TRAY QFP 160 JEDEC Search Results

QFP JEDEC tray

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 160 pin QFP 24 x 24 Terminal Spacing Linear = 0.5 A B 81 80 120 121 detail of lead end C D S Q 41 40 160 1 F G H I M J P K N NOTE S160GM-50-8ED-2 EIAJ CODE Weight (Reference Value)

Contextual Info: Mounting Pad Packing NEC Tray Name LA-3508A-1 JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A B 120 121 81 80 detail of lead end C S D R Q 41 40 160 1 F G P H I M J K M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of

LA-0518A-1

Abstract: S160GM-50-JMD
Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 detail of lead end C D S Q 160 1 F G R 41 40 H I M J K P M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

transistor NEC D 587

Abstract: NEC D 587 LA-3525A-1 LA-0525A-1
Contextual Info: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A B 81 80 120 121 detail of lead end C D S Q 160 1 R 41 40 F G H I J M P K M N L NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of

P160GD-65-LBD

Contextual Info: Packing NEC Tray Name LA-3508A-1 Mounting Pad JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A 81 80 160 1 41 40 F C 120 121 D B G H I M detail of lead end J N 5°±5° M Q P S K L P160GD-65-LBD, MBD NOTE Each lead centerline is located within 0.13 mm

nec 2701

Abstract: JEDEC tray dimension 2701 NEC LA-0518A-1 QFP JEDEC tray
Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 S C D R Q 41 40 160 1 F G H I J M P K S N S L NOTE ITEM 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.10 mm (0.004 inch) of

QFP28

Abstract: 7404 QFP JEDEC tray JEDEC TRAY QFP
Contextual Info: TRAY CONTAINER UNIT : mm 3 x 8=24 NEC 135° C MAX. A' 34.20 37.02 27.93 34.20 74.04 30.93 37.02 QFP28×28×3.2A 135.9 PPE A 259.14 315.0 322.6 SECTION A-A' 34.20 (3.77) (6.35) 7.62 27.35 Applied Package Quantity (pcs) 120-pin Plastic QFP (3.2mm thick) 160-pin Plastic QFP (3.2mm thick)

QFP JEDEC tray

Abstract: nec 44 pin LQFP LQFP Package tray NEC lqfp 52 JEDEC TRAY QFP JEDEC tray standard qfp tray standard nec 44pin QFp Package tray tray qfp 160 jedec
Contextual Info: TRAY CONTAINER HEAT PROOF 7 A' 15.20 13.10 12.5 PPE 135°C MAX NEC 15.70 A 8x20 = 160 13.00 109.9 LQFP 10×10×1.4 12.5 288.8 315.0 322.6 SECTION A-A' 12.50 Applied Package 6.12 (6.35) 9.90 7.62 135.9 UNIT : mm Quantity (pcs) 64-pin Plastic QFP (1.4mm thick)

ND-1420-2

Abstract: QFP JEDEC tray 304-Pin 304 QFP
Contextual Info: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

QFP Shipping Trays

Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
Contextual Info: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

QFP JEDEC tray

Contextual Info: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

TO-220 JEDEC

Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
Contextual Info: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

QFP JEDEC tray

Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
Contextual Info: QFP Carrier & Development Socket January 1998, ver. 12 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

ASE QFP

Contextual Info: QFP Carrier & Development Socket Features • ■ ■ ■ ■ General Description Q u ad flat pack QFP carriers protect fragile leads on QFP devices d u rin g shipping and device handling. QFP developm ent sockets allow on-board electrical and m echanical

removal tool from EPLD socket

Contextual Info: QFP Carrier & Development Socket M a rc h 1995, ver. 7 Features D ata S h ee t • ■ ■ ■ General Description Q uad flat pack QFP carriers protect fragile leads on Altera QFP devices during shipping and device handling. Development sockets allow on-board electrical and mechanical

MIL-I-8835A

Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Contextual Info: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

Contextual Info: QFP Carrier & Development Socket Ju n e 1996, ver. 10 Features D ata S h e e t • ■ ■ ■ ■ General Description Q u a d flat p ac k Q FP c a rrie rs p ro te c t frag ile le a d s o n Q F P d ev ice s d u rin g sh ip p in g a n d d ev ic e h a n d lin g .

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

116-Pin

Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Contextual Info: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size