TSOP L9 Search Results

TSOP8

Abstract: Resistance TSOP 32 thermal resistance Robinson Nugent IC SOCKET Robinson Nugent TFP-32DAR 28P2C-A FPT-28P-M03 nugent fujitsu polymer
Contextual Info: Material Copyrighted By Its Respective Manufacturer Detail ' A - S = 10 : 1 1 = Body 2 = Contact 3 = Frame Holder S13NOOS Robinson —ñtugant RN ICPAK Specifications for TSOP Sockets MATERIALS Plating: TT = 2.03 urn (80 pinch) Tin/Lead overall. Body: Liquid crystal polymer

Contextual Info: MH4M32AATJ-6,-7 FAST PAGE MODE 134217728-BIT 4194304-WQRD BY 32-BIT DYNAMIC RAM DESCRIPTION The MH4M32AATJ ¡s 4194304-word x 32-bit dynamic RAM. PIN CONFIGURATION (TOP VIEW) [Both side] This is consists of eight industry standard 4M x 4 dynamic o RAMs in TSOP.

Contextual Info: ADVANCE‡ 64Mb: x16, x32 SYNCFLASH MEMORY SYNCFLASH MEMORY MT28S4M16B1LC – 1 Meg x 16 x 4 banks MT28S2M32B1LC – 512K x 32 x 4 banks FEATURES PIN ASSIGNMENT Top View 86-Pin TSOP • PC133 SDRAM-compatible read timing • Fully synchronous; all signals registered on

MICRON POWER RESISTOR 24W

Contextual Info: ADVANCE MICRON ft M T24D T J472(S 4 MEG x 72 DRAM MODULE SElMCONOUCTQft MC 4 MEG X 72 DRAM DRAM MODULE 5.0V FAST PAGE MODE, OPTIONAL SELF REFRESH FEATURES OPTIONS MARKING • Timing 60ns access 70ns access -6 -7 • Components SOJ TSOP D DT • Packages

MT48LC4M32B2F5

Abstract: MT48LC4M32B2B5 MT48LC4M32B2P
Contextual Info: 128Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC4M32B2 - 1 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/sdram Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive

Contextual Info: PRELIMINARY‡ 64Mb: x16, x32 SYNCFLASH MEMORY SYNCFLASH MEMORY MT28S4M16B1LC– 1 Meg x 16 x 4 banks MT28S2M32B1LC– 512K x 32 x 4 banks Features Pin Assignment Top View 86-Pin TSOP • PC133 SDRAM-compatible read timing • Fully synchronous; all signals registered on positive

MT48LC4M32B2P

Contextual Info: 128Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC4M32B2 - 1 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/sdram Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive

MT48LC8M32B2

Contextual Info: 256Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC8M32B2 - 2 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/dramds Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive

128MbSDRAMx32

Abstract: MT48LC4M32B2F5 MT48LC4M32B2P
Contextual Info: 128Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC4M32B2 - 1 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/sdram Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive

Contextual Info: Features • Fast Read Access Tim e - 45 ns • Low-Power CMOS Operation - 100 jiA max. Standby - 25 mA max. Active at 5 MHz AT27C010L - 35 mA max. Active at 5 MHz (AT27C010) • JEDEC Standard Packages - 32-Lead 600-mil PDIP - 32-Lead PLCC - 32-Lead TSOP

6 pin mini din

Abstract: MT48LC4M32B2P 3 pin mini mold transistor TSOP 86 Package MT48LC4M32B2F5 transistor marking CS COMMAND diode a7 m 208 b1 rele driver
Contextual Info: 128Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC4M32B2 - 1 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/sdram Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive

Contextual Info: I ^DDS371 000 037 3 b73 TSOP — 32 50 XX Number of Contacts:. 32 — SMT — TT J 50 = .50mm Lead Spacing . Plating _ Blank = Standard Pack 5 parts/pack TP - Tape & Reel (body only) 'Fram es are packaged in vinyl bags ALL DIMENSIONS IN MILLIMETERS ± 0.3 General Tolerance

Contextual Info: GMM77316280CTG 16Mx72, 3.3V, 4K Ref, EDO Description Features The GMM77316280CTG is an 16M x 72 bits Dynamic RAM MODULE which is assembled 18 pieces o f 16M x 4bit DRAM s in 32 pin TSOP- ± package and two 16bit driver ICs in 48pin TSSOP package mounted on a 168 pin

Contextual Info: STI722007D1 -xxVG 168-PIN DIMMS 2M X 72 Bit DRAM DIMM with EDO Mode and ECC FEATURES GENERAL DESCRIPTION • The Simple Technology STI722007D1-xxVG is a 2M x 72 bit Dynamic RAM high density memory module. The module consists of nine 2M x 8 bit DRAMs in a 28-pin TSOP packages.

