TSOP 17 Search Results

Contextual Info: shrink-TSOP KM44S32030AN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 8M x 4Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 April 1999 Samsung Electronics reserves the right to change products or specification without notice. REV. 0.1 Apr. 1999 shrink-TSOP

Contextual Info: shrink-TSOP KM48S16030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 shrink-TSOP

M312L5623MTS

Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
Contextual Info: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM

Contextual Info: CIC-40TS-40D-F6-YAM-S 40-Lead TSOP to a 40-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F004B3 E28F008B3 E28F016B3 SOCKET: BASE 40-Pin DIP PIN NAMES SOCKET 40-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

PC133 registered reference design

Contextual Info: Shrink-TSOP KMM390S6520BN Preliminary PC133 Registered DIMM Revision History Revision 0.0 July 29. 1999, Preliminary - First generation of datasheet. REV. 0.0 July. 1999 Shrink-TSOP KMM390S6520BN Preliminary PC133 Registered DIMM KMM390S6520BN SDRAM DIMM

48TS-40D-A6-WEL-S

Abstract: TSOP 48 socket
Contextual Info: CIC-48TS-40D-A6-WEL-S 48-Lead TSOP to a 40-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F200CV / B5 E28F400CE / CV / B5 SOCKET: Wells 648-0482211-A31 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $190.00 $171.00 $161.50 $142.50 TYPICAL DIMENSIONS:

Contextual Info: Shrink-TSOP KMM377S6520BN Preliminary 512MB Registered DIMM 512MB Registered DIMM based on 128Mb SDRAM sTSOP2 Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 Shrink-TSOP KMM377S6520BN

CIC-56TS-48D-B6-YAM-S

Abstract: cic56ts48d-b6-yam
Contextual Info: CIC-56TS-48D-B6-YAM-S REV 2 56-Lead TSOP to a 48-Pin DIP 6/97 (EXAMPLES) TSOP DEVICES: PIN CONFIGURATION: E28F016XS SOCKET: Yamaichi IC191-0562-003N QTY PRICE EACH 1-4 5-9 10-24 25-49 $200.00 $180.00 $170.00 $150.00 PRICING: TYPICAL DIMENSIONS: (Drawings not to scale)

Contextual Info: Shrink-TSOP KMM464S3323BN Preliminary 144pin SDRAM SODIMM 256MB SDRAM SODIMM based on 128Mb SDRAM sTSOP Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 Shrink-TSOP KMM464S3323BN

wells 648-0482211

Abstract: 648-0482211 648-0482211-A31
Contextual Info: CIC-48TS-44D-A6-WEL-S 48-Lead TSOP to a 44-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: BASE 44-Pin DIP E28F200CV / B5 E28F400CE / CV / B5 E28F800CE / CV / B5 SOCKET: Wells 648-0482211-A31 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $195.00 $175.50

wells 648-0482211

Abstract: CIC-48TS-40D-B6-WEL-S 648-0482211
Contextual Info: CIC-48TS-40D-B6-WEL-S 48-Lead TSOP to a 40-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F200CV / B5 E28F400CE / CV / B5 E28F800CE / CV / B5 SOCKET: Wells 648-0482211-A31 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $190.00 $171.00 $161.50 $142.50

NTGS3433T1

Abstract: NTGS3433T1G
Contextual Info: NTGS3433T1 MOSFET −3.3 Amps, −12 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

DP3SZ128512X16NY5

Abstract: SA10 SA11 SA12 SA13 Dense-Pac Microsystems
Contextual Info: 2Meg SRAM/8Meg FLASH, 70ns, TSOP STACK 30A193-00 C 2 Megabit SRAM / 8 Megabit FLASH DP3SZ128512X16NY5 ADVANCED INFORMATION DESCRIPTION: The DP3SZ128512X16NY5 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ TSOP stacking technology. The Module packs 2-Megabits of

Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

71406

Abstract: tsop6 package solder mask 1206 8 ChipFET AN818 AN826 AN-818
Contextual Info: AN818 Vishay Siliconix Using the Single-Channel TSOP-6 As a Second-Source for the 1206-8 Single-Channel ChipFETr Kandarp Pandya INTRODUCTION The Vishay Siliconix ChipFET is a state-of-the-art package that evolved from the TSOP-6 format. Despite the improved

marking code OZ

Contextual Info: NTGS3433T1 MOSFET -3.3 Amps, -12 Volts P−Channel TSOP−6 Features • Ultra Low RDS on • Higher Efficiency Extending Battery Life • Miniature TSOP−6 Surface Mount Package http://onsemi.com Applications • Power Management in Portable and Battery−Powered Products, i.e.:

200B

Abstract: 27C512-12 27C512-15 27C512A
Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM PACKAGE TYPES TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

k4h510438b

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM Pb-Free DDR SDRAM DDR SDRAM Registered Module 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC 66 TSOP II with Pb-Free (RoHS compliant) Revision 1.2 Oct. 2004 Revison 1.2 Oct. 2004

A37 diode

Contextual Info: NTGS4111P, NVGS4111P Power MOSFET −30 V, −4.7 A, Single P−Channel, TSOP−6 Features • • • • • • Leading −30 V Trench Process for Low RDS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space

Contextual Info: NVGS4111P Product Preview Power MOSFET −30 V, −6.2 A, Single P−Channel, TSOP−6 Features • • • • • • Leading −30 V Trench Process for Low RDS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space

block diagram laptop ac adapter

Abstract: SLUFM16GU2U-A nand flash pcb layout design serial flash memory 16gb format JESD22-B110 nand flash 16gb hirose 6 pin serial 9 pin
Contextual Info: 1GB to 16GB USB Flash Module www.stec-inc.com SLUFMxGU2U I -y USB Solid-State Flash Disk Capacity: 1GB - 16GB USB 2.0 Compliant Form Factors: • Horizontal Mount • Standard Connector or 9-Pin DConnector  1-High TSOP Flash Placement or Stacked TSOP Flash Placement

Contextual Info: CIC-40TS-40D-B6-YAM-S REV 2 40-Lead TSOP to a 40-Pin DIP 7/97 (EXAMPLES) TSOP DEVICES: PIN CONFIGURATION: BASE 40-Pin DIP E28F002BC / BL / BV / BX E28F004BE / BL / BV / BX E28F008BE / BV (TE extended temp range) SOCKET: Yamaichi IC191-0402-002N PRICING: