TSS 204 Search Results

Contextual Info: 11-05-7 TSS N Series Specifications: Finish Insulation : Gold plated centre contact and nickel plated body. : Teflon. Straight Plug Clamp CM-07 For Clamp Type Connectors Page 1 26/05/06 V1.0 11-05-7 TSS N Series Preparation of Cable: 1 1. Slide nut, washer and gasket onto cable.

Contextual Info: F-204 amtec T/H BOX CONNECTOR STRIPS SPEC IFIC A TIO N S BCS For complete specifications see www.samtec.com?BCS NO. PINS PER ROW Insulator Material: Black Liquid Crystal Mates w ith: Polymer C ontact Material: TSW, MTSW, TSS, Phosphor Bronze ^ = 10 m" 0,25Mm

M103

Abstract: M105 M107
Contextual Info: ACSM-2047 SCHOTTKY DIODE MODULE DETECTORS Frequency Range min Sensitivity (min) Flatness vs. Frequency (max) Typical TSS Nominal Video Capacitance 1 – 18 1800 1.0 -51 20 GHz mV/mW ±dB dBm pF NOTES: Maximum input power: +20dBm Sensitivity is measured into an open circuit load (>10k ohm).

Contextual Info: ACSM-2047 SCHOTTKY DIODE MODULE DETECTORS Frequency Range min Sensitivity (min) Flatness vs. Frequency (max) Typical TSS Nominal Video Capacitance 1 – 18 1800 1.0 -51 20 GHz mV/mW ±dB dBm pF NOTES: Maximum input power: +20dBm Sensitivity is measured into an open circuit load (>10k ohm).

LPC TPM

Abstract: ST19WP18-TPM-C ST19WP18 TSSOP28 PKCS-11 st19wp18-tpm intel LPC interface spec 1.0
Contextual Info: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)

Contextual Info: V.35 - Interface connectors V.35 DTE/DCE Interface connectors Description The Telecommunications Standardization Sector TSS V.35, formerly CCITT V.35 is the international standard termed “Data Transmission at 48 Kbps using 60108 Khz Group-Band Circuits. It makes

LPC TPM

Abstract: lpc interface ST19WP18 ST19WP18-TPM-C TSSOP28 Trusted platform module SERIRQ intel LPC interface spec 1.0 lad1 NTRU Cryptosystems
Contextual Info: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)

Contextual Info: V.35 - interface connectors V.35 DTE/DCE Interface connectors Description The Telecommunications Standardization Sector TSS V.35, formerly CCITT V.35 is the international standard termed “Data Transmission at 48 Kbps using 60-108 Khz Group-Band Circuits. It makes use of a 34

intel LPC interface spec 1.0

Contextual Info: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)

Contextual Info: SIEMENS Standard EEPROM ICs SLx 24C08/16 8/16 Kbit 1024/2048 x 8 bit Serial CM O S-EEPRO M with I2C Synchronous 2-Wire Bus D atasheet 1998-07-27 ÖHBSbQS O l l W S TSS I SLx 24C08/16 Revision History: Current Version: 1998-07-27 Previous Version: 06.97 Page

Contextual Info: A43E06161 Preliminary 512K X 16 Bit X 2 Banks Synchronous DRAM Document Title 512K X 16 Bit X 2 Banks Synchronous DRAM Revision History History Issue Date Remark 0.0 Initial issue May 3, 2005 Preliminary 0.1 Modify tSS from 3ns to 2ns July 31, 2005 Rev. No.

A43E06161

Abstract: A43E06161V
Contextual Info: A43E06161 Preliminary 512K X 16 Bit X 2 Banks Synchronous DRAM Document Title 512K X 16 Bit X 2 Banks Synchronous DRAM Revision History History Issue Date Remark 0.0 Initial issue May 3, 2005 Preliminary 0.1 Modify tSS from 3ns to 2ns July 31, 2005 Rev. No.