Contextual Info: •HYUNDAI HYM564410A N-Series 4M x 64-bit CMOS DRAM MODULE DESCRIPTION The HYM564410A is a 4M x 64-bit Fast page mode CMOS DRAM module consisting of sixteen HY5117400A in 24/28 pin SOJ or TSOP-II and two 16-bit BiCMOS line drivers in TSSOP on a 168 pin glass-epoxy printed circuit

Contextual Info: GMM7738280CTG BMx72, 3.3 V, 4K Ref, EDO D escription The G M M 7738280CTG is an 8M x 72 bits Dynamic RAM MODULE which is assembled 9 pieces of 8M x 8bit DRAMs in 32 pin TSOP II package and two 16bit driver ICs in 48pin TSSOP package mounted on a 168 pin printed

Contextual Info: HYM591610 Series »HYUNDAI SEMICONDUCTOR 16M X 9-bit CMOS DRAM MODULE PRELIMINARY DESCRIPTION The HYM591610 is a 16M x 9-bit Fast page mode CMOS DRAM module consisting ol nine HY5117100 in 24/28 pin SOJ or TSOP-II on a 30 pin glass-epoxy printed circuit board. 0.22|iF decoupling capacitor is mounted for

Contextual Info: HB526A264DB Series 1,048,576-word x 64-bit x 2-bank Synchronous Dynamic RAM Module HITACHI ADE-203-607 Z Preliminary Rev. 0.0 Jun. 18, 1996 Description The HB526A264DB is a lM x 64 X 2 banks Synchronous Dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 8 pieces of 16-Mbit SDRAM (HM5216805TT) sealed in TSOP

dap013

Abstract: DAP011 free pdf download P55 MOSFET P55 MOSFET mosfet d38 equivalent am2 SOCKET PIN LAYOUT b30 c250 rp633 LA185 2N3904 A35
Contextual Info: A 4 3 2 B 1 INDEX 2 CPU SOCKET 7 3 CLOCK GENERATOR 4 MTXC HOST INTERFACE 5 MTXC SYSTEM INTERFACE 6 CACHE 1 7 CACHE 2 8 DIMM 1 9 DIMM 2 10 SYSTEM BIOS, TSOP 11 PIIX4 1 12 PIIX4 2 13 IDE INTERFACE 14 ULTRA IO CONTROLLER 15 PARALLEL PORT 16 KB, FLOPPY, & COM PORTS

Contextual Info: CMOS 8M 1 M x 8 MROM FEATURES • 1,048,576 x 8 bit organization (Byte mode: BYTE = V,L) 524,288 x 16 bit organization (Word mode: BŸTË = V,H) PIN CONNECTIONS 56-PIN TSOP TOP VIEW • Access time: 120 ns (MAX.) • Supply current: -O p e ra tin g : 35 mA (MAX.)

Contextual Info: 13 Od \ :r " \ V -—< { I T00S371 0000375 44b • O e t a I I ' A* S - l O : 1 ~Q) 1 = Body 2 = Contact 3 = Frame Holder EP TSOP — 40 50 XX — SMT — TT ' ” Number of Contacts: 40 _ T 50 = .50mm — Lead Spacing ~ — ~ . Plating -Blank = Standard Pack (5 parts/pack)

Contextual Info: HB526A164DB Series 524,288-word x 64-bit x 2-bank Synchronous Dynamic RAM Module HITACHI ADE-203-606 Z Preliminary - Rev. 0.0 Jun. 18, 1996 Description The HB526A164DB is a 512k x 64 x 2 banks Synchronous Dynamic RAM Small Outline Dual In-line Memory M odule (S.O.DIMM), mounted 4 pieces of 16-Mbit SDRAM (HM5216165TT) sealed in TSOP

Contextual Info: E2D5090-17-50 O K I Sem iconductor M SM 9892L 2M-bit Serial Voice Flash Memory GENERAL DESCRIPTION The MSM 9892L is a 2Mb flash memory that operates at 2.7 V to 3.6 V. Since backup is not needed, the number of pins is small, and the pins are contained in a small-package 28-pin TSOP, the

Contextual Info: SOCKETS TSOP — 28 55 XX — SMT — TT Plating Number of Contacts: 28 <1005371 Blank = Standard Pack 5 parts/pack TP = Tape and Reel (body only) 'Frames are packaged in vinyl bag 55 = .55mm Lead Spacing K S e c t ion A-B 0000372 |5 5 « » - « B 737 1 = Body