TSOP 32 PIN Search Results

PA32TS14-OT

Abstract: 32TS14
Contextual Info: PA32TS14-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS14-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket.

29f512

Abstract: pinout socket 7 PA32TS20-OT 29F010
Contextual Info: PA32TS20-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS20-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. Several Flash EEPROM

Enplas drawings

Abstract: TSOP 54 PIN Enplas OTS 0,047 63 DIP 32 DIMENSION enplas TSOP 40 socket F28F010 F28F020
Contextual Info: CIC-32TS-32D-A6-ENP-R 32-Lead TSOP to a 32-Pin DIP 3/98 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: F28F010 F28F020 SOCKET: BASE 32-Pin DIP PIN NAMES SOCKET 32-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

pinout socket 7

Abstract: 0,047 63 CIC-32TS-32D-B6-YAM-S
Contextual Info: CIC-32TS-32D-B6-YAM-S 32-Lead TSOP to a 32-Pin DIP Mar-98 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: One to One Standard Pinout SOCKET: BASE 32-Pin DIP PIN NAMES SOCKET 32-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

TSOP 44 socket

Abstract: 32PIN-DIP-SOCKET
Contextual Info: CIC-32TS-32D-B6-YAM-R 32-Lead TSOP to a 32-Pin DIP Mar-98 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: One to One Reverse Pinout SOCKET: BASE 32-Pin DIP PIN NAMES SOCKET 32-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

W9759

Abstract: MBM29F010 29C101T15 intel 28F020 intel 28F010 28F010T AM29F010 28F020T 28F001BX-B 28F001BX-T
Contextual Info: Created in DoubleCAD XT, www.DoubleCAD.com 17.78 mm 6.42 mm 32 pin TSOP to 32 pin DIP 22.04 mm Part Number W9759 Product Group Programmer Adapters Top Package TSOP Top Pitch 0.5mm Bottom Package DIP Bottom Pitch 0.6" Top Pins 32 Bottom Pins 32 15.24 mm 2.54 mm

STT 433

Abstract: V62C5181024 RB800 RM302 Z010
Contextual Info: M O SEL VITELIC PRELIMINARY V62C5181024 128K X 8 STATIC RAM Features • Packages - 32-pin TSOP Standard - 32-pin TSOP (Reverse) - 32-pin 600 mil PDIP - 32-pin 300 mil SOP (450 mil pin-to-pin) - 32-pin 440 mil SOP (525 mil pin-to-pin) ■ High-speed: 35, 45, 55, 70 ns

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M07 32-pin plastic TSOP I Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-32P-M07) 32-pin plastic TSOP (I) (FPT-32P-M07) LEAD No. 32 1 Details of "A" part

tsop 17

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M25 32-pin plastic TSOP I Lead pitch 0.50mm Package width 8.0mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-32P-M25) 32-pin plastic TSOP (I) (FPT-32P-M25)

FPT-32P-M24

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M24 Lead pitch 0.50mm Package width 8.0mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 32-pin plastic TSOP I (FPT-32P-M24) 32-pin plastic TSOP (I) (FPT-32P-M24)

FPT-32P-M24

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC FPT-32P-M24 32-pin plastic TSOP I Lead pitch 0.50 mm Package width 8.0 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-32P-M24) 32-pin plastic TSOP (I)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC FPT-32P-M25 32-pin plastic TSOP I Lead pitch 0.50 mm Package width 8.0 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-32P-M25) 32-pin plastic TSOP (I)

Contextual Info: Qualification Report October 1993, Version 1.0, QTP# 93275 Thin Small Outline Package 32 Lead TSOP Type 1 Dry packing required CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 32 Pins TSOP

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M05 Lead pitch 0.60mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Reverse bend 32-pin plastic TSOP I (FPT-32P-M05) 32-pin plastic TSOP (I) (FPT-32P-M05) 25 24 Details of "A" part

TSOP032-P-0820-1

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M06 EIAJ code : TSOP032-P-0820-1 32-pin plastic TSOP I Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-32P-M06) 32-pin plastic TSOP (I) (FPT-32P-M06)

Contextual Info: M O SEL V ITELIC • Packages - 32-pin TSOP Standard - 32-pin TSOP (Reverse) - 32-pin 300 mil PDIP - 32-pin 300 mil SOJ - 32-pin 400 mil SOJ Features ■ ■ ■ ■ ■ ■ ■ P R E LIM IN A R Y V61C5181024 128K X 8 STA TIC R A M High-speed: 10, 12, 15, 20 ns

Contextual Info: M O S E L V IT E L IC PRELIM INARY V62C3181024 2 .7 VOL T 1 2 8 K X 8 STA TIC RAM Features • Packages - 32-pin TSOP Standard - 32-pin TSOP (Reverse) - 32-pin 600 mil PDIP - 32-pin 300 mil SOP (450 mil pin-to-pin) - 32-pin 440 mil SOP (525 mil pin-to-pin)

Contextual Info: PA32-28-3TS Data Sheet 32 pin TSOP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32-28-3TS adapter converts the pinout of a 32 pin TSOP device to its 28 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. The AMD 27C256, and others

MT48LCM32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LCM32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LC2M32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LCM32B2P

Abstract: MT48LCM32B2 x32s
Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LC2M3B2b5

Abstract: MT48LCM32B2 MT48LCM32B2P MT48LC2M3B2 MT48LCM32 SMD MARKING code tac 63 ball fbga thermal resistance micron MT48LC4M16A2B4-6A IT 64Mb SDRAM is a high-speed CMOS
Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free