TUNGSTEN ALLOY SHEET Search Results

744051

Abstract: "MATERIAL DECLARATION SHEET"
Contextual Info: MATERIAL DECLARATION SHEET Material # 6657S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Housing Molded PBT 6.8 2 Bushing Steel Alloy 1.35 3 Hex Nut Brass Alloy

3545H

Abstract: 3545-H metal oxide grease TUNGSTEN ALLOY SHEET 744051
Contextual Info: MATERIAL DECLARATION SHEET Material # 3545H Product Line Precisions Posted Date Compliance Date Ref. 3548 RoHS Compliant No No. Construction element Material group Material weight [g] 1 Shaft Brass Alloy 9.1625 2 C-Ring Stainless Steel Alloy 0.009 3 Bushing

744051

Contextual Info: MATERIAL DECLARATION SHEET Material # 6637S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Contact Spring Palmet Alloy 0.00095 2 C-Ring Stainless Steel Alloy

MR301

Abstract: nec mr301 LR46266 MR301H
Contextual Info: Document No. ER0046EJAV3SG00 WWW-MR301 MR301 Series 1998 • DIMENSIONS mm(inch) 22.5MAX. (0.89) 0.3 (0.01) 3.5 (0.14) 17MAX. (0.67) 16.5MAX. (0.65) 12.2 2 2.3 (0.48) (0.08) (0.09) Tolerance ±0.2 mm (0.008) 12 2 (0.47) (0.08) ■ RECOMMENDED PCB PAD LAYOUT and

Solder Paste, Indium 5.8

Abstract: ABLEBOND 84-1LMIT ro4003 8mil 1295SA cte table epoxy PCB Rogers RO4003 84-1-LMIT cte table RO4003 RO4350
Contextual Info: AMMC-XXXX Production Assembly Process Application Note 5409 Description Recommended Collet Drawing This document describes and illustrates the handling and attachment of Avago’s AMMC-XXXX mmWave bare die. Handling Guidelines Avago’s GaAs mmWave ICs vary in size but are typically

Contextual Info: Power PCB Relay G2R • Creepage distance of 8.0 mm min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available see G2R-S(S data sheet). • High sensitivity (360 mW) and high capacity (16 A) types

G2R-217

Abstract: dpdt latching relay omron relay g2r G2R-2 HP125 b300 pilot duty 10a omron g2r 1 e dc12 G2R-1 relay tv3 G2RK OMRON
Contextual Info: Power PCB Relay G2R • Creepage distance of 8.0 mm min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available see G2R-S(S data sheet). • High sensitivity (360 mW) and high capacity (16 A) types

Contextual Info: Power PCB Relay G2R • Creepage distance of 8.0 mm min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available see G2R-S(S data sheet). • High sensitivity (360 mW) and high capacity (16 A) types

Contextual Info: Issued March 1997 232-4774 Data Pack G Carbide parting off system Data Sheet RS stock numbers 849-243 to 849-394 Introduction Originally developed in the 1950’s, Tungsten Carbide Inserts are preformed shapes made from a mixture of cemented carbides. They are manufactured by a sintering rather than a melting process.

tokin 108

Abstract: NEC RELAY MR301 NEC Tokin 108 Tokin
Contextual Info: DATA SHEET AUTOMOTIVE RELAYS EQ1 SERIES DESCRIPTION The new NEC TOKIN EQI Series automotive relays are designed for motor and lamp control applications that require a high level of quality and performance. The EQ1 has a unique two-piece design for the magnetic circuit,

EQ1 Series

Abstract: tokin 108 NEC RELAY MR301 NEC Tokin 108 NEC Tokin relay relay nec 31000S catalog
Contextual Info: DATA SHEET To be discontinued in July,2014 AUTOMOTIVE RELAYS EQ1 SERIES DESCRIPTION The new NEC TOKIN EQI Series automotive relays are designed for motor and lamp control applications that require a high level of quality and performance. The EQ1 has a unique two-piece design for the magnetic circuit,

it1338

Abstract: Solder Paste Dupont
Contextual Info: ASIC Flip Chips: Manufacture and Use fôv H . i r b t i r a I . i i h s o n , A p p l i c a t i o n s F n i» i iu 't * i Introduction plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or

