TRAY DESIGN Search Results

DAEWON tray drawing

Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Contextual Info: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect

Contextual Info: SIM card connector with tray Product name： ： Connector FMS006-3710-0 Tray FMA006-3700-0 RoHS Feature tray operation type Top mount type Enabling the height: 1.75mm MAX. mounting on PCB Card miss Insertion prevention design Static discontinuity prevention

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

lccf cable tray conduit clamps

Abstract: LCCF010 tray design LCC010 EMT CONDUIT EMT CONDUIT 3
Contextual Info: 106-107.qxp 8/11/2010 10:48 AM Page 107 4F LCC Series Cable Tray Conduit Clamps LCC 4F Applications: LCCF LCC cable tray conduit clamps are used for installation on cable tray side rails with inside flanges requiring inside tray mounting and outside flanges; LCCF clamps are for use exclusively on inside

FMA006-3800-0

Abstract: simcard connector
Contextual Info: SIM Card Connector with Tray RoHS Product name： ： Connector FMS006-3810-0 Tray FMA006-3800-0 Feature Tray operation type Reverse mount bottom mount Enabling the height: 1.75mm MAX. mounting on PCB Card miss Insertion prevention design

FT300SP30-01

Abstract: tray speed control temperature dc fan
Contextual Info: Fan tray Free air capacity Free air capacity Power consumption Tray acoustic performance Lead IEC Plug Switch m 3/h m 3/h l/s W dB A FT300XL30-01 480 395 110 59 54.3 X - - 230V 50Hz 3-fan tray FT300SL30-01 480 395 110 59 54.3 X - X 230V 50Hz 3-fan tray FT300SP30-01

Contextual Info: Verpackt in Tray fnQ ^ ±0 3 Verpackungseinheit 16 St. tray packaging < - ► A - joo II OD JTJTJTJTJTJTJ5JTJTJTJ ' 63,5 ^ PO — -

Contextual Info: OFF-BOARD PROGRAMMING/MEDIA SERVICES US Dist. WYLE ELECTRONICS Wyle Electronics • ■ ■ ■ ■ ■ ■ Programming capabilities Tube-to-tube Tube-to-tray Tray-to-tray Laser mark Co-planarity check Tape and reel Outsourcing volume programming can increase productivity and reduce capital

Contextual Info: COMPONENTS PRODUCT INFORMATION NEW CONNECTOR microSIM Card Connector MB-0271-1 April 2014 SF58 Series RoHS Compliant <Drawing when a tray is inserted> Note: Tray is not included. Tray is to be prepared by customers. <<Outline>> Smartphones and tablet PC equipping microSIM Mini UICC Cards are increasing.

v-tek

Contextual Info: TAPE AND REEL EQUIPMENT V-TEK M.A.C.H. Modular Automatic Component Handler • ■ ■ ■ ■ ■ Handles tray inputs Bowl feeders and tube feeders optional Outputs to tape or back into tray 32-bit Windows* operating system for easy operation Basic system can be used for tray to

Contextual Info: COMPONENTS PRODUCT INFORMATION NEW CONNECTOR nanoSIM Card Connector MB-0275-1 January 2014 SF70 Series RoHS Compliant <Drawing when a tray is inserted> Note: Tray is not included. Tray is to be prepared by customers. <<Outline>> Recently, smartphones and tablet PC have been equipped with nanoSIM cards.

pd0008

Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
Contextual Info: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all

Contextual Info: 8 7 6 5 4 3 2 D 1 REVISIONS AMPHENOL PART NUMBER CONFIGURATION U90 - C 1 X 1 - 1 X 0 X PACKAGING HEAT SINK OPTION 1 = TRAY PACKAGING, HEAT SINK IN SEPARATE TRAY IF ORDERED 0 = NO HEAT SINK OPENING A = TRAY PACKAGING W/ HEAT SINK ASSEMBLED 1 = NO HEAT SINK OR CLIP SHIPPED

