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54122-106140950LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch |
PDF
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54112-106101000RLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10127721-061GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 3.2mm Kink Tail (100u\\ Tin) plating, GW Compatible LCP, Black Color,Tray Packing. |
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54122-106120650RLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch |
PDF
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54112-106101050LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
PDF
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