TSOP32 PAD Search Results

soj16 package

Abstract: adaptor ssop56 dip48 W9518 W9512 W9514 SOJ-20 W9524 soj16 soj18 package TSOP14 package
Contextual Info: WINSLOW ADAPTICs - SOIC or SOJ Solder Pads to DIP Adapters SOIC or SOJ Solder Pads to DIP ADAPTICs how to order shipping costs terms & conditions These ADAPTICs have an array of SOP solder pads on the top and male pins on the underside to mate with a DIP socket or solder into a

Contextual Info: Very Low Power CMOS SRAM 512K X 8 bit BS62LV4006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 30mA Max. at 55ns

TSOP32 pad

Abstract: bs62lv1027 R0201-BS62LV1027
Contextual Info: Very Low Power CMOS SRAM 128K X 8 bit BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns

BS62LV2006

Abstract: BS62LV2006DC BS62LV2006SC BS62LV2006STC BS62LV2006TC TSOP32 pad
Contextual Info: Very Low Power CMOS SRAM 256K X 8 bit BS62LV2006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 23mA Max. 2mA (Max.)

375E-1

Abstract: BS62LV4006 BS62LV4006EC BS62LV4006PC BS62LV4006SC BS62LV4006STC BS62LV4006S stsop32
Contextual Info: Very Low Power CMOS SRAM 512K X 8 bit BS62LV4006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 30mA Max. at 55ns

Contextual Info: Very Low Power CMOS SRAM 128K X 8 bit BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns

Contextual Info: Very Low Power CMOS SRAM 256K X 8 bit BS62LV2006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 23mA Max. 2mA (Max.)

BS62LV1027

Abstract: BS62LV1027DC BS62LV1027PC BS62LV1027SC BS62LV1027STC BS62LV1027TC VDR15
Contextual Info: Very Low Power CMOS SRAM 128K X 8 bit BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns

AN58 NOVRAM Battery Backed SRAM

Abstract: layout soic28 X20C17 DS1220 pnp array SCR Inverter datasheet TSOP32 pad Unlimited Xicor an58 AN58
Contextual Info: Application Note AN58 NOVRAM vs. Battery Backed SRAM: Latch-up Considerations for Nonvolatile Systems by Gray Creager, September 1994 Nonvolatile memories come in many varieties ROM, PROM, EPROM, etc. , however in-circuit reprogrammable nonvolatile memories are often

sharp laser diodes

Abstract: TSOP855
Contextual Info: VISHAY INTERTECHNO L O G Y , INC . INTERACTIVE data book ir receiver modules vishay semiconductors vse-db0090-1010 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents

marking a9

Abstract: BS62LV1027 A988
Contextual Info: Very Low Power CMOS SRAM 128K X 8 bit Automotive Grade BS62LV1027 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 15mA Max. at 70ns

125OC

Abstract: BS62LV2006
Contextual Info: Very Low Power CMOS SRAM 256K X 8 bit BS62LV2006 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. 2mA (Max.) Standby current : 0.1uA (Typ.)

Contextual Info: Very Low Power CMOS SRAM 128K X 8 bit Automotive Grade BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns

jedec ms-024

Abstract: BS62LV4006SA
Contextual Info: Very Low Power CMOS SRAM 512K X 8 bit Automotive Grade BS62LV4006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 30mA Max. at 55ns

BS62LV4006

Contextual Info: Very Low Power CMOS SRAM 512K X 8 bit Automotive Grade BS62LV4006 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 25mA Max. at 70ns

jedec ms-024

Abstract: BH62UV4000 BH62UV4000DI BH62UV4000SI
Contextual Info: Ultra Low Power/High Speed CMOS SRAM 512K X 8 bit BH62UV4000 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC low operation voltage : 1.65V ~ 3.6V Ÿ Ultra low power consumption : VCC = 3.6V Operation current : 10mA Max. at 55ns

PGA68

Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
Contextual Info: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE

MQFP Shipping Trays

Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

JEDEC TRAY DIMENSIONS

Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

TATC-X03

Abstract: stss-sw1e SOMC-14 smd x17 P440 C 05 MX-500P-21 O M 335 SP440 talon MX-500S
Contextual Info: SmartHeat Technology SmartHeat 22/11/01 2:09 pm Page 8 S mar t He at ® W h e n t h e t e m p e r a t u r e o f t h e he a te r a c o p p e r b a r c o a te d wi th a ma g netized iro n/nickel a llo y r e a c h e s a c e r t a i n l e v e l ( i t s C u r i e Po i nt) , i t s t op s a b s or b i n g e ne r g y an d th e t empera ture becom es

FSQ510 Equivalent

Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
Contextual Info: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178

METCAL SP200

Abstract: MX-500P-21 QX2-P-21 SP440 QX2-P-11 SP-PW1-20 ERG IC 1118 NZ-D1113 D1116 MX-500S-11
Contextual Info: Precision Systems for the Electronics Bench SOLDERING, DESOLDERING AND REWORK SYSTEMS SP 44 0 SP440 Desoldering System Since 1982, OK International’s Metcal brand has been the industr y ’s single source of high-per formance, precision systems for the electronics bench.

Contextual Info: Cover and contents 22/11/01 2:04 pm Page 2 Precision Systems for the Electronics Bench SOLDERING, DESOLDERING AND REWORK SYSTEMS Precision Systems for the Electronics Bench WORLD HEADQUARTERS AND NORTH AMERICAN OFFICE 1530 O’BRIEN DRIVE • MENLO PARK • CA 94025 • USA

enamelled copper wire swg table

Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
Contextual Info: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .