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    UDG-92017 Search Results

    UDG-92017 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    67292-017LF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. PDF
    54112-109201700LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. PDF
    67292-017
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. PDF
    10122992-017LF
    		Amphenol Communications Solutions HPCE-STRADDLE MOUNT THICKER HOST BOARD 28P20S PDF
    54112-809201750LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. PDF