MOLEX mxj 5

Abstract: SD Card Package tray 709 P mxj 13 MOLEX
Contextual Info: CIRCUIT No. 2 M > — 2.95 CIRCUIT No. - /3XCL05MAXO, „0.IMAX. A - A ÏCALEs 5- □ REAR-NAIL CIRCUIT NOo SEMI-HARD TRAY PACKAGE SORT TRAY RACKAGR PACKING TRAY FORM q;- FINISH f t ± \1 _ i LU u or x n WIRE RANGE a s m 15 E INS. RANGE ÎS S ^S SEE NC DIMENSIONS:

DC 0509

Abstract: FMS006-3900-0 FMA006-3900-0
Contextual Info: SIM Card Tray connector, Top mount Super low profile H=1.42mm P/N：Connector FMS006-3900-0 Tray FMA006-3900-0 Feature ・Tray type ・Top mount type ・Super low profile design H=1.42mm max. ・Card mis-insertion prevention design ・Static discontinuity prevention design

AX103912

Contextual Info: Detailed Specifications & Technical Data ENGLISH MEASUREMENT VERSION AX103912 Faceplates and Panels - FiberExpress Ultra Splice Tray 8 inches For more Information please call 1-800-Belden1 Description: FiberExpress Ultra 8 inches Splice Tray Usage Overall

Contextual Info: Detailed Specifications & Technical Data ENGLISH MEASUREMENT VERSION AX103914 Faceplates and Panels - FiberExpress Ultra Splice Tray 12 inches For more Information please call 1-800-Belden1 Description: FiberExpress Ultra 12 inches Splice Tray Usage Overall

AM29

Abstract: 29f800bb AMD xp
Contextual Info: u Chapter 11 Die and Wafer Shipments CHAPTER 11 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Carrier Designs for Singulated Die Waffle Pack Surftape and Reel GEL-PAK Die Tray Carrier Designs for Wafers Wafer Jar GEL-PAK Wafer Tray

Panduit GS2B

Abstract: CPP24WBL CMR19X84 cable tray specification Panduit splice tray fiber patch panels MPP24WBL ABM2SA FMT48 gs2b
Contextual Info: FOR USE WITH PANDUIT PAN-NET NETWORK CABLING SYSTEM Fiber Optic/Multimedia Interconnect Tray Part Number: FMT48SP INSTALLATION INSTRUCTIONS Panduit Corp. 1999 PAGE 1 OF 4 Printed in U.S.A. The FMT48SP Fiber Optic / Multimedia Interconnect Tray is designed to provide a fiber cable management solution

system cable tray

Abstract: TGC40 cable tray
Contextual Info: 108-109.qxp 8/11/2010 4F 4F 10:49 AM Page 108 TGC Cable Tray Ground Conductor Clamp Applications: Ordering Information Cable tray grounding conductor clamps are designed for use in heavy industrial applications: • To provide a means for securely attaching a grounding conductor to

DIN 41652

Contextual Info: Verpackt in Tray Verpackungseinheit 24 St. tray packaging packaging unit 24 pcs 1 Sonstige Angaben siehe 204630 /Additional indications please see 204630 Verpackt in Gurt Verpackungseinheit 125 St. tape & reel packaging packaging unit 125 pcs Abspulrichtung

DIN 41652

Abstract: 214642
Contextual Info: Verpackt in Tray Verpackungseinheit 16 St. tray packaging packaging unit 16 pcs 1 Sonstige Angaben siehe 204630/Additional indications please see 204630 Verpackt in Gurt Verpackungseinheit 125 St. tape & reel packaging packaging unit 125 pcs Abspulrichtung

DIN 41652

Abstract: DIN ISO 2768-M DIN ISO 2768-M tape din iso 2768 M
Contextual Info: Verpackt in Tray Verpackungseinheit 20 St. tray packaging packaging unit 20 pcs 1 Sonstige Angaben siehe 204630/Additional indications please see 204630 1 Verpackt in Gurt Verpackungseinheit 125 St. tape & reel packaging packaging unit 125 pcs Abspulrichtung

Contextual Info: Mining and Petrochemical Tray-Rated, Loose Tube, Gel-Free Cable 192 F, 50 µm multimode OM4 Corning dielectric, low-temperature, tray-rated, mining and petrochemical fiber optic cables are designed for indoor and outdoor use in mining and petrochemical backbones (aerial and duct) and horizontal intrabuilding and