Flip Chip Substrate

Abstract: Dupont 9476
Contextual Info: ASIC Flip Chips: Manufacture and Use ! ir i v i t : ì I>mmi . Introduction Application specific integrated circuits ASICs have been available and widely used for almost two decades. On the other hand, the surface mount technology known as "Flip Chip” has been available, but not widely known outside of

Dupont 9476

Contextual Info: ASIC FLIP CHIPS Application Note ASIC Flip Chips: Manufacture and Use By Barbara L. Gibson, Applications Engineer plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or

Model 3M

Contextual Info: 980/980E Ionized Air Gun Data Sheet The 3M 980 Ionized Air Gun is an excellent tool for blowing particulate contamination off of any surface, even from the most static-sensitive products. It releases a constantly balanced stream of compressed ionized air or gas that neutralizes static charge that

MRF286

Abstract: AP 494 Application Note ansys eb211 motorola milestone
Contextual Info: MOTOROLA Order thisEB211 document by EB211/D SEMICONDUCTOR ENGINEERING BULLETIN EB211 Thermal Management and Solder Mounting Method for the MRF286, 60 Watt Power Device in a CuW Copper Tungsten Base Package Prepared by: Jeanne Pavio, Jerry Mason, Bill Adams, Wendi Stemmons, Craig Johnson, Bob Wentworth,

V10686

Abstract: v1068 ABB P6 C276 MR-01-75 UNSN06600ASME Welding Hastelloy MR0175 en10204 600Lb hastelloy corrosion
Contextual Info: Data Sheet Heavy Duty Thermowell SS/HDT_1 for the Oil & Gas Industry  Constructed from durable, high-quality materials – for use in heavy duty applications  Low cost of ownership – exchangeability of inserts while line or vessel is in service  Wide range of applications covered

MRF286

Abstract: EB211
Contextual Info: Freescale Semiconductor, Inc. MOTOROLA SEMICONDUCTOR ENGINEERING BULLETIN ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Order this EB211 document by EB211/D EB211 Thermal Management and Solder Mounting Method for the MRF286, 60 Watt Power Device in a CuW

latching relay G2R

Abstract: omron g2r-2 Datasheet OMRON G2R-24 A300 B300 E41643 G2R-14 G2R-14-DC12 G2R-24
Contextual Info: Power PCB Relay G2R • Creepage distance of 8.0 mm 0.31 min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available (see G2R-S(S) data sheet). • High sensitivity (360 mW) and high capacity (16 A) types

pyrometer

Abstract: 55-FE optical pyrometer 80ni
Contextual Info: Issued July 1990 A10625 Infra-red temperature indicator pyrometer Stocknumber 254-112 The RS low cost, non-contact temperature indicator is ideal for applications where objects to be measured are of low thermal mass or are inappropriate for contact measurement, ie. moving parts.

SOT333

Abstract: SOT423 sot468 thermal compound wps II TO metal package aluminum kovar SOT439 Transistor Packages sot262 SOT443 rf transistor smd pages
Contextual Info: Philips Semiconductors RF transmitting transistor and power amplifier fundamentals 4 RF and microwave transistor packages RF AND MICROWAVE TRANSISTOR PACKAGES handbook, halfpage The packages of electronic devices are, in general, designed to: metal cap – Protect the electronics from mechanical damage

Contextual Info: G5RL-U/-K PCB Power Relay 16 A High Switching Current, General-purpose Latching Relay • Creepage distance 8 mm between coil and contacts. • 10 kV Impulse withstand voltage. • Ambient Operating Temperature 85°C • Suitable for TV-8 rating. SPST-NO (1a

KR207

Abstract: KR310 HEIDENHAIN rod
Contextual Info: Model THP Tweezer Handpiece A successful resistance spot welding process generally requires a welding power supply, a spot welding head, and a weld monitor or weld checker. Selecting the right accessories for these critical components can enhance and improve your results, and provide

240-W

Abstract: G2R-14-DC12 16A 250VAC 16A 30VDC omron relays DATASHEET G2R-14 G2R-24 G2RK2A 8A DPDT RELAY 220 omron g2r-2 G2RK
Contextual Info: Power PCB Relay G2R • Creepage distance of 8.0 mm min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available see G2R-S(S data sheet). • High sensitivity (360 mW) and high capacity (16 A) types