TSMC EA Search Results

10190N

Abstract: tsmc Activation Energy
Contextual Info: Cypress Semiconductor Technology Qualification Report QTP# 99285 VERSION 1.3 July, 2000 L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor L28-TSMC Technology in TSMC-2A

XPC823ZT66B2T

Abstract: XPC823ZT81B2T XPC823 XPC823ZT75B2T motorola tsmc XPC823ZT66B2 KXPC823ZT81B2T MPC823 MOS11 xpc823zt66
Contextual Info: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for

XPC823ZT66B2T

Abstract: XPC823 XPC823ZT75B2T XPC823ZT81B2T KXPC823ZT81B2T MPC823 W90913 XPC823ZT
Contextual Info: M Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for

MIL-STD-883 Method 3015.7

Abstract: tsmc design rule L28-TSMC tsmc Activation Energy tsmc cmos tsmc Ea CY2037-2WAF CY2037AWAF CY5037
Contextual Info: Cypress Semiconductor Fab Transfer Qualification Report QTP# 001103 VERSION 2.0 July, 2000 CY2037A Wafer L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor

L28-TSMC

Abstract: tsmc cmos 7C80380A tsmc Activation Energy tsmc Ea tsmc design rule TSMC-2A
Contextual Info: Cypress Semiconductor Technology Qualification Report QTP# 000402VERSION 1.1 July, 2000 CY5037A Wafer L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7069 Cypress Semiconductor

3248L

Contextual Info: RELIABILITY REPORT DATE: 6/8/05 QUALITY ENG : PART NUMBER MICREL KS8001L/KSZ8001L KS8001LD/KSZ8001LD PROJECT # PACKAGE TYPE : ASSEMBLY LOC LOT # FAB LOC D/C # PROCESS KS8001S 48L SSOP OSE GD64047MEA TSMC 0437A 0.18 um KS8001LD 48L QFP ASE GD64047MEK TSMC 0503A

Contextual Info: QUALIFICATION REPORT Date: 11/4/13 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ9031XXXX Product Family PACKAGE TYPE : LOT # ASSEMBLY LOC FAB LOC PROCESS KSZ9031GQ 128L QFP Q2A38072 TICP TSMC 0.065 um KSZ9031RNX 48L QFN MLF GPKH888.00MEA TICP TSMC 0.065 um

XPC850SRZT50BT

Abstract: XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 MPC850 XPC850SRCZT50B
Contextual Info: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC850 XC Qualification in TSMC/WaferTech EFFECTIVE DATE: 30-SEPT-00 Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for

JESD22

Contextual Info: RELIABILITY REPORT Date: 7/27/11 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8842PMBL AM QUAL VEHICLES PACKAGE TYPE : ASSEMBLY FAB PROCESS KSZ8842PMBL AM 100 LFBGA OSE TSMC 0.15 um KSZ8842PMQL AM 128L PQFP ASE TSMC 0.15 um AEC Q100 GROUP A QUALIFICATION RESULTS:

130nm CMOS

Abstract: tsmc cmos model tsmc cmos silicon footprint ESD
Contextual Info: Data sheet IO ESD protection Low capacitive IO protection for TSMC 130nm CMOS technology Sofics has verified its TakeCharge ESD protection clamps on TSMC 130nm CMOS technology. The devices are product proven in several hundreds mass produced 130nm products. The cells provide competitive advantage

Contextual Info: RELIABILITY REPORT Date: 10/17/08 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8841/42 PMQL Qual vehicles KSZ8841/42PMQL PACKAGE TYPE : ASSEMBLY FAB LOC 128L QFP ASE/TICP TSMC ESD RATINGS FIT RATE ESD-HBM: +/- 1500V TSMC 0.15 um process: 6.6 FIT PROCESS 0.15 um

Contextual Info: RELIABILITY REPORT Date:7/24/08 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8893MQL/FQL Qual vehicles PACKAGE TYPE : ASSEMBLY 128L QFP OSE KSZ8893MQL FAB LOC PROCESS TSMC 0.15 um ESD RATINGS LATCH-UP RATING FIT +/- 1000V HBM I/O Trigger @ 200 mA TSMC 0.15 um : 6.6 FIT

Contextual Info: QUALIFICATION REPORT Date: 5/31/11 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ9021RL/GQ/GN/RN PACKAGE TYPE : LOT # ASSEMBLY LOC FAB LOC PROCESS KSZ9021RL 64L QFP GF63838.1 MEB TICP TSMC 0.15 um KSZ9021GQ 128L QFP GF63838.1 MEA TICP TSMC 0.15 um KSZ9021RN 48L MLF

