TSOP 86 PACKAGE Search Results

TSOP 86 Package

Abstract: tsop 86
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 86 PIN PLASTIC FPT-86P-M01 86-pin plastic TSOP II Lead pitch 0.50mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-86P-M01) 86-pin plastic TSOP (II) (FPT-86P-M01) 86 44 Details of "A" part 0.25(.010)

MT48LCM32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LCM32B2P

Abstract: MT48LCM32B2 x32s
Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LC2M3B2b5

Abstract: MT48LCM32B2 MT48LCM32B2P MT48LC2M3B2 MT48LCM32 SMD MARKING code tac 63 ball fbga thermal resistance micron MT48LC4M16A2B4-6A IT 64Mb SDRAM is a high-speed CMOS
Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LCM32B2

Abstract: MT48LC2M3B2
Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LC4M32B2P

Abstract: TP 472
Contextual Info: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)

MT48LC4M32B2P

Abstract: marking 6a2 smd 6A 1176
Contextual Info: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)

MT48LC4M32B2P

Contextual Info: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)

MT48LC4M32B2P

Abstract: x32SDR
Contextual Info: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)

MT48LC4M32B2P

Contextual Info: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)

TSOP 86 Package

Abstract: TSOP 400 86
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 86 PIN PLASTIC To Top / Package Lineup / Package Index FPT-86P-M01 86-pin plastic TSOP II Lead pitch 0.50 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-86P-M01)

TSOP 54 PIN

Contextual Info: PACKAGING INFORMATION Plastic TSOP 54–Pin, 86-Pin Package Code: T Type II N N/2+1 Notes: 1. Controlling dimension: millimieters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be

MX23L12822

Abstract: MX23L12822MC-12 MX23L12822YC-12 tsop 86
Contextual Info: MX23L12822 128M-BIT 8M x 16 / 4M x 32 MASK ROM WITH PAGE MODE FEATURES • Current - Operating: 75mA (max.) - Standby: 15uA (max.) • Supply voltage - 3.3V±10% • Package - 70 pin SSOP (500 mil) - 86 pin TSOP(2) • Bit organization - 8M x 16 (byte mode)

MT48LCM32B2

Abstract: MT48LC2M3B2b5 MT48LCM32B2P MT48LCM32 Micron Technology automotive
Contextual Info: Preliminary‡ 64Mb: x32 Automotive SDRAM Features Automotive SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL on page – 86-pin TSOP II (400 mil) standard

K4S643234E

Contextual Info: K4S643234E-TC CMOS SDRAM 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 2.5V Commercial Temperature 86-TSOP Revision 1.3 October 2001 Samsung Electronics reserves the right to change products or specification without notice. -1- Rev. 1.3 (Oct. 2001)

Contextual Info: K4S643232E-TE/N CMOS SDRAM 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 3.3V Extended Temperature 86-TSOP Revision 1.4 December 2001 Samsung Electronics reserves the right to change products or specification without notice. -1- Rev. 1.4 (Dec. 2001)

K4S643232F-TI/p

Abstract: K4S643232F
Contextual Info: K4S643232F-TI/P CMOS SDRAM 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 3.3V Industrial Temperature 86-TSOP Revision 1.0 January 2002 Samsung Electronics reserves the right to change products or specification without notice. -1- Rev. 1.0 (Jan. 2002)

K4S643232H-UC

Contextual Info: SDRAM 64Mb H-die x32 CMOS SDRAM 2M x 32 SDRAM 86 TSOP-II with Pb-Free (RoHS compliant) Revision 1.1 August 2004 Samsung Electronics reserves the right to change products or specification without notice. -1- Rev. 1.1 August 2004 SDRAM 64Mb H-die (x32) CMOS SDRAM

Contextual Info: ADVANCE‡ 64Mb: x16, x32 SYNCFLASH MEMORY SYNCFLASH MEMORY MT28S4M16B1LC – 1 Meg x 16 x 4 banks MT28S2M32B1LC – 512K x 32 x 4 banks FEATURES PIN ASSIGNMENT Top View 86-Pin TSOP • PC133 SDRAM-compatible read timing • Fully synchronous; all signals registered on

MT48LC4M32B2F5

Abstract: MT48LC4M32B2B5 MT48LC4M32B2P
Contextual Info: 128Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC4M32B2 - 1 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/sdram Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive

MT48LC4M32B2P

Contextual Info: 128Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC4M32B2 - 1 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/sdram Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive

MT48LC8M32B2

Contextual Info: 256Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC8M32B2 - 2 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/dramds Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive

128MbSDRAMx32

Abstract: MT48LC4M32B2F5 MT48LC4M32B2P
Contextual Info: 128Mb: x32 SDRAM SYNCHRONOUS DRAM MT48LC4M32B2 - 1 MEG x 32 x 4 BANKS For the latest data sheet, please refer to the Micron Web site: www.micron.com/sdram Features Figure 1: Pin Assignment Top View 86-Pin TSOP • PC100 functionality • Fully synchronous; all signals registered on positive