TRAY BGA 8 X 8 Search Results

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

KGA0E000BA

Abstract: kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC
Contextual Info: Mobile SoC Code Information • Microcontroller • MSP • MOS August 2009 -1- Part Number Decoder Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte

LPCC-8

Abstract: DRAM BGA TRAY qfn 6 x 6 TRAY
Contextual Info: Digital Media Code Information • MOS • Linear-IC • SIP August 2009 -1- Part Number Decoder MOS Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1. System LSI (S) 9~10. Mask Option 2. Large Classification : MOS (5)

Mos MARKING CODE

Abstract: clcc tray transistor WLM package marking WF 5 CCD MARKING
Contextual Info: Imaging Solutions Code Information • MOS • CIS • CCD August 2009 -1- Part Number Decoder MOS Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1. System LSI (S) 9~10. Mask Option 2. Large Classification : MOS (5)

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

fBGA package tray 12 x 19

Abstract: FCCSP HT80C51 a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD
Contextual Info: Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)

Contextual Info: MR2A08A 512K x 8 MRAM Memory FEATURES • Fast 35ns Read/Write Cycle • SRAM Compatible Timing, Uses Existing SRAM Controllers Without Redesign • Unlimited Read & Write Endurance • Data Always Non-volatile for >20 years at Temperature • One Memory Replaces Flash, SRAM, EEPROM and BBSRAM in

AEC-Q100

Abstract: MR2A08A MR2A08AYS35
Contextual Info: MR2A08A FEATURES 512K x 8 MRAM Memory • Fast 35ns Read/Write Cycle • SRAM Compatible Timing, Uses Existing SRAM Controllers Without Redesign • Unlimited Read & Write Endurance • Data Always Non-volatile for >20 years at Temperature • One Memory Replaces Flash, SRAM, EEPROM and BBSRAM in

secucalm

Abstract: HT80C51 ARM10 H285 I18N SecuCalm16
Contextual Info: Smart Card Controller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)

JEP95

Abstract: tray datasheet bga BGA-32
Contextual Info: BGA Package 32-Lead 15mm x 11.25mm × 4.98mm (Reference LTC DWG # 05-08-1860 Rev A) A DETAIL A Z 8 A2 aaa Z 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.33 – 0.43 // bbb Z 3.95 – 4.05 H DETAIL B J K

tray datasheet bga

Abstract: JEP95
Contextual Info: BGA Package 32-Lead 15mm x 11.25mm × 3.42mm (Reference LTC DWG # 05-08-1851 Rev B) A DETAIL A Z 8 A2 aaa Z 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.27 – 0.37 // bbb Z 2.45 – 2.55 H DETAIL B J K

JEP95

Abstract: BGA144 tray datasheet bga JEP95 MS-028 bga tray
Contextual Info: BGA Package 144-Lead 15mm x 15mm × 4.92mm (Reference LTC DWG # 05-08-1880 Rev Ø) DETAIL A Z A M A2 aaa Z L K J H G F E D C B PIN 1 A 1 PIN “A1” CORNER 2 b A1 4 ccc Z 3 4 5 b1 MOLD CAP 6 F D SUBSTRATE 7 0.27 – 0.37 8 // bbb Z 3.95 – 4.05 9 DETAIL B

JEP95

Contextual Info: BGA Package 133-Lead 15mm x 15mm × 3.42mm (Reference LTC DWG # 05-08-1877 Rev Ø) DETAIL A Z A 12 A2 aaa Z 11 10 9 8 7 6 5 4 3 2 PIN 1 1 A PIN “A1” CORNER B b A1 4 ccc Z C D E b1 MOLD CAP F F D SUBSTRATE G 0.27 – 0.37 H // bbb Z 2.45 – 2.55 J DETAIL B

JEP95

Abstract: MS-028
Contextual Info: BGA Package 44-Lead 15mm x 15mm × 5.02mm (Reference LTC DWG # 05-08-1881 Rev Ø) A DETAIL A Z 11 A2 aaa Z 10 9 8 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.37 – 0.47 // bbb Z 3.95 – 4.05 H DETAIL B

LPCC

Abstract: marking code G qfn 12 qfn 3 x 3 TRAY Bonding
Contextual Info: Networks Code Information 1/2 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1. System LSI (S) 9~10. Mask Option 2. Large Classification : MOS (5) 11. " - " 3. Small Classification A : Audio B : Analog Core C : Camera D : Display F : CCD G : General

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

0.18-um

Contextual Info: Serial LINK Code Information 1/2 S5SXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 9 10 11 12 13 14 15 9. Interface (Serial / Parallel) 4 : 4 bit interface 5 : 5 bit interface 8 : 8 bit interface 1 : 10 bit interface 6 : 16 bit interface 2 : 20 bit interface

TRAY 15X15

Abstract: bga Shipping Trays tray jedec BGA ad456 176TQFP Package tray 15X15 MPSU 140 tray bga 23 AD4567 BGA-1515
Contextual Info: I AMSUN ELECTRONICS KS8664B_ CDMA/AMPS Dual Mode Modem Processor DATA SHEET Ordering July, Information Dev ice Package KS8664B 196PBGA KS8664BQ 176TQFP 1999 CDMA Team System LSI/Semiconductor SAMSUNG Electronics Co., LTD. [\D r\D ^ Uí KÍ I— o

marking code G qfn 12

Abstract: uLGA MARKING CODE analog marking code 14 Analog Marking Information 3 mobile Camera Module package marking WF 5 marking 5 qfn marking z linear marking code
Contextual Info: Telephone Code Information • MOS • Linear-IC -1- Part Number Decoder MOS Code Information 1/2 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1. System LSI (S) 9~10. Mask Option 2. Large Classification : MOS (5) 11. " - " 3. Small Classification

Marking Code 2K

Contextual Info: EEPROM & Memory Card Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 12. Package Type 1 : TEBGA A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA 2. Large Classfication : MOS (5)

IC 50061

Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing

Contextual Info: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 packages

MR4A08BMYS35

Contextual Info: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 packages