Contextual Info: TSMC 0.25 micron Process OPERATING LIFE @ Tj = +130-150c at rated Voltage Q302-Q104 Family Device Lot. Pkg Qty Physical Tranciver KS8721B KS8721BL KS8721BL KS8721BL KS8721BL KS8721BL KS8721SL KS8721SL KS8721BT KS8Z8721SL KS8995 KS8995E KS8993/KS8081 D62873

tsmc design rule

Abstract: tsmc cmos tsmc Activation Energy tsmc L28-TSMC
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 001205 VERSION 1.2 July, 2000 Low Cost Three-PLL Clock Generator CY2081SC/CY2081SL TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7069 Cypress Semiconductor

tsmc cmos 0.13 um

Abstract: "embedded dram" tsmc
Contextual Info: SoC-RAMTM PL Memory Core 0.18µm 3Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank

16 bit Array multiplier code in VERILOG

Abstract: 8 bit Array multiplier code in VERILOG vhdl code for lvds driver i7 processor history verilog code for 128 bit AES encryption verilog code for aes encryption EP3CLS150 fpga based Numerically Controlled Oscillator freescale m9k E144 package
Contextual Info: 1. Cyclone III Device Family Overview July 2012 CIII51001-2.4 CIII51001-2.4 Cyclone III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company TSMC low-power (LP) process technology, silicon optimizations and software

Contextual Info: TSMC 0.18 micron Process OPERATING LIFE @ Tj = + 130-150c at rated Voltage Family Device Lot. Pkg Qty Act Hrs Rej Act Hrs Rej PHYs KS8001LD KS8001S KSZ8001S KSZ8001L GD64047MEL GD64047MEC GD64047MEQ GDP0833.02 QFP-48 SSOP-48 SSOP-48 QFP-48 116 116 77 77 168

i7 processor history

Abstract: cyclone III datasheet freescale m9k altera cyclone 3 8 bit Array multiplier code in VERILOG verilog code for 128 bit AES encryption Altera Cyclone III EP3CLS200 E144 EP3C120
Contextual Info: 1. Cyclone III Device Family Overview CIII51001-2.2 Cyclone III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company TSMC low-power (LP) process technology, silicon optimizations and software

PCN0304

Abstract: altera date code format TSMC 0.13um process specification altera Date Code Formats EP1S60 EP1C12
Contextual Info: Page 1 of 2 PROCESS CHANGE NOTIFICATION PCN0304 300 MM WAFER SCHEDULE Change Description Effective September 2003, Altera will begin manufacturing the Stratix and Cyclone™ product families on 300 mm wafers using 0.13µm process technology at TSMC. The

TSMC embedded Flash

Abstract: NT410 tsmc 0.18 flash TSMC Flash cmos tsmc 0.18 TSMC Flash memory 0.18 TSMC Flash IP tsmc cmos NT1208 NT1115
Contextual Info: Taiwan Semiconductor Manufacturing Company Ltd. January 27, 2000 Page 1 FOR IMMEDIATE RELEASE CONTACT IN TAIWAN CONTACT IN NEW YORK Derek Tien or Julie Chan Finance Division TSMC invest@tsmc.com.tw 886/3/567-2664 Mami Ogawa Thomson Financial Investor Relations

tsmc cmos 0.13 um

Abstract: "embedded dram" tsmc D1270 TSMC cmos 0.18um TSMC 0.18Um MOSAID Technologies
Contextual Info: SoC-RAMTM PL Memory Core 0.18µm 8Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank

JESD22-A114F

Abstract: JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: W-1002-01(R4) DATE: October 4, 2010 Affected Products: Refer to the attached list of products transferring from IDT Fab 4 to TSMC

TSMC 0.35Um

Contextual Info: RELIABILITY REPORT DATE: 11/16/11 QUALITY ENG : PRODUCT : Micrel Rel/QA MIC3003GFL QUAL VEHICLES PACKAGE TYPE : ASSEMBLY LOC. FAB LOC. PROCESS 24L FC-MLF 3mmx3mm UNISEM TSMC TMSC 0.35 um MIC3003GFL ESD RATINGS LATCH-UP RATING FIT +/- 3000V HBM (Human Body Model)