ULC SERIES Search Results

ulc series

Abstract: nuclear
Contextual Info: ULC Series ULC Series Push-Pull Push-Pull Connectors Connectors for for Nuclear Nuclear Industry Industry ULC Series 3 ULC Series 4 ULC Series 5 ULC Series 6 ULC Series 7 ULC Series 8 ULC Series 9 ULC Series 10 ULC Series 11 ULC Series 12 ULC Series 13 ULC Series

ATT ORCA fpga

Abstract: cmos vs ttl TEMIC PLD ATT ORCA fpga architecture XC4000 part numbering system ic master rely ic schematic diagram TEMIC DATABOOK
Contextual Info: ULC Design Checklist Please complete and include with ULC design data package To complete feasibility or start conversion, all questions must be answered 1. Customer Company: .

ulc xc3030

Abstract: Temic ulc xc3030 EPM7128 XC3030 TEMIC EPM7128 TEMIC PLD BQFP 100 PACKAGE EPM7128 PLCC R/ULC/A1440
Contextual Info: Ordering Ordering Information Prior to conversion, ULCs are referred to by a generic ULC part number and separate package designation plus an optional temperature range formed as follows ULC/ base PLD or FPGA pins–package where base PLD or FPGA refers to EPM7128 or XC3030

Temic ulc

Abstract: TEMIC DATABOOK XILINX XC2000 TEMIC PLD vantis jtag schematic actel die run marking altera ep
Contextual Info: Design Requirements ULC–Design Checklist To perform the ULC to FPGA or EPLD feasibility study and conversion rapidly and accurately, please fill out the form below and supply the requested material. All questions must be answered. 1. Customer Technical Contact

JUPITER

Abstract: JUPITER ULC JUPITER 30 triaxial connectors JUPITER M series TEFZEL COAXIAL CABLE
Contextual Info: JUPITER ULC Series Description Applications ț Push-pull locking System ț Multipin, coaxial, triaxial, connectors ț Solder contacts ț Remoted manipulated version are available Equipments for nuclear reprocessing plant Standards Characteristics Electrical

uart with bit parity

Contextual Info: VISH A Y ▼ TOIM3232 _ Vishay Telefunken Integrated Interface Circuits ïiyWÂîr: ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 |xm Description

EIA232

Abstract: MAX232 SO16L TFDS3000
Contextual Info: TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length 0.8 mm Description The TOIM3xxx series ICs provide proper timing for the

TFDS3000

Abstract: infrared transmitter receiver rs232 EIA232 MAX232 SO16L IRDA TRANSMITTER
Contextual Info: TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length 0.8 mm Description The TOIM3xxx series ICs provide proper timing for the

CRCW

Abstract: RS232 MAX232 EIA232 MAX232 TFDU4100 TFDU4300 XT49S 2T11
Contextual Info: TOIM4232 VISHAY Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuit ULC Technology: High performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 µm . Description 18080

TOIMx232

Abstract: CRCW 75c211 82546 293D105X9016A CRCW1206-20R0FRT1 TFDS420x crcw12060 1206A220
Contextual Info: TOIM4232 VISHAY Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuit ULC Technology: High performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 µm . Description 18080

UA1044

Abstract: UA1068 UA1084 UA1100 UA1120 UA1132 UA1144 UA1160 UA1184 UA1208
Contextual Info: UA1 Series 0.35 µm ULC Series Description The UA1 series of ULCs is well suited for conversion large sized CPLDs and FPGAs. Devices are implemented in high–performance CMOS technology with 0.35–µ m drawn channel lengths, and are capable of supporting

CMOS RS232 Level Converter

Abstract: infrared circuit infrared transistor rs232 protocol "Infrared TRANSCEIVER" DATASHEET INFRARED SEND MODULE infrared transmitter receiver rs232 Infrared-transceiver ir transmitter receiver rs232 EIA232
Contextual Info: TOIM3000/3232 Infrared IrDA Integrated Interface Circuits ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length 0.8 mm Description The TOIM3xxx series ICs provide proper timing for the

Contextual Info: UA1 Series 0.35 µm ULC Series Description The UA1 series of ULCs is well suited for conversion large sized CPLDs and FPGAs. Devices are implemented in high–performance CMOS technology with 0.35–µ m drawn channel lengths, and are capable of supporting

10R0

Abstract: 293D SO16L TFDS4000 TOIM3000 mhs ulc
Contextual Info: TOIM3000 Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM300 IC provides the proper timing for the

TTL RS232 Level Converter

Abstract: maxim 1987 MAX3232CSE maxim max 1987 4000 Series Integrated Infrared Transceiver Cannon connectors CMOS RS232 Level Converter sub-d9 "Infrared TRANSCEIVER" DATASHEET capacitor Vishay VJ 1206
Contextual Info: TOIM4232 Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse

ic 293D

Abstract: MAXIM MAX232 SO16L
Contextual Info: TOIM4232 VISHAY Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuit ULC Technology: High performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 µm . Description 18080

bc815

Abstract: bc815 transistor MAX232 for level converter ic 293D EIA232 MAX232 SO16L TFDS4000 TFDS4500 capacitor Vishay VJ 1206
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for

BC815-25

Abstract: bc815 CRCW 1n4145 Temic ulc ic 293D
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for

TFDS4000

Abstract: infrared transmitter receiver rs232 10R0 293D SO16L CRCW-1206-10R0-F-RT1 tfds*4000
Contextual Info: TOIM3000 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3000 IC provides the proper timing for the

tfds*4000

Abstract: TOIM3000
Contextual Info: TOIM3000 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3000 IC provides the proper timing for the

82520

Abstract: tfds*4000
Contextual Info: TOIM3000 VISHAY T Vishay Telefunken Integrated Interface Circuits MEMBER IrDA ML ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 ^m Description The TOIM300 1C provides the proper timing for the

TFDS4000

Abstract: infrared transmitter receiver rs232 TFDS3000 Infrared transmitter
Contextual Info: TOIM3000 VI SHAY Vishay Telefunken ▼ Integrated Interface Circuits SSIBS ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 ^m Description The TOIM300 1C provides the proper timing for the

TFDS4000

Contextual Info: TOIM3000 ym M f ▼ Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 |xm Description The TOIM300 1C provides the proper timing for the

CRCW

Abstract: ic 293D 4000-Series
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for