TRAYS 14 X 20 Search Results

12B-0608-F19

Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
Contextual Info: ‹ Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X

daewon

Abstract: 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11
Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FLA 069, VBG 080, FEE 088, TLE 088, TSA 088, VBG 088, VBL 088 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 14 PLACES SEE DETAIL "D" X Y (12 CENTER CELLS, 2 SIDE CELLS) 6.35 * 7.62 BUMPS 11 PLACES Z SEE DETAIL "E"

SMD BOOK

Abstract: smd 842 SMD Packages TQFP Package 44 lead 20B40 P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK
Contextual Info: Package Outlines Plastic Package, P-DIP-40 Plastic Dual In-Line Package 20B40 DIN 41870 T10 Plastic Package, P-LCC-28-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-44-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-68 (Plastic Leaded Chip Carrier) – SMD

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than

daewon

Abstract: VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA
Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ 044 3648 \ f28384b \ 8.1.7 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 6 Dec 2007 5-39 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ044

EIA and EIAJ standards 783

Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
Contextual Info: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to

Contextual Info: MXO45LV & MXO45HSLV HCMOS/TTL Clock Oscillator FEATURES • • • • • • • • • • Standard 14 Pin or 8 Pin DIP Packages HCMOS/TTL Compatible Output Fundamental and 3rd Overtone Crystal Designs Frequency Range 1 – 200 MHz Frequency Stability ±50 ppm Standard

KCD-QD01-BA

Abstract: KCD-QD01 cyberdisplay 320 kopin cyberdisplay kopin 320 320 display RS170 Module KLQS-007-A-B kopin amlcd
Contextual Info: CyberDisplayTM CyberDisplayTM 320 Monochrome Display Model 290 KCD-QD01-BA Specifications For Use With RS170 Module Kopin Corporation 695 Myles Standish Blvd., Taunton, MA 02780 T 508.824.6696, F 508.824.6958 2/22/2001 KLQS-007-A-B Table of Contents 1. ELECTRICAL SPECIFICATIONS . 1-3

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

PK-75462-001

Contextual Info: This document was generated on 01/14/2009 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0760440001 Active SFP+ Stacked Multi-Port Connectors Small Form-factor Pluggable Plus SFP+ Stacked 2-by-1 Multi-Port Connector with 4

MIL-I-8835A

Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Contextual Info: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

Common rail injector service manuals

Abstract: IPMB B2035 4511 bp Common rail injector Technical data INTEL 915 sdr GR-63-CORE M66EN PICMG 3.0 -48v GR-63-CORE Zone 4 test requirements
Contextual Info: Intel NetStructureTM ZT 5088 12U General Purpose Packet Switched Platform Technical Product Specification July 2003 Order Number: 273789-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

IC 50061

Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing

a1770

Abstract: EVD30 a3x2g7 E41871 B66298 corrugated B66298V1012T1 250 B 340 smd Transistor u cores Wound Toroids Coil
Contextual Info: Ferrites and accessories Packing Date: September 2006 Data Sheet  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited. Packing Packing Survey of packing modes

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

ITT Cannon DPD

Abstract: coaxial cable tzc 75005 st-212 coaxial cable ITT Cannon PVX st214 coaxial cable KPSE Assembly Instructions RG179B/U cgl itt cannon balun 75-ohm to 120-ohm RG58 CABLE 50 OHM
Contextual Info: 2001 1.0/2.3 RF Connector Series 2001 RF Coaxial Connectors Contents Description Page Introduction 3 1.0/2.3 50 Ohm Range 5 1.0/2.3 75 Ohm Plugs 7 Type 54 Range 8 1.0/2.3 75 Ohm Jacks 9 MID - Surface Mount Jacks 12 Baluns 16 U - Links 17 1.0/2.3 - 1.0/2.3 In - Series Adaptors

heat sensor with fan cooling ps3

Abstract: AD202 B2035 HF 4725 ZT7102 ZT 7102 ZT508512U lp9 pinout GR-63-CORE M66EN
Contextual Info: Intel NetStructureTM ZT 5085 12U Redundant Host Packet Switched Platform Technical Product Specification October 2004 Order Number: 273790-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

PC MOTHERBOARD SERVICE MANUAL

Abstract: adaptec 29160 Adaptec AHA 29160 SMART WORK DC-390U3W 53C875 2018E
Contextual Info: ARS-2018/2018E SCSI to SATA Mirror Smart User’s Manual Version: 1.0 Copyright 2006 ACARD Technology Corp. Release: April 2006 Copyright and Trademarks The information in this manual is subject to change without prior notice and does not represent a commitment on the part of the vendor, who assumes no liability or

oki qfp tray

Abstract: Ultrasonic humidifier circuit 750H OKI Year Work Week "the package information document consisting of 8 chapters in total" Oki Moisture Oki Moisture level
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE This document is Chapter 3 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE

p31b

Abstract: FUSE 451 P03cm TGS 813 TGS 823 P0080SAL P0080SBL P0080SAMCL P1200SDL p48a
Contextual Info: 9 Mechanical Data 9 Mechanical Data The following section describes the mechanical specifications of products in this Telecom Design Guide. Telecom Design Guide • 2006 Littelfuse, Inc. 9-1 www.littelfuse.com /GEJCPKECN &CVC Gas Plasma Arresters—Package Dimensions / Specifications . . . . . . . . . . . . . . . . . . . . . . . . 9-3

MIL-STD-81705

Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes

8502 400 494 811

Abstract: comcode D-181781 Lucent Technologies fiber lucent comcode b-oversheath lucent LXE 8544B 811 tube D-181683
Contextual Info: fiber.book : sec11.fm Page 12 Thursday, June 22, 2000 11:40 AM Associated Kits for the UCB Closure CSM Kit Central Strength member tie down kit for loose tube cables. Product Code Comcode CSM Kit 107 010 290 Product Code Comcode Racetrack Grommet 845 628 775