapor) and hot water. 2. The top surface of the socket is

Contextual Info: AXS1 ROUND PIN TYPE SEALED IC SOCKETS AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN (SEALED TYPE) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic, vapor) and hot water. 2. The top surface of the socket is

Contextual Info: SIDAC OVP CHIPS OVER VOLTAGE PROTECTION Hard Glass Passivated Positive Resistance Turn On IS 800 mA Max. SIZE: 0.075" x 0.075" (Less Kerf) x 0.010" Silver Metalized for Solder Assembly Also available with Aluminum one side for Heavy Aluminum wire ultrasonic bonding.

Contextual Info: APPLICATION NOTES Attachment Methods Bonding of capacitors to substrates can be cat­ egorized into two methods: those involving solder, which are prevalent, and those using other mate­ rials, such as epoxies and thermo-compression or ultrasonic bonding with wire.

L59 microswitch

Abstract: microswitch l96 "Pressure transducer" MEDIAMATE MICRO SWITCH FREEPORT BZE6-2RN S877T BZE7-2RQ8-PG MICRO SWITCH FREEPORT A ILLINOIS. USA model L96 KEMA 02 ATEX 2240 947-F4Y-2D-1C0-300E ST2R5BG2SPGF
Contextual Info: Industrial Switches and Sensors Global switches Heavy duty switches Compact switches Product solutions on the Interactive Catalogue Precision switches Hazardous location switches Safety switches Relays Position products Ultrasonic distance sensors Pressure sensors

Contextual Info: Board Design Considerations Bonding of capacitors to substrates can be categorized into two methods, those involving solder, which are prevalent, and those using other materials, such as epoxies and thermocompression or ultrasonic bonding with wire. The amount of solder applied to the chip capacitor will

GO220-5

Contextual Info: SIDAC OVP CHIPS OVER VOLTAGE PROTECTION • Hard Glass Passivated • Positive Resistance Turn On IS 800 mA Max. • SIZE: 0.110" x 0.110" (Less Kerf) x 0.010" • Silver Metalized for Solder Assembly • Also available with Aluminum one side for Heavy Aluminum wire ultrasonic bonding.

CH4730

Abstract: 1N4728 1N4764 CH4728 CH4729 CH4731 CH4732 CH4733 CH4734 CH4735
Contextual Info: VOLTAGE REGULATOR PLANAR DIODE CHIPS HIGH POWER 3.3-100 VOLTS Electrically sim ilar to the J E D E C 1N 4 7 2 8 - 1N 4 764 Com patible with ultrasonic and thermocompression lead bonding, scrub and eutectic preform die bonding. Junction surfaces are protected from ambient

Contextual Info: SIDAC OVP CHIPS OVER VOLTAGE PROTECTION • Hard Glass Passivated • Positive Resistance Turn On IS 800 mA Max. • SIZE: 0.135" x 0.135" (Less Kerf) x 0.010" • Silver Metalized for Solder Assembly • Also available with Aluminum one side for Heavy • Aluminum wire ultrasonic bonding.

MSK PRODUCT COMPARISON CHART

Contextual Info: MSK PRODUCT COMPARISON CHART Test Flow or Requirement MIL-STD-883 Test Method Certification Qualification QML Listing No Element Evaluation Clean Room Processing Ultrasonic Inspection, TM 2030 Wirebond Process Control No Yes A/R Yes Hermetic Class H Yes

CDQ2N52

Abstract: 2 MHZ ULTRASONIC transducers CDK1N52
Contextual Info: Technical Specification FLUXUS F70x Liquid Ultrasonic Flowmeter for Permanent Installation Designed for wall mounting or installation in 19'' rack systems Features • Precise bi-directional and highly dynamic flow measurement with the non-intrusive clamp-on technology

inductive speed sensor

Abstract: MQVR3S-530RA 1000VA QT50UVR3F SAFQT50U QT50UVR3FQ1 QT50UVR3WQ MQVR3S-515RA
Contextual Info: U-GAGE QT50U Series Sensors – Universal Supply Voltage Long-Range Ultrasonic Sensors with Electromechanical Relay Output Features • Fast, easy-to-use TEACH-Mode programming; no potentiometer adjustments • SPDT electromechanical relay for high-capacity switching

ic socket DIP

Abstract: Socket IC 24 pin
Contextual Info: Order Discontinued as of August 31, 2009 AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE Compliance with RoHS Directive ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds),

ANCC-151A

Abstract: ANCC-153A
Contextual Info: PCS and WLAN Omni Antennas ANCC-15x Series V4.00 Features ● ● ● ● ● ● Light Weight - Slim Profile Patented Printed Circuit Technology Watertight Ultrasonic and O-Ring Sealed Groundplane Independent Stainless Steel Hardware Multiple pigtail lengths, radome colors and connector

Omron

Abstract: V750-D22M03-IM 5888 d1111 omron nt series RFID Ultrasonic welding V750-D22M02-IM
Contextual Info: Omron V750 Series omRon GEN • GLOBAL INLAYS Omron Inlays Single Design for Global Use Unmatched Performance RoHS Restriction of Hazardous Substance Compliant Jomful is Omron's own technology used to manufacture inlays. The term JOMFUL is derived from: Joint Of Metal with Film by Ultrasonic