Contextual Info: A43E06161 Preliminary 512K X 16 Bit X 2 Banks Synchronous DRAM Document Title 512K X 16 Bit X 2 Banks Synchronous DRAM Revision History History Issue Date Remark 0.0 Initial issue May 3, 2005 Preliminary 0.1 Modify tSS from 3ns to 2ns July 31, 2005 Rev. No.

ST19WP18-TPM-B

Abstract: year 2000 compliant motherboard LPC TPM ST19WP18 TSSOP28 "multiplexed command" pkcs-11
Contextual Info: ST19WP18-TPM-B Trusted Platform Module TPM With TCG Software Stack DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1) ■ 33-MHz LOW PIN COUNT (LPC)

D1710

Abstract: JIS-C3604 RG58U SK 474 22-4250
Contextual Info: REVISIONS PART NO. 13-06-1 TSS RG58U ECN # REV DESCRIPTION DRAWN DATE CHECKD DATE APPRVD DATE - A RELEASED S. K 17/5/06 K. S 17/5/06 N. K 31/5/06 Dimensions : Millimetres Inches This data sheet and its contents (the "Information") belong to the Premier Farnell Group

LPC TPM

Abstract: SMARTCARD IC TPM module ST19WP18 ST19WP18-TPM-B TSSOP28 intel LPC interface spec 1.0
Contextual Info: ST19WP18-TPM-B Trusted Platform Module TPM With TCG Software Stack DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1) ■ 33-MHz LOW PIN COUNT (LPC)

Contextual Info: S P E C IF IC A T IO N S For complete specifications see www.samtec.com?SSW or www.samtec.com?SSQ Mates With: TSW, MTSW, MTLW, LCW, EW, ZW, TSS, ZSS, TSM, TSSH Insulator Material: Black Liquid Crystal T O Polymer -S & -D or !IIIS« Black High Temperature

Trusted platform module

Abstract: 1. Mobile Computing block diagram
Contextual Info: ST19WP18-TPM-B Trusted Platform Module TPM With TCG Software Stack DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1) ■ 33-MHz LOW PIN COUNT (LPC)

OCO14

Abstract: TP3077 TP3072V-X
Contextual Info: TP3072V-X blE D • bSGllEH DDfilôMS TSS ■NSCE! NATL SEMICOND LINEAR National mm Semiconductor TP3072V-X COMBO II Programmable PCM CODEC/Filter General Description Features The TP3072V-X is a second-generation combined PCM CO­ DEC and Filler devices optimized for digital switching appli­

15-03 TSS RG58 CABLE 50 OHM

Abstract: TSS 204 rg58 tnc crimp TNC female 50 ohm RG58-50 110-GH
Contextual Info: TSS Series TNC 50 Ohm Plugs, Jacks & Socket Features: • Silver plated bodies and contacts. • Teflon insulators. N series connectors are similar to BNC connectors except for their mating threaded coupling which is designed to provide low reflection from DC to 11GHz under extreme environmental conditions, especially shock and vibration.

RG174U

Contextual Info: REVISIONS PART NO. 13-11 TSS RG174U Main Body This data sheet and its contents the "Information" belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence

D1710

Abstract: JIS-C3604 RG58U
Contextual Info: REVISIONS PART NO. 13-10-1 TSS RG58U ECN # REV DESCRIPTION DRAWN DATE CHECKD DATE APPRVD DATE - A RELEASED S. K 17/5/06 K. S 17/5/06 N. K 31/5/06 Stripping Dimension This data sheet and its contents the "Information" belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for

Contextual Info: ACSM-2047 Schottky Diode Module Detector Features: • Contains hermetically sealed modules, internal RF matching, DC return, and RF bypass capacitor. • The video port is protected from static or transient charges. • Input impedance matching. • Models may be chosen for broadband RF

Contextual Info: ACSM-2047 Schottky Diode Module Detector Features: • Contains hermetically sealed modules, internal RF matching, DC return, and RF bypass capacitor. • The video port is protected from static or transient charges. • Input impedance matching. • Models may be chosen for broadband RF