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68004-401HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail. |
PDF
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93944-401HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54mm (0.100in) Pitch. |
PDF
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68604-401HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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TLV5633CPW
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Texas Instruments
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12-Bit DAC Parallel Voltage Out Pgrmable Int Ref Settling Time, Pwr Consumption, 8-bit uC Comp Int 20-TSSOP 0 to 70 |
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TLV5633IDW
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Texas Instruments
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12-Bit DAC Parallel Voltage Out Pgrmable Int Ref Settling Time, Pwr Consumption, 8-bit uC Comp Int 20-SOIC -40 to 85 |
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