TSOP I Search Results

tsop6

Abstract: TSOP-6 SI3443DV TSOP-6 Marking Marking information part marking information 036 marking TSOP66
Contextual Info: Si3443DV Package Outline TSOP-6 Part Marking Information TSOP-6 6 www.irf.com

TSOP 32 socket

Abstract: Yamaichi socket adapters Intel 48 TSOP Yamaichi SSOP socket adapters wand intel manual TSOP 48 socket
Contextual Info: SOCKETS/SOCKET TOOLS INTEL TSOP Precision Vacuum Wand • ■ ■ ■ ■ ■ ■ Reduces bent leads Increases process throughput time Minimizes handling Utilizes guide pins Eliminates manual alignments Works with Yamaichi* TSOP sockets and Intel TSOP trays

M312L5623MTS

Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
Contextual Info: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

TSOP 48 socket

Contextual Info: SOCKETS/SOCKET TOOLS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile ENPLAS’ open-top TSOP Type I series

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

TSOP 48 thermal resistance

Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead

Contextual Info: shrink-TSOP KM44S32030AN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 8M x 4Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 April 1999 Samsung Electronics reserves the right to change products or specification without notice. REV. 0.1 Apr. 1999 shrink-TSOP

Contextual Info: shrink-TSOP KM48S16030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 shrink-TSOP

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

Contextual Info: 4 Mb, SmartVoltage, Cobra, I-Temp, TSOP, LH28F004SCHTL85

SC70-5L

Abstract: siliconix j201 Siliconix tsop datasheet 72728 t0520 0007 T1 diode TSOP TSOP Package
Contextual Info: Device Orientation Vishay Siliconix Device Orientation SC70-5L, TSOP-5L DEVICE ORIENTATION Package Method SC70-5L T1 TSOP-5L T1 User Direction of Feed Revision control of this drawing is maintained through Document Control, Pack Specification—PACK-0007-11

Dense-Pac Microsystems

Abstract: DP3SZ128512X816NY5 DENSE-PAC TSOP 56 Package
Contextual Info: 1Meg SRAM/8Meg FLASH, 70 - 100ns, TSOP STACK 30A195-00 A 1 Megabit SRAM / 8 Megabit FLASH DP3SZ128512X816NY5 ADVANCED INFORMATION DESCRIPTION: The DP3SZ128512X816NY5 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ TSOP stacking

Contextual Info: NTGS3455T1 MOSFET -3.5 Amps, -30 Volts P−Channel TSOP−6 Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available http://onsemi.com Applications V(BR)DSS

NTGS3455T1

Abstract: NTGS3455T1G
Contextual Info: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available http://onsemi.com Applications V(BR)DSS

TSOP-6 material

Abstract: tssop8 thermal performance TSOP-6 175
Contextual Info: TSOP-6—The Next Step for LITTLE FOOTR Cellular telephones, notebook computers, and other portable electronic systems are becoming smaller with each new generation of products. The new TSOP-6 LITTLE FOOT family anticipates this evolution. Its small size allows the

NTGS3433T1

Abstract: NTGS3433T1G
Contextual Info: NTGS3433T1 MOSFET −3.3 Amps, −12 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

Contextual Info: n AMENDMENT Advanced Micro Devices CMOS Memory Products 1991 Data Book Handbook Publication: Am27C256 PID# 08007F/1 Page 2-40 Amend this data sheet to add information on the TSOP package that is now available for this product. CONNECTION DIAGRAM TSOP Packages

NTGS3455T1

Abstract: NTGS3455T1G
Contextual Info: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

DP3SZ128512X16NY5

Abstract: SA10 SA11 SA12 SA13 Dense-Pac Microsystems
Contextual Info: 2Meg SRAM/8Meg FLASH, 70ns, TSOP STACK 30A193-00 C 2 Megabit SRAM / 8 Megabit FLASH DP3SZ128512X16NY5 ADVANCED INFORMATION DESCRIPTION: The DP3SZ128512X16NY5 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ TSOP stacking technology. The Module packs 2-Megabits of

Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

71406

Abstract: tsop6 package solder mask 1206 8 ChipFET AN818 AN826 AN-818
Contextual Info: AN818 Vishay Siliconix Using the Single-Channel TSOP-6 As a Second-Source for the 1206-8 Single-Channel ChipFETr Kandarp Pandya INTRODUCTION The Vishay Siliconix ChipFET is a state-of-the-art package that evolved from the TSOP-6 format. Despite the improved

tsop6 marking 443

Contextual Info: NTGS3443T1 Power MOSFET 4.4 Amps, 20 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available 4.4 AMPERES 20 VOLTS